• Interaction and multiscale mechanics
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• v.6 no.3
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• pp.301-316
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• 2013

The influence of indenter geometry on nanoindentation was studied using a static molecular dynamics simulation. Dislocation nucleation, dislocation locks, and dislocation movements during nanoindentation into Al (001) were studied. Spherical, rectangular, and Berkovich indenters were modeled to study the material behaviors and dislocation activities induced by their different shapes. We found that the elastic responses for the three cases agreed well with those predicted from elastic contact theory. Complicated stress fields were generated by the rectangular and Berkovich indenters, leading to a few uncommon nucleation and dislocation processes. The calculated mean critical resolved shear stresses for the Berkovich and rectangular indenters were lower than the theoretical strength. In the Berkovich indenter case, an amorphous region was observed directly below the indenter tip. In the rectangular indenter case, we observed that some dislocation loops nucleated on the plane. Furthermore, a prismatic loop originating from inside the material glided upward to create a mesa on the indenting surface. We observed an unusual softening phenomenon in the rectangular indenter case and proposed that heterogeneously nucleating dislocations are responsible for this.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.12
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• pp.1453-1463
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• 2013

In this study, we investigated the effect of the indenter geometry on the crack characteristics by indentation cracking test and FEA. We conducted various cohesive finite element simulations based on the findings of Lee et al. (2012), who examined the effect of cohesive model parameters on crack size and formulated conditions for crack initiation and propagation. First, we verified the FE model through comparisons with experimental results that were obtained from Berkovich and Vickers indentations. We observed whether nonsymmetrical cracks formed beneath the surface during Berkovich indentation via FEA. Finally, we examined the relation between the crack size and the number of cracks. Based on this relation and the effect of the indenter angle on the crack size, we can predict from the crack size obtained with an indenter of one shape (such as Berkovich or Vickers) the crack size for an indenter of different shape.

• Korean Journal of Materials Research
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• v.9 no.4
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• pp.434-438
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• 1999

Vickers microhardness for polished Cu specimen has been measured by conventional and new methods. The conventional microhardness was measured by observing the diagonal of indentation after the load was removed. Whereas, the new method for microhardness was obtained by measuring the penetration depth of indenter into the specimen under the load. As the applied load was increased, the microhardness obtained by new method was increased. When the applied load was in the range of 5mN to 80mN, the rate of elastic to total depth of indenter was about 6% and the calculated depth of rounded indenter was 0.07$\mu\textrm{m}$. The difference in microhardness measured by two different methods such as conventional and new methods can be explained in terms of the elastic deformation of specimen, the shape of practical indenter and pile up of material.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.389-395
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• 2001

To restrain contact failure, present study investigates the influence of edge machining of an indenter (punch). As for the edge machining, rounding, chamfering, and chamfering and rounding are considered. Contact mechanics is consulted to examine the traction profile and the size of the contact region which are directly influenced by the end profile of the indenter. The effect of rounding size (i.e., radius) in the case of the chamfering and rounding edge-indenter is studied. Shear traction is also evaluated within the regime of partial slip. Size of slip region and its expansion rate due to the increase of shear force are considered to investigate the shape effect of the indenter on contact failure.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.9
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• pp.943-951
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• 2014

The tip geometries of the pyramidal and conical indenters used for micro/nano-indentation tests are not sharp. They are inevitably rounded because of their manufacturability and wear. In many indentation studies, the tip geometries of the pyramidal indenters are simply assumed to be spherical, and the theoretical solution for spherical indentation is simply applied to the geometry at a shallow indentation depth. This assumption, however, has two problems. First, the accuracy of the theoretical solution depends on the material properties and indenter shape. Second, the actual shapes of pyramidal indenter tips are not perfectly spherical. Hence, we consider the effects of these two problems on indentation tests via finite element analysis. We first show the relationship between the Poisson's ratio and load-displacement curve for spherical indentation, and suggest improved solutions. Then, using a possible geometry for a Berkovich indenter tip, we analyze the characteristics of the load-displacement curve with respect to the indentation depth.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.708-713
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• 2012

The indented geometry for rockwell hardness indenter has been configured by using Confocal Laser Scanning Microscopy (CLSM). For this purpose, the CLSM can be well suited to construct the three-dimensional indented volume from the indented surface by rockwell hardness tester. Furthermore, the height data of HEI(height encoded image) by CLSM must be acquired at first and converted to indented surface later. And the indented surface patterns enable us to predict the indenter shape and volume. This volume can be used to study the rockwell hardness model as a volume parameter. As a result, the technique performed in this study by combining the CLSM with compensation technique is an excellent one to obtain the geometries of indented surfaces over a wide range of surface resolution in a micro scale. And it can be used for micro volume calculation.

• Journal of the Korean Society for Nondestructive Testing
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• v.33 no.2
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• pp.129-137
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• 2013

A force calibration of a nanoindenter and a 3D morphology observation of indenters were carried out in this study. A microbalance calibrated with standard weights was used for measuring the loads generated by a nanoindenter. The indentation load could be calibrated from the ratio of measured and generated loads and the first contact load also could be detected from the microbalance data. By analyzing atomic force microscopy images of two indenters, curvature radii of apexes were determined by $19.71{\pm}3.03$ and $1043.94{\pm}50.91$ nm, respectively, for the nearly new indenter A and the severly worn indenter B. Corresponding bluntness depths were estimated by 1.22 and 64.56 nm for the both indenters by overlapping their profiles on the perfect pyramidal shape. In addition, nanoindentation curves obtained from a fused silica reference material with the both indenters showed a depth difference corresponding to the bluntness depth difference along the indentation depth axis. By shifting amounts of the bluntness depths along the horizontal axis, whole nanoindentation curves overlapped on themselves and resulted in nanohardness values consistent within 1.11 % without considering the complex indenter area function of each indenter.

• Journal of the Korean Vacuum Society
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• v.18 no.2
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• pp.97-101
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• 2009

In the modem semiconductor industry, the progress that consumes the most capital and labor is cleansing process. Cleansing process is to remove impurities that can affect the operation of the device and deteriorate its function. Especially, Photoresist (PR) progress that etches the device always requires cleansing at the end of the progress. Also, HDI-PR (High-Dose Ion-implanted Photoresist) created from PR progress is difficult to remove. Thus, in modem IC cleansing, many steps of cleansing are used, including dry and wet cleansing. In this paper, we suggested to combine existing dry-cleansing and wet-cleansing, each represented by plasma cleansing and stripper solution, as Plasma Liquid-Vapor Activation (PLVA). This PLVA method enhances the effect of existing cleansing solution, and decreases the amount of solution and time required to strip. We stripped HDI-PR by activated solution and measured surface hardness and Young's modulus by Nano-indenter. Nano-indenter is the equipment that determines the hardness and the modulus of elasticity by indenting nano-sized tip with specific shape into the surface and measuring weight and z-axis displacement. We measured the change of surface hardness and Young's modulus before and after the cleansing. As a result, we found out that the surface hardness of the sample sharply decreased after the cleansing by plasma-activated PR stripper solution. It can be considered that if physical surface-cleansing process is inserted after this, more effective elimination of HDI-PR is possible.

• Journal of Powder Materials
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• v.5 no.1
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• pp.22-27
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• 1998

The effect of the $\alpha$/$\beta$ phase fraction on the mechanical properties in silicon nitrides was investigated in part 1. In part II, we describe the role of microstructure on the mechanical properties and contact damage of silicon nitrides with coarse/equiaxed and coarse/elongated microstructures. Grain sizes and shapes were controlled by starting powder. Hertzian indentation using spherical indenter was also used to investigate contact damage behavior. Cone cracks from the spherical indentation were suppressed when the silicon nitride contains coarse and elongated grains. Coarse and elongated grains played an important role of cone crack suppression. The size of quasi-plastic zone does not depend on grain size or shape but depends on the fraction of $\alpha$/$\beta$ phase. A quasi-plastic zone was consisting of microcracks by shear stress during indentation.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.246-251
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• 2004

Nano-indentation is used for measuring mechanical properties of thin films such as elastic modulus and hardness. For ductile materials, pile-up around the indenter causes the calculation of inaccurate projected contact area. This phenomenon was found by measurement of indentation shape using an atomic force microscope. In present study finite element analysis of nano-indentation was performed to compensate the effects of pile-up on the contact area. The result of finite element analysis was compared with that of nano-indentation for a ductile material. The analysis has demonstrated that the true contact area is greater than that calculated by nano-indentation. It is verified that the consideration of the effects of pile-up in nanoindentation for ductile materials using the finite element method is reasonable.