• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2009년도 제40회 하계학술대회
• /
• pp.1256_1257
• /
• 2009

We have grown, for the first time to our knowledge, N-doped ZnO thin films on sapphire substrate by employing novel dielectric barrier discharge in pulsed laser deposition (DBD-PLD). DBD guarantees an effective way for massive in-situ generation of N-plasma under the conventional PLD process condition. Low-temperature photoluminescence spectra of the N-doped ZnO film provided near band-edge emission after thermal annealing process. The emission peak was resolved by Gaussian fitting to find a dominant acceptor-bound exciton peak ($A^0X$) that indicates the successful p-type doping of ZnO with N.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 2009년도 Korea Superconductivity Society Meeting 2009
• /
• pp.54-54
• /
• 2009

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 2008년도 High Temperature Superconductivity Vol.XVIII
• /
• pp.66-66
• /
• 2008

• 한국진공학회지
• /
• 제2권1호
• /
• pp.99-108
• /
• 1993

저압화학증착법에 의해 제조된 hemispheircal 및 rugged Si 박막들은 64 Mbit DRAM 이상의 캐패시터에 사용하기 위해 개발되었다. 이 공정을 사용하므로써 종래에 사용되던 Si 전극의 평평한 표면이 hemispherical 혹은 rugged 박막 형태의 표면으로 변한다. 위와 같은 박막은 비정질 Si 표면에서 핵생성되며 Si 원자 확산에 의해 결정립들이 결정체로 성장한다. 화학증착의 변수, 열처리 및 in-situ doping process들은 hemispherical 및 rugged Si 박막의 미세구조에 영향을 준다. 동일 두께에서는 고온에서 이루어질 때 혹은 동일 온도일 경우에는 얇은 박막층일 때에 하부전극의 표면들이 rugged poly Si 형상을 나타내며 이렇게 됨으로써 유효면적은 2.1배로 증가한다. 이와 같은 캐패시터 유효면적 증가는 대체로 높은 신뢰성을 갖는 두꺼운 절연막을 사용하면서 stack 캐패시터 구조의 높이를 감소시킬 수 있다. 따라서 이러한 제조기술은 차세대 캐패시터에 적용될 수 있다.

• 센서학회지
• /
• 제5권2호
• /
• pp.61-67
• /
• 1996

RTCVD (rapid thermal chemical vapor deposition) 법으로 $SiH_{4}$ / $GeH_{4}$ / $H_{2}$ 혼합가스를 사용하여 $Si_{1-x}Ge_{x}$ 구조의 이종접합 에피막을 성장한 후, 성장에 사용된 원료가스의 혼합비에 대한 Ge 조성비 변화와 성장계면 특성 그리고 격자 부정합에 의한 에피막의 결함에 대하여 조사하였다. $650^{\circ}C$의 비교적 낮은 온도에서 $Si_{1-x}Ge_{x}$ /Si 이종접합 에피막을 약 $400\;{\AA}$ 두께로 성장하였을 때 격자부정합에 의한 결함은 관찰되지 않았으며, 공정조건에 따른 Ge 조성비 변화는 $SiH_4$ / $GeH_{4}$의 유량비에 따라 선형적인 특성을 나타내었다. 200 ppm $B_{2}H_{6}$ 가스를 사용한 in-situ 불순물 첨가 공정에서는 $Si_{1-x}Ge_{x}$ / Si 구조의 불순물 농도분포 변화가 접합계면에서 수 백${\AA}$ / decade 로 조절될 수 있었으며, Ge 조성비 변화도 동등한 수준의 계면특성을 나타내었다.

• Progress in Superconductivity
• /
• 제9권1호
• /
• pp.68-73
• /
• 2007

We fabricated the in-situ $MgB_2$ wires using the powder-in-tube method and investigated the effects of sintering temperature and SiC contents on the microstructure and superconducting properties. Pure $MgB_2$ wires and 5, 10, 20 wt.% SiC doped $MgB_2$ wires were sintered at $600-1000^{\circ}C$ for 30 minutes in Ar atmosphere. We found that $MgB_2$ phase was mostly formed at the sintering temperature of $700^{\circ}C$ and above, and the critical temperature ($T_c$) increased with increasing sintering temperature. For the $MgB_2$ sintered at $850^{\circ}C$, the highest critical current density ($J_c$) was obtained to be $3.7{\times}10^5\;A/cm^2$ at 5 K and 1.6 T by a magnetic properties measurement system (MPMS). The addition of SiC to the $MgB_2$ wires changed microstructure and critical properties. SEM observation showed that the $MgB_2$ core had considerable micro-cracks in undoped wire and the density of micro-cracks decreased with increasing SiC contents. The critical temperature decreased as the SiC contents increased, on the other hand, the critical current density of SiC doped $MgB_2$ wires in high magnetic field was enhanced compared to that of undoped $MgB_2$ wires.

• 한국결정성장학회:학술대회논문집
• /
• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
• /
• pp.422-448
• /
• 1996

Low-temperature epitaxial growth of Si and SiGe layers of Si is one of the important processes for the fabrication of the high-speed Si-based heterostructure devices such as heterojunction bipolar transistors. Low-temperature growth ensures the abrupt compositional and doping concentration profiles for future novel devices. Especially in SiGe epitaxy, low-temperature growth is a prerequisite for two-dimensional growth mode for the growth of thin, uniform layers. UHV-ECRCVD is a new growth technique for Si and SiGe epilayers and it is possible to grow epilayers at even lower temperatures than conventional CVD's. SiH and GeH and dopant gases are dissociated by an ECR plasma in an ultrahigh vacuum growth chamber. In situ hydrogen plasma cleaning of the Si native oxide before the epitaxial growth is successfully developed in UHV-ECRCVD. Structural quality of the epilayers are examined by reflection high energy electron diffraction, transmission electron microscopy, Nomarski microscope and atomic force microscope. Device-quality Si and SiGe epilayers are successfully grown at temperatures lower than 600℃ after proper optimization of process parameters such as temperature, total pressure, partial pressures of input gases, plasma power, and substrate dc bias. Dopant incorporation and activation for B in Si and SiGe are studied by secondary ion mass spectrometry and spreading resistance profilometry. Silicon p-n homojunction diodes are fabricated from in situ doped Si layers. I-V characteristics of the diodes shows that the ideality factor is 1.2, implying that the low-temperature silicon epilayers grown by UHV-ECRCVD is truly of device-quality.

• 한국초전도ㆍ저온공학회논문지
• /
• 제16권3호
• /
• pp.4-6
• /
• 2014

Among Fe-based superconductors, potassium doped $BaFe_2As_2$ is favorable for applications because of its relatively high transition temperature and low anisotropy. To study the superconducting properties and the applicable aspects, high quality thin films of potassium doped $BaFe_2As_2$ should be fabricate. However, the high volatility of potassium makes it difficult to fabricate thin films of this compound. In this paper, we discuss the details of the experimental conditions used to fabricate $Ba_{1-x}K_xFe_2As_2$ films by ex situ PLD method. In the first set of samples, barium ratio in the target was controlled to make films with various potassium doping rate. However, in the second set of samples, the amount of potassium was controlled to find out optimal conditions for making high quality $Ba_{1-x}K_xFe_2As_2$ films.

• Transactions on Electrical and Electronic Materials
• /
• 제12권5호
• /
• pp.200-203
• /
• 2011

In this research, nitrogen (N)-doped zinc oxide (ZnO) thin films have been grown on a sapphire substrate by dielectric barrier discharge (DBD) in pulsed laser deposition (PLD). DBD has been used as an effective way for massive in-situ generation of N-plasma under conventional PLD process conditions. Low-temperature photoluminescence spectra of N-doped ZnO thin films provided near-band-edge emission after a thermal annealing process. The emission peak was resolved by Gaussian fitting and showed a dominant acceptor-bound excitation peak ($A^{\circ}X$) that indicated acceptor doping of ZnO with N. The acceptor binding energy of the N acceptor was estimated to be approximately 145 MeV based on the results of temperature-dependent photoluminescence (PL) measurements.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제3권2호
• /
• pp.96-101
• /
• 2003

Direct evidence on the incorporation of high concentration of oxygen into undoped AlGaN layers for the AlGaN/GaN heterostuctures is provided by scanning photoemission microscopy using synchrotron radiation. In-situ annealing at $1000^{\circ}C$ resulted in a significant increase in the oxygen concentration at the AlGaN surface due to the predominant formation of Al-O bonds. The oxygen incorporation into the AlGaN layers resulting from the high reactivity of Al to oxygen can enhance the tunneling-assisted transport of electrons at the metal/AlGaN interface, leading to the reduction of the Schottky barrier height and the increase of the sheet carrier concentration near the AlGaN/GaN interface.