• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.6
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• pp.929-935
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• 1986

In this paper, we describe the physical modelling and numerical aspects of a program called PRECISE(Program for Efficient Calculation of Impurity Profile in Semiconductor by Elimination) which calcualtes a two-dimensional impurity profile in silicon due to diffusion and ion implantation steps. The PRECISE enables rapid prediction of the two-dimensional impurity profile near the mask edge-or the bird's beak during the local oxidation process. This has been developed by modifying the existing one-dimentional simulator, DIFSIM(DIFfusion SIMulator to include models for arsenic diffusion and emitter dip effect which were found out to agree fairly well with the xperimental data.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.4
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• pp.58-64
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• 1984

A simple model for the impurity profile in an ion-implanted channel layer of an enhancement type IGFET is assumed and a simple expression for the threshold voltage derived by using the assumed impurity profile is analyzed in detail. Also, this simple model is applied to simulating the substrate bias dependence of its threshold voltage. Excellent agreement is obtained between theory and experiment on n-channel devices. The error range of threshold voltage between gaussian-profile and box-profile is calculated in this paper and a new method of calculating the depth of ion-implanted Baler D is also introduced.

• Journal of the Korean Institute of Telematics and Electronics
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• v.22 no.4
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• pp.51-58
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• 1985

A simple model for the impurity profile in an ion-implanted channel layer of an enhance-ment type IGFET is assumed and a simple expression for the threshold voltage is derived by the assumed impurity profile. In application, the concept of correction factor K is used and the value of threshold voltage is well agreed with experimental value. Also, 1-V character-istics curve is well agreed with experimental value. In addition, this program is packaged and is utilized.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.1
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• pp.18-22
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• 2005

We developed a new systematic calibration procedure and applied it to the calibration of the diffusivity, segregation and TED model of the indium impurity. The TED of the indium impurity was studied under 4 different experimental conditions. Although the indium proved to be susceptible to the TED, the RTA was effective in suppressing the TED effect and in maintaining a steep retrograde profile. Just as in the case of boron, indium demonstrated significant oxidation-enhanced diffusion in silicon and its segregation coefficients at the Si/SiO₂ interface were significantly below 1. In contrast, the segregation coefficient of indium decreased as the temperature increased. The accuracy of the proposed technique has been validated by SIMS data and 0.13-㎛ device characteristics such as Vth and Idsat with errors less than 5% between simulation and experiment.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.370-374
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• 1988

This paper is concerned with the investigation of the impurity redistribution process in a two step diffusion. In integrated circuit technology, two step boron diffusion involving a deposition step followed by a drive-in step in commonly encounted. The drive-in process is usually performed in oxidizing atmosphere resulting in redistribution of impurity (boron) within the semiconductor. This paper proposes a new numerical analysis method; Bounary Element Method to determine impurity profile at the arbitrary point in domain by its coordinate and boundary value.

• Journal of the Korean Vacuum Society
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• v.12 no.S1
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• pp.63-66
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• 2003

It is experimentally shown that a $TiO_2$ film on Si(111) substrate was prepared by using the technique of D.C. reaction sputter deposition with $Ar^{+}$ ion beam bombardment, and a layer-like structure was observed from the depth profile of the interface between $TiO_2$ film and Si substrate with Scanning Electron Microscopy and Electron Probe. It was also surprisingly discovered that Ti atoms could be detected at about 9 $\mu$m depth. The $TiO_2$-Si interface bombarded by $Ar^{+}$ ion beams revealed multi-layer structures, a mechanism might be caused by defect diffusion, impurity and matrix relocation. Multi-relocations of impurity and matrix atoms were as a result of profile broadening of the $TiO_2$-Si interface, and the spread due to matrix relocation in this system is shown to exceed much more the spread due to impurity relocation.

• Journal of the Korean Institute of Telematics and Electronics
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• v.22 no.3
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• pp.95-102
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• 1985

An efficient numerical scheme for assessing the two-dimensional diffusion problem for modelling impurity profile in semiconductor is described. 4 unique combination of ADI (Al-ternating Direction Bmplicit) method and Gauss Elimination has resulted in a reduction of CPU time for most diffusion processes by a factor of 3, compared to other iteration schemes such as SOR (Successive Over-Relaxation) or Stone's iterative method without additional storage re-quirement. Various numerical schemes were compared for 2-D as well as 1-0 diffusion profile in terms of their CPU time while retaining the magnitude of relative error within 0.001%. good agree-ment between 1-D and 2-D simulation profile as well as between 1-D simulation profile and experiment has been obtained.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.6
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• pp.17-26
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• 1984

A computer program (DIFSIM: Diffusion SIMulator) was written to calculate the impurity profile, specifically boron and phosphorus, due to three different diffusion processes-predeposition, drive-in in inert ambient, and drive-in in oxidizing ambient. The vacancy mechanism including Fair and Tsai's theory for phosphDrus diffusion was widely incorporated for modeling various diffusion processes. The concentrationtependent oxidation rate was also explained using the vacancy model, while the oxidation - enhanced diffusion was mo dolled using catkins replacement mochanlsm . The simulation results using DIFSIM showed a fairly good agreement with the experimental data by adjusting some of the empirical parameters in the program. The results obtained using DIFSIM were compared with the results from SUPREM II.

• KSBB Journal
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• v.15 no.5
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• pp.537-540
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• 2000

In developing a HPLC purification process, it was hoped that a single chromatographic system would be sufficient to abtain pure paclitaxel in high yield. However, no such system was found, due in part to the complex taxoid profile of crude paclitaxel and to the rigorous nature of the product specification. A two step HPLC purification was adopted using reverse-phase separation on C(sub)18 as a first step, and normal-phase separation on silica as the final polishing step. Impurity profiles were established and maintained for paclitaxel, which identified and quantified each impurity observed in purified paclitaxel from these two steps, all impurities at or above 0.1% were identified. Results provide information for improving the quality control of paclitaxel production.

• Transactions on Electrical and Electronic Materials
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• v.5 no.6
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• pp.211-214
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• 2004

We developed a new systematic calibration procedure which was applied to the calibration of the diffusivity, segregation and TED model of the indium impurity. The TED of the indium impurity has been studied using 4 different groups of experimental conditions. Although the indium is susceptible to the TED, the RTA is effective to suppress the TED effect and maintain a steep retrograde profile. Like the boron, the indium shows significant oxidationenhanced diffusion in silicon and has segregation coefficients at the $Si/SiO_2$ interface much less than 1. In contrast, however, the segregation coefficient of indium decreases as the temperature increases. The accuracy of the proposed technique is validated by SIMS data and $0.13 {\mu}m$ device characteristics such as $V_{th}$ and $Id_{sat}$ with errors less than $5 \%$ between simulation and experiment.