• 제목/요약/키워드: high-density grain

검색결과 544건 처리시간 0.029초

New Density-Independent Model for Measurement of Grain Moisture Content using Microwave Techniques

  • Kim, Jong-Heon;Kim, Ki-Bok;Noh, Sang-Ha
    • Journal of Electrical Engineering and information Science
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    • 제2권4호
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    • pp.72-78
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    • 1997
  • A free space transmission method using standard gain horn antennas in the frequency range from 9.0 to 10.5GHz is applied to determine the dielectric properties of grain such as rough rice ,brown rice and barley. The dielectric constant and loss factor, which depend on the moisture content of the wetted grain are obtained from the measured attenuation and phase shift by vector network analyzer. The moisture content of grain varied from 11 to 25% based on this wetted condition. The measured values of dielectric constants as a function of moisture density are compared with values of those obtained using he predicted model for estimating dielectric constants of grain. The effect of density fluctuation, high is an important parameter governing the dielectric properties of grain, on the dielectric constant and loss factor is presented. A new density-independent model in terms of measured attenuation an moisture density is proposed of reducing the effects of density fluctuation on the moisture content measurement.

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High-Temperature Deformation Behavior of Ti3Al Prepared by Mechanical Alloying and Hot Pressing

  • Han, Chang-Suk;Jin, Sung-Yooun;Kwon, Hyuk-Ku
    • 한국재료학회지
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    • 제30권2호
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    • pp.57-60
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    • 2020
  • Titanium aluminides have attracted special interest as light-weight/high-temperature materials for structural applications. The major problem limiting practical use of these compounds is their poor ductility and formability. The powder metallurgy processing route has been an attractive alternative for such materials. A mixture of Ti and Al elemental powders was fabricated to a mechanical alloying process. The processed powder was hot pressed in a vacuum, and a fully densified compact with ultra-fine grain structure consisting of Ti3Al intermetallic compound was obtained. During the compressive deformation of the compact at 1173 K, typical dynamic recrystallization (DR), which introduces a certain extent of grain refinement, was observed. The compact had high density and consisted of an ultra-fine equiaxial grain structure. Average grain diameter was 1.5 ㎛. Typical TEM micrographs depicting the internal structure of the specimen deformed to 0.09 true strain are provided, in which it can be seen that many small recrystallized grains having no apparent dislocation structure are generated at grain boundaries where well-developed dislocations with high density are observed in the neighboring grains. The compact showed a large m-value such as 0.44 at 1173 K. Moreover, the grain structure remained equiaxed during deformation at this temperature. Therefore, the compressive deformation of the compact was presumed to progress by superplastic flow, primarily controlled by DR.

비파괴평가에 의한 라디에타소나무 단판 및 수지함침시트 표면적층 합판의 휨성능 (Bending Performances of Radiata Pine Veneers and Phenol Resin-Impregnated Sheet Overlaid Plywoods by Nondestructive Evaluation)

  • 서진석
    • Journal of the Korean Wood Science and Technology
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    • 제26권1호
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    • pp.87-96
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    • 1998
  • The bending performances were evaluated at the radiata pine plywood through veneer compositions encompassing veneer quality, ply-numbers and overlays of the high density- or medium density-phenol resin impregnated sheets (hereafter abbreviated as resin sheets) on the raw plywood. In addition, a prediction on the bending MOE of veneers and plywoods was carried out by the nondestructive testing with stresswave timer. The summarized results were as follows: I. Bending strength and bending MOE of resin sheets-overlaid plywoods in parallel surface grain direction through 5 and 7ply were increased by 13 to 45% and 17 to 34%, respectively. Resin sheets-overlay occurred an increasing effect of the strength efficiency i.e. strength perpendicular-to-grain direction versus that parallel-to-grain direction, showing the phenomenon that the plywood strength becomes greater at the perpendicular-to-grain direction of 7ply than at that of 5ply. Displacement at bending failure had a greater trend at 7ply than at 5ply, and was decreased by resin sheets-overlay. 2. After the nondestructive bending MOEs were measured for individual veneers, these veneers were rearranged in plywood-manufacture. In these plywoods, including resin sheets-overlay, the actual MOE was predictable with feasibility of $R^2$=0.53, and also the nondestructively-evaluated MOE was lower by 20% in raw plywood, and higher 20% in LVL than actual bending MOEs.

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미립 절대밀도의 품종간 변이 및 몇가지 미립형질과의 관계 (Varietal Variations in Absolute Density of Rice Grain and Its Relations with Other Grain Characters)

  • Hee Jong, Koh;Mun Hue, Heu;Cheng Mo, Jiang
    • 한국작물학회지
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    • 제37권3호
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    • pp.244-249
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    • 1992
  • 벼 품종간 미립 절대밀도의 변이와 그에 영향하는 미립관련형질들을 구명하기 위하여 통일형 30, Japonica형 72 및 Indica형 133 계 235 품종에 대해 미립의 절대밀도와 모양 및 크기, 경도, 심복백, ADV, amylose 함량, 전분구조를 조사하고 그들 간의 관계를 검토한 결과는 다음과 같다. 1. 백미의 절대밀도는 평균적으로 통일형 1.496g/$cm^3$, Japonica형 1.506g/$cm^3$, Indica형 1.500g/$cm^3$이었고, 출수까지의 생육일수 및 현미의 경도와는 정의 상관을 심복백, 현미의 부피 및 1000립중, 입장과는 부의 상관을 보였다. 2. 편회귀분석 결과 미립의 크기가 절대밀도에 가장 크게 영향하는 것으로 나타났다. 3. 절대밀도의 고, 저에 따른 전분결정구조의 차이는 감별할 수 없었으며, 심복백의 경우 정상배유부분에 비해 전분립자가 둥글고 그 결정조직이 느슨하였다. 4. 미립의 크기가 비슷하고 심복백이 없는 경우 절대밀도의 품종간 차이는 미미한 것으로 나타나서 수량성에는 크게 영향하지 못할 것으로 생각되나, 미질의 측면에서는 검토되어져야 할 것이다.

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초미립 초경소재 개발을 통한 엔드밀 공구의 성능 평가 (Machinability Evaluation of Endmill Tool through Development of Ultra-fine Grain Grade Cemented Tungsten Carbide Material)

  • 김홍규;서정태;권동현;김정석;강명창
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 추계학술대회 논문집
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    • pp.865-869
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    • 1997
  • In recent years, there has been increasing demand of ultra-fine grain graded cemented tungsten carbide material with high hardness and toughness which is used as high speed cutting tool for development in semiconductor, electronics and die/mold industry, which bring into limelight high-precision, high-efficient machining of sculptured surfaces. This paper deals with the performance of variation in the ultra-fine grain graded cemented tungsten carbide material such as grain size, hardness and density varied according to the volume of added elements, Co or TaC, and he changing of mixing, sintering process. Also, the performance of developing material with uniformed grain size of 0.5${\mu}{\textrm}{m}$ is compared with other domestics' & foreign companies' with analyzing and cutting performance testing.

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Single Crystal Growth Behavior in High-Density Nano-Sized Aerosol Deposited Films

  • Lim, Ji-Ho;Kim, Seung-Wook;Kim, Samjung;Kang, Eun-Young;Lee, Min Lyul;Samal, Sneha;Jeong, Dae-Yong
    • 한국재료학회지
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    • 제31권9호
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    • pp.488-495
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    • 2021
  • Solid state grain growth (SSCG) is a method of growing large single crystals from seed single crystals by abnormal grain growth in a small-grained matrix. During grain growth, pores are often trapped in the matrix and remain in single crystals. Aerosol deposition (AD) is a method of manufacturing films with almost full density from nano grains by causing high energy collision between substrates and ceramic powders. AD and SSCG are used to grow single crystals with few pores. BaTiO3 films are coated on (100) SrTiO3 seeds by AD. To generate grain growth, BaTiO3 films are heated to 1,300 ℃ and held for 10 h, and entire films are grown as single crystals. The condition of grain growth driving force is ∆Gmax < ∆Gc ≤ ∆Gseed. On the other hand, the condition of grain growth driving force in BaTiO3 AD films heat-treated at 1,100 and 1,200 ℃ is ∆Gc < ∆Gmax, and single crystals are not grown.

큰 결정 크기를 가지는 단일층 그래핀 성장을 위한 구리 호일의 전해연마 공정 최적화 (Optimized Electroplishing Process of Copper Foil Surface for Growth of Single Layer Graphene with Large Grain Size)

  • 김재억;박홍식
    • 센서학회지
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    • 제26권2호
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    • pp.122-127
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    • 2017
  • Graphene grown on copper-foil substrates by chemical vapor deposition (CVD) has been attracting interest for sensor applications due to an extraordinary high surface-to-volume ratio and capability of large-scale device fabrication. However, CVD graphene has a polycrystalline structure and a high density of grain boundaries degrading its electrical properties. Recently, processes such as electropolishing for flattening copper substrate has been applied before growth in order to increase the grain size of graphene. In this study, we systemically analyzed the effects of the process condition of electropolishing copper foil on the quality of CVD graphene. We observed that electropolishing process can reduce surface roughness of copper foil, increase the grain size of CVD graphene, and minimize the density of double-layered graphene regions. However, excessive process time can rather increase the copper foil surface roughness and degrade the quality of CVD graphene layers. This work shows that an optimized electropolishing process on copper substrates is critical to obtain high-quality and uniformity CVD graphene which is essential for practical sensor applications.

Sputtering of Multifunctional AlN Passivation Layer for Thermal Inkjet Printhead

  • 박민호;김상호
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.50-50
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    • 2011
  • The aluminum nitride films were prepared by RF magnetron sputtering using an AlN ceramic target. The crystallinity, grain size, Al-N bonding and thermal conductivity were investigated in dependence on the plasma power densities (4.93, 7.40, 9.87 W/$cm^2$) during sputtering. High thermal conductivity is important properties of A1N passivation layer for functioning properly in thermal inkjet printhead. The crytallinity, grain size, Al-N bonding formation and chemical composition were observed using X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS), respectively. The AlN thin film was changed from amorphous to crystalline as the power density was increased, and the largest grain size appeared at medium power density. The near stoichiometry Al-N bonding ratio was acquired at medium power density. So, we know that the AlN thin film had better thermal conductivity with crystalline phase and near stoichometry Al-N bonding ratio at 7.40 W/$cm^2$ power density.

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사출성형 및 열간가압 소결법으로 제작된 지르코니아 세라믹 임플란트의 소결물성 및 미세구조적 결함 (Sintered Properties and Microstructural Defects of Zirconia Ceramic Implant Fabricated by Injection Molding and Hot Isostatic Pressing (HIP))

  • 박현정;박정식;이종국
    • 열처리공학회지
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    • 제36권4호
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    • pp.215-222
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    • 2023
  • 3Y-TZP (3 mol% yttria-stabilized tetragonal zirconia polycrystals, 3Y-TZP) ceramics are emerging as dental implant materials due to their superior optical and mechanical properties as well as excellent biophysical properties, in spite of low bioactivity. In this study, we investigated to sintered properties and microstructural defects of dental zirconia implants fabricated by ceramic injection molding and post-HIP (Hot isostatic pressing) processing and analyzed the processing parameters related with the obtainment of its high sinterd density. Sintered and microstructural parameters, i.e, apparent density, grain size and phase composition of zirconia implants fabricated by injection molding were dependent on the fixtute size and implant type. Maximum sintered density of 99.2% and minimum grain size of 0.3-0.4 ㎛ were obtained from large-scaled 2-body sample. In 1-body ceramic implant, high sintered density of 99.5% was obtained, but it had a little monoclinic phase and wide grain size distribution.

프랙탈을 이용한 ZnO 바리스터 표면 구조 및 전기적 특성 (The Structure and Electrical Characteristics of ZnO Varistors Surface using-Fractal)

  • 오수홍;홍경진;이진;이준웅;김태성
    • 한국전기전자재료학회논문지
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    • 제13권10호
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    • pp.834-839
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    • 2000
  • The structural properties that SEM photograph of ZnO varistors surface studied by fractal mathematics program were investigated to verify the relations of electrical characteristics. The SEM photograph of ZnO varistors surface were changed by binary code and the grain shape of that were analyzed by fractal dimension. The void of ZnO varistors surface was found by fractal program. The relation between grain density and electrical properties depend on fractal dimension. The grain size in ZnO varistors surface was decreased by increasing of Sb$_2$O$_3$ addition. The spinel structure was formed by Sb$_2$O$_3$addition and it was depressed the ZnO grain formation. The grain size of ZnO by Sb$_2$O$_3$addition were from 5 to 10[${\mu}{\textrm}{m}$]. Among of ZnO varistors, fractal dimension of ZnO4 was very high as a 1.764. The density of grain boundary in ZnO2 and ZnO3 varistors surface was 15[%] by formed spinal structure. The breakdown electric field of ZnO2 that fractal dimension has 1.752 was very high to be 8.5[kV/cm]. When the fractal dimensin was high, the grain shape of ZnO varistors was complex and the serial layers of ZnO grain was increased.

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