• 제목/요약/키워드: high power semiconductor device

검색결과 261건 처리시간 0.03초

Considerations on the use of a Boost PFC Regulator Used in Household Air-conditioning Systems (over 3kW)

  • Jang Ki-Young;Suh Bum-Seok;Kim Tae-Hoon
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2002년도 전력전자학술대회 논문집
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    • pp.589-592
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    • 2002
  • The CCM (Continuous Conduction Mode) boost topology is generally used in the PFC (Power Factor Correction) regulator of household air-conditioning systems. There are three kinds of power devices-bridge rectifier diodes, FRDs (Fast Recovery Diodes), and IGBTs (or MOSFETs) - used In a boost PFC regulator. Selecting the appropriate device is very cumbersome work, specially, in the case of FRDs and IGBTs, because there are several considerations as described below: 1) High frequency leakage current regulation (conducted and radiated EMI regulation) 2) Power losses and thermal design 3) Device cost. It should be noted that there are trade-offs between the power loss characteristic of 2) and the other characteristics of 1) and 3). This paper presents a detailed evaluation by using several types of power devices, which can be unintentionally used, to show that optimal selection can be achieved. Based on the given thermal resistances, thermal analysis and design procedures are also described from a practical viewpoint.

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A Study on Characteristic Improvement of IGBT with P-floating Layer

  • Kyoung, Sinsu;Jung, Eun Sik;Kang, Ey Goo
    • Journal of Electrical Engineering and Technology
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    • 제9권2호
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    • pp.686-694
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    • 2014
  • A power semiconductor device, usually used as a switch or rectifier, is very significant in the modern power industry. The power semiconductor, in terms of its physical properties, requires a high breakdown voltage to turn off, a low on-state resistance to reduce static loss, and a fast switching speed to reduce dynamic loss. Among those parameters, the breakdown voltage and on-state resistance rely on the doping concentration of the drift region in the power semiconductor, this effect can be more important for a higher voltage device. Although the low doping concentration in the drift region increases the breakdown voltage, the on-state resistance that is increased along with it makes the static loss characteristic deteriorate. On the other hand, although the high doping concentration in the drift region reduces on-state resistance, the breakdown voltage is decreased, which limits the scope of its applications. This addresses the fact that breakdown voltage and on-state resistance are in a trade-off relationship with a parameter of the doping concentration in the drift region. Such a trade-off relationship is a hindrance to the development of power semiconductor devices that have idealistic characteristics. In this study, a novel structure is proposed for the Insulated Gate Bipolar Transistor (IGBT) device that uses conductivity modulation, which makes it possible to increase the breakdown voltage without changing the on-state resistance through use of a P-floating layer. More specifically in the proposed IGBT structure, a P-floating layer was inserted into the drift region, which results in an alleviation of the trade-off relationship between the on-state resistance and the breakdown voltage. The increase of breakdown voltage in the proposed IGBT structure has been analyzed both theoretically and through simulations, and it is verified through measurement of actual samples.

WBG 소자를 적용한 보조전원장치의 고효율, 경량화 연구 (Research on High-Efficient Power Converters Using WBG Devices for Auxiliary Power Supplies (APS) System)

  • 조인호;이재범
    • 공학기술논문지
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    • 제10권2호
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    • pp.203-208
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    • 2017
  • Due to global climate change issues, there is a growing demand for systems throughout the industry. In the case of power conversion, studies have been actively conducted to change the structure of the power conversion circuit and to apply new power devices. In particular, the WBG (Wide Band Gap), which is newly emerged device in the market for developing semiconductor technology, has demonstrated advantages in applying for various aspects in comparison to the existing Si (Silicon) Semiconductor. Recent research centers in the railway industry are focusing on developing technologies suitable for railway vehicles by utilizing these new developments in railway countries such as Japan and Europe. This paper researches the WBG device that is applicable to the auxiliary power supplies (APS) in railway system, and analyzes the downsizing effects to APS in high-speed railway by conducting a theoretical analysis and simulation.

A Design of BJT-based ESD Protection Device combining SCR for High Voltage Power Clamps

  • Jung, Jin-Woo;Koo, Yong-Seo
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권3호
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    • pp.339-344
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    • 2014
  • This paper presents a novel bipolar junction transistor (BJT) based electrostatic discharge (ESD) protection device. This protection device was designed for 20V power clamps and fabricated by a process with Bipolar-CMOS-DMOS (BCD) $0.18{\mu}m$. The current-voltage characteristics of this protection device was verified by the transmission line pulse (TLP) system and the DC BV characteristic was verified by using a semiconductor parameter analyzer. From the experimental results, the proposed device has a trigger voltage of 29.1V, holding voltage of 22.4V and low on-resistance of approximately $1.6{\Omega}$. In addition, the test of ESD robustness showed that the ESD successfully passed through human body model (HBM) 8kV. In this paper, the operational mechanism of this protection device was investigated by structural analysis of the proposed device. In addition, the proposed device were obtained as stack structures and verified.

GaN-HEMT 기반 Anyplace Induction Cooktop용 전력변환장치 설계 및 성능 검증 (Design and Hardware Verification of Power Conversion System for GaN-HEMT Based Anyplace Induction Cooktop)

  • 권만재;장은수;박상민;이병국
    • 전력전자학회논문지
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    • 제25권6호
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    • pp.451-458
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    • 2020
  • In this study, a trade-off analysis of a power conversion system (PCS) is performed in accordance with a power semiconductor device to establish the suitable operating frequency range for the anyplace induction heating system. A resonant network is designed under each operating frequency condition to compare and analyze the PCS losses depending on the power semiconductor device. On the basis of the simulation results, the PCS losses and frequency condition are calculated. The calculated results are then used for a trade-off analysis between Si-MOSFET and GaN-HEMT based on PCS. The suitable operating frequency range is determined, and the validity of the analysis results is verified by the experiment results.

고전압 전력소자를 보호하기 위한 센스펫 설계방법 (A Design Method on Power Sensefet to Protect High Voltage Power Device)

  • 경신수;서준호;김요한;이종석;강이구;성만영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.6-7
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    • 2008
  • Current sensing in power semiconductors involves sensing of over-current in order to protect the device from harsh conditions. This technique is one of the most important functions in stabilizing power semiconductor device modules. The sense FET is very efficient method with low power consumption, fast sensing speed and accuracy. In this paper we have analyzed the characteristics of proposed sense FET and optimized its electrical characteristics to apply conventional 450V power MOSFET devices by numerical and simulation analysis. The proposed sense FET has the n-drift doping concentration $1.5\times10^{14}cm^{-3}$, size of $600{\mu}m^2$ with 4.5 $\Omega$, and off-state leakage current below 50 ${\mu}A$. We offer the layout of the proposed sense FET to process actually. The offerd design and optimization methods is meaningful, which the methods can be applied to the power devices having various breakdown voltages for protection.

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고 전력 Source Measurement Unit의 설계 및 제작 (Design and Implementation of High Power Source Measurement Unit)

  • 이상구;백왕기;박종식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 B
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    • pp.860-863
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    • 2003
  • In this paper high power SMU(Source Measurement Unit) having 50V/1.5A source/measure range has been designed and implemented. The SMU has two operation mode, voltage mode and current mode. The SMU can be used as variable voltage source, variable current source, voltage meter, or current meter. Combining two different unit, output power can be doubled as 100V/1.5A. The developed SMU tan be used many semiconductor testing system and electronic device inspecting system.

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GaN, Cool MOS, SiC MOSFET을 이용한 DC-DC 승압 컨버터의 효율 특성 (Efficiency Characteristics of DC-DC Boost Converter Using GaN, Cool MOS, and SiC MOSFET)

  • 김정규;양오
    • 반도체디스플레이기술학회지
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    • 제16권2호
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    • pp.49-54
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    • 2017
  • In this paper, recent researches on new and renewable energy have been conducted due to problems such as energy exhaustion and environmental pollution, and new researches on high efficiency and high speed switching are needed. Therefore, we compared the efficiency by using high speed switching devices instead of IGBT which can't be used in high speed switching. The experiment was performed theoretically by applying the same parameters of the high speed switching devices which are the Cool MOS of Infineon Co., SiC C3M of Cree, and GaN FET device of Transform, by implementing the DC-DC boost converter and measuring the actual efficiency for output power and frequency. As a result, the GaN FET showed good efficiency at all switching frequency and output power.

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교류 구동 LED 드라이버 IC에 관한 연구 (A study on AC-powered LED driver IC)

  • 전의석;안호명;김병철
    • 한국정보전자통신기술학회논문지
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    • 제14권4호
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    • pp.275-283
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    • 2021
  • 본 연구에서는 저내압 반도체 공정으로 제작 가능한 교류 구동 LED 드라이버 IC를 설계하여, 그 성능들에 대한 시뮬레이션을 수행하였다. 교류 220V에서 직접 구동하기 위한 드라이버 IC를 제작하기 위하여 500V 이상의 항복전압을 만족하는 반도체 제조공정이 필요하다. 고내압 반도체 제조공정은 일반적인 저내압 반도체 공정보다 매우 높은 제조비용을 요구한다. 따라서 낮은 내압의 소자를 구현하는 반도체 공정기술로도 제작할 수 있도록 LED 드라이버 IC를 직렬로 설계하였다. 이는 입력전압이 고전압이라도 각 LED 블록마다 전압이 나누어 인가되는 것을 가능하게 한다. LED 조명회로는 220V에서 96%의 역률을 나타내고 있다. pnp 트랜지스터를 이용한 역률 개선 회로에서는 99.7%의 아주 높은 역률을 얻을 수 있으며, 입력전압의 변동과 관계없이 매우 안정된 동작을 보여주었다.

SiC based Technology for High Power Electronics and Packaging Applications

  • Sharma, Ashutosh;Lee, Soon Jae;Jang, Young Joo;Jung, Jae Pil
    • 마이크로전자및패키징학회지
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    • 제21권2호
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    • pp.71-78
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    • 2014
  • Silicon has been most widely used semiconductor material for power electronic systems. However, Si-based power devices have attained their working limits and there are a lot of efforts for alternative Si-based power devices for better performance. Advances in power electronics have improved the efficiency, size, weight and materials cost. New wide band gap materials such as SiC have now been introduced for high power applications. SiC power devices have been evolved from lab scale to a viable alternative to Si electronics in high-efficiency and high-power density applications. In this article, the potential impact of SiC devices for power applications will be discussed along with their Si counterpart in terms of higher switching performance, higher voltages and higher power density. The recent progress in the development of high voltage power semiconductor devices is reviewed. Future trends in device development and industrialization are also addressed.