• 제목/요약/키워드: high current density

검색결과 2,256건 처리시간 0.03초

Effect of Deposition Parameters on the Morphology and Electrochemical Behavior of Lead Dioxide

  • Hossain, Md Delowar;Mustafa, Chand Mohammad;Islam, Md Mayeedul
    • Journal of Electrochemical Science and Technology
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    • 제8권3호
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    • pp.197-205
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    • 2017
  • Lead dioxide thin films were electrodeposited on nickel substrate from acidic lead nitrate solution. Current efficiency and thickness measurements, cyclic voltammetry, AFM, SEM, and X-ray diffraction experiments were conducted on $PbO_2$ surface to elucidate the effect of lead nitrate concentration, current density, temperature on the morphology, chemical behavior, and crystal structure. Experimental results showed that deposition efficiency was affected by the current density and solution concentration. The film thickness was independent of current density when deposition from high $Pb(NO_3)_2$ concentration, while it decreased for low concentration and high current density deposition. On the other hand, deposition temperature had negative effect on current efficiency more for lower current density deposition. Cyclic voltammetric study revealed that comparatively more ${\beta}-PbO_2$ produced compact deposits when deposition was carried out from high $Pb(NO_3)_2$ concentration. Such compact films gave lower charge discharge current density during cycling. SEM and AFM studies showed that deposition of regular-size sharp-edge grains occurred for all deposition conditions. The grain size for high temperature and low concentration $Pb(NO_3)_2$ deposition was bigger than from low temperature and high concentration deposition conditions. While cycling converted all grains into loosely adhered flappy deposit with numerous pores. X-ray diffraction measurement indicates that high concentration, high temperature, and high current density favored ${\beta}-PbO_2$ deposition while ${\alpha}-PbO_2$ converted to ${\beta}-PbO_2$ together with some unconverted $PbSO_4$ during cycling in $H_2SO_4$.

고성능 아연-이온 전지의 고품질 집전체를 위한 그래핀 필름의 결함 제어 (Controlling Defects in Graphene Film for Enhanced-Quality Current Collector of Zinc-Ion Batteries with High Performance)

  • 이영근;안건형
    • 한국재료학회지
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    • 제33권4호
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    • pp.159-163
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    • 2023
  • Zinc-ion Batteries (ZIBs) are currently considered to be effective energy storage devices for wearable electronics because of their low cost and high safety. Indeed, ZIBs show high power density and safety compared with conventional lithium ion batteries (LIBs) and exhibit high energy density in comparison with supercapacitors (SCs). However, in spite of their advantages, further current collector development is needed to enhance the electrochemical performance of ZIBs. To design the optimized current collector for high performance ZIBs, a high quality graphene film is suggested here, with improved electrical conductivity by controlling the defects in the graphene film. The graphene film showed improved electrical conductivity and good electron transfer between the current collector and active material, which led to a high specific capacity of 346.3 mAh g-1 at a current density of 100 mA g-1, a high-rate performance with 116.3 mAh g-1 at a current density of 2,000 mA g-1, and good cycling stability (68.0 % after 100 cycles at a current density of 1,000 mA g-1). The improved electrochemical performance is firmly because of the defects-controlled graphene film, leading to improved electrical conductivity and thus more efficient electron transfer between the current collector and active material.

고해상도 CRT용 전자총의 히터 및 캐소드 저전력 설계 (Low Power Design on Heater and Cathode of Electron Gun for High Resolution CRT)

  • 김학성
    • 전력전자학회논문지
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    • 제10권6호
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    • pp.618-625
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    • 2005
  • 본 논문은 CRT 표시장치에서 고전류밀도를 구현하기 위한 전자총의 히터와 캐소드의 최적의 저전력설계와 실험을 수행하였다. CRT 표시장치에서 밝기, 고휘도, 고해상도와 대화면화를 위해서는 전자총 캐소드(cathode)의 고전류밀도가 필수적이다. 이를 위해서는 함침형 캐소드가 사용되며, 고전류밀도를 얻기 위해 히터의 동작온도를 높여야하는데 이에 비례하여 소비전력도 증가한다. 본 논문에서는 고전류밀도 캐소드 히터의 저전력 설계를 위하여 히터의 리드형태(Lead Type), 코팅(Coating)법, 발열부의 1차 및 2차 코일링의 피치와 권선수를 달리한 샘플을 제작, 시험하였다.

Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • 마이크로전자및패키징학회지
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    • 제12권1호
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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The Investigation of COD Treatment and Energy Consumption of Urban Wastewater by a Continuous Electrocoagulation System

  • DEDE SAGSOZ, Yesim;YILMAZ, Alper Erdem;EKMEKYAPAR TORUN, Fatma;KOCADAGISTAN, Beyhan;KUL, Sinan
    • Journal of Electrochemical Science and Technology
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    • 제13권2호
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    • pp.261-268
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    • 2022
  • In this study, electrochemical treatment of urban wastewater with electrical conductivity of 1000 μS cm-1 and chemical oxygen demand of 250 mg L-1 was investigated using the variables of initial pH value, current density and flow rate. Electrocoagulation was used, in which aluminum and stainless steel were selected, as the electrochemical treatment process. The electrocoagulation process was operated in continuous mode. The data obtained in experimental studies show that the best COD removal efficiency occurred in experiments where the initial pH value was 6. The increase in current density from 5 A to 15 A decreased the removal efficiency from 79 to 67%. The increase in flow rate under constant current density also reduced the efficiency of removal as expected. In experiments in which current density and flow rate were examined together, the increase in flow rate allowed the application of higher current densities. This situation led to considerable reductions in energy consumption values, even if the COD removal efficiency did not significantly increase. The high COD removal obtained with the use of high flow rate and high current density indicates that the electrocoagulation process can be used for high flow rate municipal wastewater treatment.

구리 박막의 표면형상과 물성에 대한 전류밀도 영향 (Property and Surface Morphology of Copper Foil on the Current Density)

  • 우태규;박일송;정광희;설경원
    • 한국재료학회지
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    • 제20권10호
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    • pp.555-558
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    • 2010
  • This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.

고속도금된 Zn-Cr 및 Zn-Cr-X 3원합금 도금층의 표면조직, 광택도 및 경도 (Surface morphology, Glossiness and Hardness of Zn-Cr and Zn-Cr-X ternary alloy Electrodeposits)

  • 예길촌;김대영;서경훈
    • 한국표면공학회지
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    • 제36권5호
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    • pp.379-385
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    • 2003
  • The surface morphology, the glossiness and the hardness of Zn-Cr and Zn-Cr-X(X:Co, Mn) alloy electrodeposits were investigated by using chloride bath with EDTA additive and flow cell system. The surface morphology of Zn-Cr alloy and Zn-Cr-Mn alloy changed from fine needle shape crystalline structure to colony structure of fine granular crystallites with increasing current density in the range of 20-100 $A/dm^2$. The surface morphology of Zn-Cr-Co alloy deposited from low Co concentration bath(2.5-10 g/$\ell$) was similar to that of Zn-Cr alloy, while that of Zn-Cr-Co alloy deposited from high cobalt concentration bath was fine granular crystalline structure in the same range of current density. The glossiness of Zn-Cr and Zn-Cr-Mn alloy increased noticeably with increasing current density, while that of Zn-Cr-Mn alloy decreased with increasing Mn concentration of bath in high current density region. The glossiness of Zn-Cr-Co alloy deposited from low Co concentration bath increased with current density while that of the alloy from high Co concentration bath decreased with increasing current density. The hardness of Zn-Cr and Zn-Cr-X alloy increased noticeably with current density.

고분자 전해질 연료전지의 전류밀도와 국소 함수량 관찰 (Observation of local water content and current density in the PEMFC system)

  • 고동수;문철언;최경민;김덕줄;정지환
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2008년도 춘계학술대회 논문집
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    • pp.69-72
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    • 2008
  • The local water contents and water transfer characteristics in the PEMFC system were investigated by numerical simulations and experiments. The performance of a lab-scale PEMFC is measured for fully humidified gases conditions and non-humidified ones. In order to observe the local water contents and water transfer characteristics inside PEMFC, the numerical simulation using CFD module on STAR-CD(es-pemfc) were conducted. The results show that the water content was increased as increasing current density, whereas it was decreased in high current density region. Then there was close correlation between high water content and internal temperature inside of MEA, and high current density was observed when internal temperature was dramatically increased.

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BSCCO 고온초전도 전류도입선의 제조 (Fabrication of BSCCO high-Tc superconducting current lead)

  • 하동우;오상수;류강식;장현만
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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    • pp.252-255
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    • 1996
  • Superconducting current lead is one of the promising applications of the oxide high-Tc superconductors, because they have the advantage of decreasing heat conduction to low temperature region, comparing with a conventional cooper alloy lead. High critical current density is a key factor for the applications such as current lead. (Bi,Pb)$_2$Sr$_2$Ca$_2$Cu$_3$O$\_$x/ high Tc superconductor haute been investigated in terms of critical current density. Bi-2223 superconducting current lead made by CIP and solid state sintering process. Bi-2223 current lead that heat treated at 836$^{\circ}C$ for 240 h in 1/13 P$\_$O$_2$/ had over 150 A/$\textrm{cm}^2$ of critical current density at 77K. We knew that the superconducting properties of tube type current leads were better than rods type of them. And we investigated the relation of Bi-2223 formation and heat treatment condition by XRD and SEM analysis.

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Fabrication of 6-superconducting layered HTS wire for high engineering critical current density

  • Kim, Gwantae;Ha, Hongsoo;Kim, Hosup;Oh, Sangsoo;Lee, Jaehun;Moon, Seunghyun
    • 한국초전도ㆍ저온공학회논문지
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    • 제23권4호
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    • pp.10-13
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    • 2021
  • Recently, cable conductors composed of numerous coated conductors have been developed to transport huge current for large-scale applications, for example accelerators and fusion reactors. Various cable conductors such as CORC (Conductor on round core), Roebel Cable, and TSTC (Twisted stacked tape cable) have been designed and tested to apply for large-scale applications. But, these cable conductors cannot improve the engineering critical current density (Je) because they are made by simple stacking of coated conductors. In this study, multi-HTS (High temperature superconductor) layers on one substrate (MHOS) wire was fabricated to increase the engineering critical current density by using the exfoliation of superconducting layer from substrate and silver diffusion bonding method. By the repetition of these processes, the 10 m long 6-layer MHOS conductor was successfully fabricated without any intermediate layers like buffer or solder. 6-layer MHOS conductor exhibited a high critical current of 2,460A/12mm-w. and high engineering critical current density of 1,367A/mm2 at liquid nitrogen temperature.