• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.75-79
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• 2013

Demands for semiconductor devices are dramatically increasing, and advancements in fabrication technology are allowing a step-up in the number of devices per unit area. As a result, semiconductor devices require higher heat dissipation, and thus, cooling solutions have become important for guaranteeing their operational reliability. In particular, in chip-in-board packages, in which chips and passives are embedded in the substrates for efficient device layout, heat dissipation is of greater importance. In this study, a thermal model for layers of different materials has been proposed, and then, the heat transfer has been simulated by imposing a set of appropriate boundary conditions. Heat generation can be predicted based on the results, which will be utilized as practical data for actual package design.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.85-89
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• 2011

Waste water is disposed to sewage disposal plant by underground PE double wall pipes. Various processes have been introduced to join PE pipes, but most of these methods have many disadvantages such as costs, lack of reliability and difficulties in joining, etc. Recently butt welding has been paid much attention to joint PE pipes as this process has many advantages such as cost, safety and reliability. In this study, newly developed heat plate, a patent-pending heat plate with a groove, was used to butt-weld PE double wall pipes with different misalignment gaps to simulate real underground conditions, and the butt welding temperature of PE pipe was determined by thermal analysis (Thermal Gravimetric Analysis, Differential Scanning Calorimetry and Dynamic Mechanical Analysis). The resulting joining characteristics of double wall pipes were compared with those from a conventional heat plate, in terms of stiffness, flattening and leakage tests. The results from the stiffness and flattening test showed that there were no big differences between the butt-welded joints made from these two plates. From the leakage test, although PE pipes welded with a conventional heat plate did leak below the required test conditions (10 min. at 0.75kgf/cm2), the pipes welded with a patent-pending grooved heat plate did not show any leakage even at a pressure 1.5 times higher than the required conditions. It was noted that by utilizing a grooved heat plate more complete fusion at the pipe joints could be obtained, which in turn induced a high quality joints.

• Textile Coloration and Finishing
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• v.3 no.1
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• pp.8-16
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• 1991

In order to investigate the fine structure of PET films, PET films were stretchd at various draw ratios (2, 3, 4, 5) below $T_g$ ($72^{\circ}C$) and then annealed at various temperatures (125, 150, 175, $200^{\circ}C$) under free-annealed (FA) and taut-annealed (TA) conditions. Such changes as thermal shrinkage, crystallinity, crystallite size, dynamic viscoelasticity and thermal behaviour were measured in relation to the draw ratio and annealing condition.The following results were obtained. 1. Thermal shirinkage increased with increasing annealing temperature and draw ratio, but decreased in case of draw ratio 4 (draw ratio 3 at $200^{\circ}C$) and above it. 2. The degree of crystallinity of FA samples were higher than those of TA samples. 3. Tan 5 of TA samples were less than those of FA samples, and storage moduli (E') and loss moduli (E") of FA samples were less than those of TA samples; moreover, maximum tan '||'&'||' temperature of FA samples were shifted toward higher temperature than those of TA samples. 4. The melting endotherm ($T_m$) and heat of fusion $(\DeltaH)$ of the PET film increased with the draw ratio and annealing temperature; in addition, premelting endotherm ($T_m$) and heat of fusion $(\DeltaH)$ of the local crystallization in the FA samples were larger than those of TA samples. 5. The X-ray diffraction pattern displayed sharp peaks gradually with the draw ratio and annealing temperature. 6. Crystallite sizes of FA samples were larger than those of TA samples.

• Nuclear Engineering and Technology
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• v.54 no.12
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• pp.4491-4498
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• 2022

The thermal stress between W plasma-facing material (PFM) and Cu heat sink in fusion reactors can be significantly reduced by using a W-Cu functionally graded material (W-Cu FGM) interlayer. However, there is still considerable stress at the joining interface between W and W-Cu FGM in the W/W-Cu FGM/Cu portions. In this work, we fabricate W skeletons with continuous gradients in porosity by a modified sedimentation method. Sintering densification behavior and pore characteristics of the sedimented W skeletons at different sintering temperatures were investigated. After Cu infiltration, the final W-Cu FGM was obtained. The results indicate that the pore size and porosity in the W skeleton decrease gradually with the increase of sintering temperature, but the increase of skeleton sintering temperature does not reduce the gradient range of composition distribution of the final prepared W-Cu FGM. And W-Cu FGM with composition distribution from pure W to W-20.5wt.% Cu layer across the section was successfully obtained. The thickness of the pure W layer is about one-fifth of the whole sample thickness. In addition, the prepared W-Cu FGM has a relative density of 94.5 % and thermal conductivity of 185 W/(m·K). The W-Cu FGM prepared in this work may provide a good solution to alleviate the thermal stress between W PFM and Cu heat sink in the fusion reactors.

• Journal of Hydrogen and New Energy
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• v.26 no.2
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• pp.120-126
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• 2015

Recently, the ever-increasing use of fossil fuels for rapid industrial development and population significantly caused an environment pollution and global warming such as climate change. So research and development of sustainable and eco-friendly energy have been performed. Especially the interest in nuclear fusion fuel was significantly increased from the developed countries. The system of fusion energy production was tritium separation, storage and delivery, and purification. Republic of Korea is in charge of Storage and Delivery System (SDS) in the International Thermonuclear Experimental Reactor (ITER). Welding part of the SDS bottles for storing the tritium is known to be susceptible to hydrogen embrittlement. In this study, conducted a study for the relaxation of the stability and hydrogen embrittlement of the weld area. The hydrogen heat treatment was processed through the Pressure-Composition-Temperature (PCT) device according to the time variation. Also mechanical properties such as impact test and hardness test according to using the alkaline cleaning liquid for hydrogen embrittlement relief and the fracture was observed by scanning electron microscopy (SEM) after the mechanical properties evaluation.

• Journal of the Korean Chemical Society
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• v.8 no.2
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• pp.68-74
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• 1964

Water has the melting point, the boiling point, the heat of fusion, and the heat of vaporization all much higher than would be normally expected from the hydrogen compounds of the other members of the oxygen family. Another unique characteristic of ice-Ⅰ is its volume decrease which takes place in its melting. A number of significant efforts have been made in the past to explain these properties quantitatively. The authors, reasoning from the unusually great free surface energy of water and the characteristic volume change on melting, propose the structural model of liquid water as follows. On melting, fluidized vacancies of a molecular size are introduced. Thereupon, for the unusually great surface energy density, molecules surrounding the vacancies become to have close packed arrangement. But molecules not in direct contact with vacancies should still possess the original structure i. e., ice-Ⅰ. When a molecule adjacent to a vacancy jumps into the vacancy, the molecule attains the gaslike degree of freedom. Using the above model, the authors had developed the liquid partition function of water by applying the theory of significant structures in liquids. Molar volume, vapor pressure, entropy of fusion and entropy of vaporization were calculated over a wide temperature range. The results show good agreement with experimental observations.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.6
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• pp.239-244
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• 2019

Two hydrogenation surface modifications, namely hydrogen atmosphere heat treatment and hydrogen plasma treatment, were found to lead to improved dispersion of nanodiamond (ND) seed particles and enhanced nucleation density for deposition of smooth ultrananocrystalline diamond (UNCD) film. After hydrogenation, the C-O and O-H surface functionalities on the surface of nanodiamond particles were converted to the C-H surface functionalities, and the Zeta potential was increased. As the degree of dispersion was improved, the size of nanodiamond aggregates decreased significantly and nucleation density increased dramatically. After hydrogen heat treatment at 600℃, average size of ND particles was greatly reduced from 3.5 ㎛ to 34.5 nm and a very high nucleation of ~3.9 × 10¹¹ nuclei/㎠ was obtained for the seeded Si surface.

• Fibers and Polymers
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• v.4 no.3
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• pp.114-118
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• 2003

The prepolymer and the final polyurethane (PU) block copolymer were synthesized by reacting 4,4-methylene bis(phenylisocyanate) with poly(tetramethylene glycol) and the prepolymer with 1,4-butanediol as a chain extender, respectively, to investigate the relation between phase separation and it's resulting properties. According to FT-IR data, the phase separation of hard and soft segments in the prepolymer and the PU block copolymer grew bigger by increasing the hard segment content, and the PU showed more dominant phase separation than the prepolymer. The heat of fusion due to soft segments decreased in both the prepolymer and the PU by increasing the hard segment content, whereas the heat of fusion due to hard segments increased in the PU did not appear in the prepolymers. The breaking stress and modulus of the prepolymer increased by increasing the hard segment content, and the elongation at break decreased gradually, and the PU showed the highest breaking stress and modulus at 58% hard segment content. However, the best shape recovery of the PU was obtained at 47% hard segment content due to the existence of proper interaction among the hard segments for shape memory effect. Consequently, the mechanical properties and shape memory effect of the PU were influenced by the degree of phase separation, depending on the incorporation of chain extender as well as the hard segment content.

• BMB Reports
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• v.40 no.6
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• pp.936-943
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• 2007

Previously it was reported that promoter of groES-groEL operon of Staphylococcus aureus is induced by various cellwall active antibiotics. In order to exploit the above promoter for identifying novel antistaphylococcal drugs, we have cloned the promoter containing region ($P_g$) of groES-groEL operon of S. aureus Newman and found that the above promoter is induced by sublethal concentrations of many antibiotics including cell-wall active antibiotics. A reporter S. aureus RN4220 strain (designated SAU006) was constructed by inserting the $P_g$-lacZ transcriptional fusion into its chromosome. Agarose-based assay developed with SAU006 shows that $P_g$ in single-copy is also induced distinctly by different classes of antibiotics. Data indicate that ciprofloxacin, rifampicin, ampicillin, and cephalothin are strong inducers, whereas, tetracycline, streptomycin and vancomycin induce the above promoter weakly. Sublethal concentrations of ciprofloxacin and ampicilin even have induced $P_g$ efficiently in microtiter plate grown SAU006. Additional studies show for the first time that above promoter is also induced weakly by arsenate salt and hydrogen peroxide. Taken together, we suggest that our simple and sensitive assay systems with SAU006 could be utilized for screening and detecting not only novel antistaphylococcal compounds but also different toxic chemicals.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization