• 산업기술연구
• /
• 제20권B호
• /
• pp.125-130
• /
• 2000

Heat dissipation technology using flow resonant phenomenon is a kind of new concept in heat transfer area. A vibration exciter is needed to generate air turbulence which has the natural shedding frequency of heat system. A mechanical vibrating device for the air flow oscillation is introduced, which is driven by a moving coil actuator. An analytical dynamic model for this mechanical vibration exciter is presented and its validity is verified by the comparison with experimental data. Values of some unknown system parameters in the analytic model are estimated through the system identification approach. Based on this mathematical model, a high bandwidth vibration phase, it turns out the high modal resonant characteristics of vibrating plate are the major barrier against obtaining a high bandwidth vibration exciter.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2002년도 춘계학술대회 논문집
• /
• pp.82-86
• /
• 2002

The thermal characteristics of high-speed air spindle system with built-in motor are studied. Experiment and finite difference method analysis obtain temperature rise and temperature distribution of housing. For the analysis, air fluid film model is built and temperature rise and distribution in thermal steady state are computed for each rotational speed. Generally, it is said that the heat generation of air bearing is negligible. But the heat generation in air film by heat dissipation can not be negligible especially into high-speed region of the journal. In case that the heat generation of air spindle system is high, natural frequency of the spindle system becomes lower when the thermal state is in steady-state and it means the changes of air bearing stiffness due to the change of bearing clearance. It is shown that the temperature rise of air spindle system causes thermal expansion and induces the variation of bearing clearance. In consequence the stiffness of air bearing becomes smaller.

• 설비공학논문집
• /
• 제19권5호
• /
• pp.418-425
• /
• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• 마이크로전자및패키징학회지
• /
• 제21권3호
• /
• pp.7-17
• /
• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• 대한전자공학회논문지
• /
• 제12권5호
• /
• pp.12-18
• /
• 1975

Triac phase controlled pre-regulator를 이용한 직류안정화전원에서 제어소자 전력소모를 촤소로 줄이기 위하여, 부하전류의 증가에 따라 제어소자 양단전압을 낮추어 주는 회로를 고안하여 부가하였다. 이렇게 하므로써 제어소자의 전력소모가 약 40%정도 감소되어 방열장치가 간단해지거나 전력용량을 증가할 수 있게 되었으며 열발산이 곤란한 monolithic I.C.화에 유용하도록 하였다. A method on minimizing the power dissipation in the control element of a series D.C. voltage regutator is devised. An additional control circuit which reduces the average voltage drop across the control element according to increasing the load current is attached :o the trial phase controlled pre-regulator system. It is verified that the power dissipation in the control element is reduced up to 40% by this. circuit arrangement. The heat sink system can be simplified and the capacity of tile handling power is also increased. It is expected that this circuit arrangement can be applied to I.C. fabrication.

• 대한수학회보
• /
• 제20권2호
• /
• pp.99-103
• /
• 1983

Internal heat generation is one of the insidious conditions affecting the quality of an industrial product after it is cast, coated, molded, forged or laminated. Frequently, the product is pressed into service before the exothermic chemical reactions in the generic material has been completed. The heat liberated from this continuing chemical reaction or the residual deformation from the rheological activities in the materials must be adequately removed or prevented, or the product may be discolored, warped, weakened or even "ignited" spontaneously. Numerous instances of premature structural failures, product-recalls, and/or system-malfunctions have been recorded in recent history. The Coulee Dam was poured with pre-chilled concrete just to negate this freakish encore. It is well-known that concrete (a non-isotropic conducting medium), for instance, takes 28 days to develop its full strength. During this period of curing it is conceivable that the processes of internal heat generation, heat conduction and heat dissipation take place simultaneously inside the medium.he medium.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
• /
• pp.522-524
• /
• 2005

The LED light source has many excellent advantages for the application of LCD backlight module. As we know, the operational temperature can significantly influence the characteristics of LEDs. Heat can damage the LED 's quality, and decrease its lifetime and output light intensity. In this paper, we perform computer software, Flomerics CFD (Computational Fluid Dynamics), to simulate heat distribution of the 20.1" LED backlight module we designing, and realize how the different heat sinks can solve the serious heat problem in practice.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2007년도 제38회 하계학술대회
• /
• pp.138-139
• /
• 2007

This research provides machine designers with some intuition to consider both, magnetic and heat transfer effects. A topological multi-objective function includes magnetic energy and heat inflow rate to the system, which equals to the total heat dissipation by conduction and convection. For the thermal field regarding the heat inflow, introduced as a reaction force, topology design sensitivity is derived by employing discrete equations. The adjoint variable method is used to avoid numerous sensitivity evaluations. As a numerical example, a C-core design excited by winding current demonstrates the strength of the multi-physical approach.

• 설비공학논문집
• /
• 제15권8호
• /
• pp.667-673
• /
• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2007년도 춘계학술대회B
• /
• pp.2408-2413
• /
• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.