• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of Conservation Science
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• v.22
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• pp.77-86
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• 2008

The pre-treatment for conservation must be needed for the exhumed historic sites. So, the study of conservation and restoration of historical sites has progressed favorably with using various polymers for solving upper problems. The problems which should be essentially solved for conservation of the exhumed historic sites are, however, using reinforcing agents that don't impair their original forms and sorting reinforcing agents on the lines of the historic sites' soil. These agents should be able to use without the effect of outer environments like marsh, winter time or temperature. In this work, we synthesized Epoxy resin and Epoxy hardener for the restoration of historical sites. These products have very good tension strength and adhesion strength and various physical properties that the users want. Particularly, these epoxy with high viscosity have good separation of between Epoxy final product and Urethane pre-surface.

• Journal of the Korean Wood Science and Technology
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• v.34 no.5
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• pp.29-41
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• 2006

This study was to investigate the effect of adding additive as tannin, rice husk and charcoal, for reducing the formaldehyde emission level, on the adhesion properties of urea-formaldehyde (UF) resin for particleboard. We controlled the hot-pressing time, temperature and pressure to determine the bonding strength and formaldehyde emission. Blends of various UF resin/additives (tannin, rice husk and charcoal) compositions were prepared. To determine and compare the effect of additives (tannin, rice husk and charcoal) content, 0, 5, 10 and 15%, by weight of UF resin, were used. $NH_4Cl$ as hardener added. To determine the level of formaldehyde emission, we used the desiccator, perforator and 20 L-small chamber method. The formaldehyde emission level decreased with increased additions of additive (except rice husk). Also, increased hot-pressing time decreased formaldehyde emission level. At a charcoal replacement ratio of only 15%, the formaldehyde emission level is under F ✩ ✩ ✩ ✩ grade (emit < $0.3mg/{\ell}$). Curing of the high tannin additive content in this adhesive system indicated that the bonding strength increased. But, in the case of rice husk and charcoal, the bonding strength was much lower due to the inorganic substance. Furthermore, rice husk was poor in bonding strength as well as formaldehyde emission than tannin and charcoal.

• Korean Journal of Materials Research
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• v.16 no.5
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• pp.302-307
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• 2006

The formation and processing of organic insulators on the device performance have been studied in the fabrication of organic thin film transistors (OTFTs). The series of polyvinyls, poly-4-vinyl phenol(PVP) and polyvinyltoluene (PVT), were used as solutes and propylene glycol monomethyl ether acetate(PGMEA) as a solvent in the formation of organic insulators. The cross-linking of organic insulators was also attempted by adding the thermosetting material, poly (melamine-co-formaldehyde) as a hardener in the compound. The electrical characteristics measured in the metal-insulator-metal (MIM) structures showed that insulating properties of PVP layers were generally superior to those of PVT layers. Among the layers of PVP series: PVP(10 wt%) copolymer, 5 wt% cross-linked PVP(10 wt%), PVP(20 wt%) copolymer, 5 wt% cross-linked PVP(20 wt%) and 10 wt% cross-linked PVP(20 wt%), the 10 wt% cross-linked PVP(20 wt%) layer showed the lowest leakage current characteristics. Finally, inverted staggered OTFTs using the PVP(20 wt%) copolymer, 5 wt% cross-linked PVP(20 wt%) and 10 wt% cross-linked PVP(20 wt%) as gate insulators were fabricated on the polyether sulphone (PES) substrates. In our experiments, we could obtain the maximum field effect mobility of 0.31 $cm^2/Vs$ in the device from 5 wt% cross-linked PVP(20 wt%) and the highest on/off current ratio of $1.92{\times}10^5$ in the device from 10 wt% cross-linked PVP(20 wt%).

• Proceedings of the Korea Concrete Institute Conference
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• 2008.11a
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• pp.445-448
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• 2008

The unsaturated polyester(UP) and epoxy resin have a superior material properties and a chemical resistance using sewerage pipes rehabilitation. However, UP and epoxy have not a low temperatures harding, the requirement $8{\sim}11$ hours long times harding and heating system used by reinforcement liner. This study is to evaluate the effects of low temperature harding properties methyl methacrylate(MMA) monomer using expanded polystyrene(EPS) and UP in addition of initiator and promoters. From the test result, viscosity tends to increase with increasing EPS and UP contents. However, harding time change of the MMA resins which it follows in addition of the initiator and promoter.

• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.39-43
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• 2006

The polyvinyl series organic films as gate insulators of thin film transistor(TFT) have been processed and characterized on the polyether sulphone (PES) substrates . The poly-4-vinyl phenol(PVP) and polyvinyl toluene (PVT) were used as solutes and propylene glycol monomethyl ether acetate(PGMEA) as a solvent in the formation of organic insulators. The cross-linking of organic insulators was also attempted by adding the thermosetting material, poly (melamine-co-formaldehyde) as a hardener in the compound. The electrical characteristics measured in the metal-insulator-metal (MIM) structures showed that insulating properties of PVP layers were generally superior to those of PVT layers. Among the layers of PVP series; copolymer PVP(10 wt%), 5wt% cross-linked PVP(10 wt%), copolymer PVP(20 wt%), 5 wt% cross-linked PVP(20 wt%) and 10 wt% cross-linked PVP(20 wt%), the 10 wt% cross-linked PVP(20 wt%) layer showed the lowest leakage current of 1.2 pA at ${\pm}10V$. The ms value of surface roughness and the capcitance per unit area are 2.41 and $1.76nF/cm^2$ in the case of 10 wt% cross-linked PVP(20 wt%) layer, respectively.

• Journal of the Korean Wood Science and Technology
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• v.40 no.6
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• pp.418-423
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• 2012

In order to develop the end use of cylindrical laminated veneer lumber (LVL) such as wooden crafts, the water proof-bonding strength, the resistance to abrasion and the surface hardness by painting the surface of LVL were investigated. The study results were as follows; The water proof-bonding strength through 5 cyclic test by boiling in water immersion and drying were favorable without delamination of glue line. Then the formulation of glue was resorcinol resin (100) to hardener of paraformaldehyde (5) by mixed weight percentage. The resistance to abrasion was relatively higher at cross section than tangential section. When tangential section of LVL was painted by UV protection oil, the resistance to abrasion was improved. In case of an cross section of LVL, the higher surface hardness appeared at larch core than radiata pine LVL. Also, in case of an tangential section of LVL, the higher surface hardness appeared at glue line than veneer side.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.359-363
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• 2005

The organic insulation devices with MIM (metal-insulator-metal) structures as PVP gate insulation films were prepared for the application of organic thin film transistors (OTFT). The co-polymer organic insulation films were synthesized by using PVP(poly-4-vinylphenol) as solute and PGMEA (propylene glycol monomethyl ether acetate) as solvent. The cross-linked PVP insulation films were also prepared by addition of poly (melamine-co-formaldehyde) as thermal hardener. The leakage current of the cross-linked PVP films was found to be about 300 pA with low current noise. and showed better property in electrical properties as compared with the co-polymer PVP insulation films. In addition, cross-linked PVP insulation films showed better surface morphology (roughness), showing about 0.11${\~}$0.18 nF in capacitance for all PVP film samples.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.2
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• pp.177-194
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• 1991

The purpose of this study was to analyze the magnitude and distribution of stress using a photoelastic model from a distal extension removable partial dentures with three kinds of mandibular major connectors, that is, lingual bar, linguoplate, and swing-lock attachment. A photoelastic model was made of the epoxy resin(PC-1) and hardener(PCH-1) and coated with plastic cement-1 (PC-1) at the lingual surface of the epoxy model and set with three kinds of chrome-cobalt removable partial dentures. A bilateral vertical load of 15kg to the middle portion of the metal bar crossing both the first molars of the right and the left, and a unilateral vertical load of 12.5kg to the right first molar were applied with the use of specially designed loading device and the reflective circular polariscope was used to analyze the photoelastic model under each condition. The following results were obtained : 1. When the bilateral vertical load was applied, the magnitude and distribution of the stress concentration of the edentulous area and the terminal abutment or adjacent teeth was in the order of lingual bar, linguoplate, swing-lock attachment. 2. When the unilateral vertical load was applied, the magnitude and distribution of the stress concentration of the edentulous area and the terminal abutment or adjacent teeth was in the order of lingual bar, linguoplate, swing-lock attachment. 3. When the unilateral vertical load was applied, the magnitude and distribution of the stress concentration of the termial abutment or adjacent teeth on the non-loaded side showed the least stress distribution in case of swing-lock attachment. 4. When the bilateral vertical load and the unilateral vertical load were applied the swing-lock attachment showed the mildest uniform stress distribution on the edentulous area and the alveolar bone around the abutment teeth.

• Journal of Conservation Science
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• v.24
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• pp.37-42
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• 2008

Stability of the moving historic sites have something to do with the degree of easiness of work as well as physical property of polymer product. These agents should be able to use without the effect of outer environments like water or low temperature and must have stability during progress of working the peel off Urethane pre-product from Epoxy surface. So, we synthesized low viscosity epoxy resin and hardener with best physical quality and separation media for the moving of historical sites. These products have very good tension strength, adhesion strength, low viscosity and various physical properties that the users want. Particularly, separation media products have good separation of Urethane pre-products surface and Epoxy final product surface.