• The Journal of Korean Academy of Prosthodontics
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• v.43 no.3
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• pp.293-305
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• 2005

Statement of problems. Conventional feldspathic porcelain is used extensively as a restorative material and it is subjected to grinding and polishing during fabrication and delivery procedures. There is still considerable controversy concerning the best methods to achieve the strongest porcelain restorations after such adjustments. Purpose. The objective of this study was to investigate the effects of (1) overglazing, (2) selfglazing, and (3) fine polishing on the flexural strength and fracture toughness of feldspathic dental porcelain. Material and method. Ninety porcelain disks were prepared for flexural strength test and sixty porcelain disks were fabricated for fracture toughness test. Specimens were divided into three groups for each test as follows: 1) overglazed 2) self-glazed 3) polished. The flexural strength of feldspathic porcelains was determined by ring-on-ring biaxial flexural strength test. The fracture toughness values of three experimental groups were obtained by indentation fracture toughness test. Results. The flexural strength of overglazed group was significantly higher than that of selfglazed and polished group (P<0.05), while the difference between self-glazed and polished group was not significant (P>0.05). The fracture toughness values of overglazed and polished group were significantly higher than that of self-glazed group (P<0.05), while the difference between overglazed and polished group was not significant (P>0.05). Conclusions. This results supported the use of polishing as an alternative to glazing metal ceramic restorations, as it was not detrimental in flexural strength and fracture toughness. But, under the conditions of this study, overglazing was the ideal surface finishing method of feldspathic dental porcelain.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.1
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• pp.61-70
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• 2004

Generally, ceramics are very difficult-to-cut materials because of its high strength and hardness. The machining process of ceramics can be characterized by cracking and brittle fracture. In the machining of ceramics, edge chipping and crack propagation are the principal reasons to cause surface integrity deterioration. Such phenomenon can cause not only poor dimensional and geometric accuracy, but also possible failure of the ceramic parts. Ceramics can be machined with traditional method such as grinding and polishing. However, such processes are generally cost-expensive and have low material removal rate. Thus, in this paper, to overcome these problems. BN powder, which gives good cutting property, is added for the fabrication of machinable ceramics by volume of 5,10,15,20,25 and 30%. And, mechanical properties, R-curve behavior and machining tests are carried out to evaluate the machining properties of the manufactured machinable ceramics.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.12
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• pp.1227-1235
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• 2013

Ceramic materials are classified by oxide, nitride and carbide material and have high brittleness, strength and hardness. Ceramic materials are strong in compression but weak in shearing and tension. This review paper has focused on technology trends and mechanism analysis of ceramics removal machining. The ceramic materials have superior mechanical, physical and chemical properties, but it is very hard to machining and the use of ceramics has been limited because of high strength and brittleness. In this paper, technology trends of ceramic removal-machining was introduced for types of machining technology, abrasive machining, cutting process, laser machining and so on.

• Journal of the Korean Society of Safety
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• v.25 no.5
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• pp.1-6
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• 2010

When the ceramic material is being machined, micro crack and brittle fracture dominate the process of material removal. Generally, ceramics are very difficult-to-cut materials and machined using conventional method such as grinding and polishing. However, such processes are generally cost-expensive and have low material removal rate. Machinable ceramics used in this study contain BN powder to overcome these problem and for productivity elevation. This paper focuses on machinability evaluation during end mill process with CNC machining center in this study. Experiment for this purpose is performed for tool wear patterns and mechanism.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.126-129
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method, and this process was found to be very accurate method for SOI thickness control. During electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential (OCP) point, the passivation potential (PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM, respectively.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1369-1371
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• 2001

This paper describes on thinning SDB SOI substrates by SDB technology and Electro-chemical etch-stop. The surface of the fabricated SDB SOI substrates is more uniform than that grinding or polishing by mechanical method, and this process is possible to accurate SOI thickness control. During Electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential (OCP) point and the passivation potential (PP) poin and determinated to anodic passivation potential. The surface roughness and selectively controlled thickness of the fabricated SOI substrates were analyzed by using AFM and SEM, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05b
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• pp.301-306
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method, and this process was found to be a very accurate method for SOI thickness control. During electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential(OCP) point, the passivation potential(PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.431-436
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method and this process was found to be a very accurate method for SOI thickness control. During electrochemical etch-stop leakage current versus voltage curves were measured for analysis of the open current potential(OCP) point the passivation potential(PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.362-365
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• 1999

This paper describes on thinning SDB SOI substrates by SDB technology and electrochemical etch-stop. The surface of the fabricated SDB SOI substrates is more uniform than that grinding or polishing by mechanical method, and this process is possible to accurate SOI thickness control. During Electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential (OCP) point and the passivation potential (PP) poin and determinated to anodic substrates were analyzed by using AFM and SEM, respectivelv.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.143-147
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• 2003

Despite of outstanding optical performance of glass lens, glass lens have not been widely used because of poor productivity and high cost due to manufacturing process i.e. grinding, polishing. However, press-forming method of glass lens overcomes this disadvantage because of mass production. When glass lens is produced by press-forming method using closed die, it is needed that the volume of glass lens preform precisely measured in order to prevent incomplete products and to increase in life of die. The present paper shows the shortcoming of forming process with closed die, and performs FEM simulation of forming process with open die in order to overcome this shortcoming. The design parameter of open die is selected in standard of assembly with optical module and maintenance of optical performance. FEM simulation is carried out with selected parameter of open die and two basic preform. According to distribution of effective strain in glass lens, optical property of glass lens formed at each set of die and preform is compared.