• Title/Summary/Keyword: gold chip

Search Result 97, Processing Time 0.022 seconds

Surface Analysis of Aluminum Bonding Pads in Flash Memory Multichip Packaging

  • Son, Dong Ju;Hong, Sang Jeen
    • Transactions on Electrical and Electronic Materials
    • /
    • v.15 no.4
    • /
    • pp.221-225
    • /
    • 2014
  • Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

PREPARATION OF ANISOTROPIC CONDUCTIVE FINE PARTICLES BY ELECTROLESS NICKEL PLATING.

  • Fujinami, T.;Watanabe, J.;Motizuki, I.;Honma, H.
    • Journal of the Korean institute of surface engineering
    • /
    • v.29 no.6
    • /
    • pp.709-713
    • /
    • 1996
  • Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7 $\mu\textrm{m}$ diamiter) by electroless nickel plating have been investigated. Generally, batch type electroless plating is applied to provide conductivity on the nonconductors. Since the surface areas of particles are much larger than the bulk substrate, accordingly the electroless plating bath becomes unstable. Thus, we applied the continuous dropping method for the preparation of conductive particles. The uniform coverage of deposited nickel on the particles was obtained by using ammonium acetate as a complexing agent, and surface coverage is further improved without coagulation of particles by the surface active agent treatment before enter the plating bath.

  • PDF

Voltammetric Analysis on a Disposable Microfluidic Electrochemical Cell

  • Chand, Rohit;Han, Dawoon;Kim, Yong-Sang
    • Bulletin of the Korean Chemical Society
    • /
    • v.34 no.4
    • /
    • pp.1175-1180
    • /
    • 2013
  • A microfabricated electrochemical cell comprising PDMS-based microchannel and in-channel gold microelectrodes was fabricated as a sensitive and a miniature alternative to the conventional electroanalytical systems. A reproducible fabrication procedure enabled patterning of multiple microelectrodes integrated within a PDMS-based fluidic network. The active area of each electrode was $200{\mu}m{\times}200{\mu}m$ with a gap of $200{\mu}m$ between the electrodes which resulted in a higher signal to noise ratio. Also, the PDMS layer served the purpose of shielding the electrical interferences to the measurements. Analytes such as potassium ferrocyanide; amino acid: cysteine and nucleoside: guanosine were characterized using the fabricated cell. The microchip was comparable to bulk electrochemical systems and its applicability was also demonstrated with flow injection based rapid amperometric detection of DNA samples. The device so developed shall find use as a disposable electrochemical cell for rapid and sensitive analysis of electroactive species in various industrial and research applications.

Thin Film Effects on Side Channel Signals (부 채널 신호에 대한 박막의 영향)

  • Sun, Y.B.
    • Journal of the Semiconductor & Display Technology
    • /
    • v.12 no.2
    • /
    • pp.51-56
    • /
    • 2013
  • Even if transmissions through normal channel between ubiquitous devices and terminal readers are encrypted, any extra sources of information retrieved from encrypting module can be exploited to figure out the key parameters, so called side channel attack. Since side channel attacks are based on statistical methods, making side channel signal weak or complex is the proper solution to prevent the attack. Among many countermeasures, shielding the electromagnetic signal and adding noise to the EM signal were examined by applying different thicknesses of thin films of ferroelectric (BTO) and conductors (copper and gold). As a test vehicle, chip antenna was utilized to see the change in radiation characteristics: return loss and gain. As a result, the ferroelectric BTO showed no recognizable effect on both shielding and adding noise. Cu thin film showed increasing shielding effect with thickness. Nanometer Au exhibited possibility in adding noise by widening of bandwidth and red shifting of resonating frequencies.

FPGA circuit implementation of despreading delay lack loop for GPS receiver and preformance analysis (GPS 수신기용 역확산 지연 동기 루프의 FPGA 회로 구현과 성능 분석)

  • 강성길;류흥균
    • The Journal of Korean Institute of Communications and Information Sciences
    • /
    • v.22 no.3
    • /
    • pp.506-514
    • /
    • 1997
  • In this paper, we implement digital circuit of despreading delay lock loop for GPS receiver. The designed system consists of Epoch signal generator, two 13bit correlators which correlates the received C/A code and the locally generated C/A code in the receiver, the C/A code generator which generates C/A code of selected satellite, and the direct digital clock synthesizer which generates the clock of the C/A code generator to control the phase and clock rate, the clock controller, and the clock divider. The designed circuit has the function of the acquisition and tracking by the autocorrelation characteristics of Gold code. The controller generates each other control signals according to the correlation value. The designed circuit is simulated to verify the logic functional performance. By using the simulator STR-2770 that generates the virtual GPS signal, the deigned FPGA chip is verified the circuit performance.

  • PDF

Fabrication of Microcantilever-based Biosensor Using the Surface Micromachining Technique (표면 미세 가공기술을 이용한 마이크로 캔틸레버의 제작과 바이오센서로의 응용)

  • Yoo Kyung-Ah;Joung Seung-Ryong;Kang C. J.;Kim Yong-Sang
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.55 no.1
    • /
    • pp.11-15
    • /
    • 2006
  • We propose an optical and an electrical detection methods for detecting various bio-molecules effectively with microcantilevers. The microcantilevers were fabricated employing surface micromachining technique that has attractive advantages in terms of cost efficiency, simplicity and ability of fabricating in array. The fluid cell system for injection of bio-molecular solution is fabricated using polydimethylsiloxane (PDMS) and a fused silica glass. The microcantilever is deflected with respect to the difference of the surface stress caused by the formation of self-assembled bio-molecules on the gold coated side of the microcantilever. It detected cystamine dihydrochloride and glutaraldehyde molecules and analyzed individual concentrations of the cystamine dihydrochloride solution. We confirm that the deflections of bending-up or bending-down are occurred by the bio-molecule adsorption and microcantilever can be widely used to a ${\mu}-TAS$ and a lab-on-a-chip for a potential detection of various bio-molecules.

A Portable Surface Plasmon Resonance Biosensor for Rapid Detection of Salmonella typhimurium

  • Nguyen, Hoang Hiep;Yi, So Yeon;Woubit, Abdela;Kim, Moonil
    • Applied Science and Convergence Technology
    • /
    • v.25 no.3
    • /
    • pp.61-65
    • /
    • 2016
  • Here, the rapid detection of Salmonella typhimurium by a portable surface plasmon resonance (SPR) biosensor in which the beam from a diode laser is modulated by a rotating mirror is reported. Using this system, immunoassay based on lipopolysaccharides (LPS)-specific monoclonal anti-Salmonella antibody was performed. For the purpose of orientation-controlled immobilization of antibodies on the SPR chip surface, the cysteine-mediated immobilization method, which is based on interaction between a gold surface and a thiol group (-SH) of cysteine, was adopted. As a result, using the portable SPR-based immunoassay, we detected S. typhimurium in the range from 10^7 CFU/mL to 10^9 CFU/mL within 1 hour. The results indicate that the portable SPR system could be potentially applied for general laboratory detection as well as on-site monitoring of foodborne, clinical, and environmental agents of interest.

Characteristics of Constructed SPR (Surface Plasmon Resonance) Sensor System for the Detection of Salmonella and hIgG Antigen-Antibody Reaction. (살모넬라와 면역글로블린(hIgG)의 항원-항체반응 감지를 위한 표면 플라즈몬 공명형 센서시스템의 특성)

  • Um, N.S.;Koh, K.N.;Hahm, S.H.;Kim, J.H.;Lee, S.H.;Kang, S.W.
    • Journal of Sensor Science and Technology
    • /
    • v.7 no.4
    • /
    • pp.263-270
    • /
    • 1998
  • Surface Plasmon Resonance (SPR) sensor system, has rapid response and high sensitivity, can be applicable for detecting reaction times of many biospecific interactions. A SPR sensor system was constructed to detect the antigen-antibody reactions of salmonella and hIgG (human immunoglobulin G). Sensor chips made of gold thin film were used for detecting biological bindings of antigen and antibody reactions. The antigen and antibody reactions for salmonella and hIgG were carried out with various time intervals to observed characteristics of these reactions using SPR sensor system. The resonance angle shift changes were clearly observed at the time of salmonella or hIgG antibody injection into sample cell since each antibody was self-assembled on gold chip surface of the sensor. It was found that the antibodies of salmonella and hIgG reacted with its sensor chip surface in 10 minutes and 60 minutes respectively. And the antigens of both salmonella and hIgG were bound to its antibody within 1 minute.

  • PDF

Effects of PCB ENIG and OSP Surface Finishes on the Electromigration Reliability and Shear Strength of Sn-3.5Ag PB-Free Solder Bump (PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가)

  • Kim, Sung-Hyuk;Lee, Byeong-Rok;Kim, Jae-Myeong;Yoo, Sehoon;Park, Young-Bae
    • Korean Journal of Materials Research
    • /
    • v.24 no.3
    • /
    • pp.166-173
    • /
    • 2014
  • The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

Dose Distribution in Solid Phantom by TLD with a Metal Plate of Various Thicknesses (다양한 두께의 금속판을 얹은 TLD를 이용하여 구한, 고체 팬텀 내에서의 선량분포)

  • Kim, Sookil
    • Progress in Medical Physics
    • /
    • v.10 no.2
    • /
    • pp.83-88
    • /
    • 1999
  • Purpose: TLD experiments were set up to measure the dose distribution and to analyze the influence on dose measurement of thin metal plate and solid water phantom. The aim of the present study was to investigate the build-up effect of metal plate loaded on TLD chip and depth dose in the controlled environment of phantom measurements. Materials and Methods: Measurements were done by using LiF TLD-100 loaded by a thin metal plate with the same surface area (3.2$\times$3.2 $\textrm{mm}^2$) as TLD chip. TLD chips loaded with one metal plate from three different metal plate (Tin, Copper, Gold) of different thicknesses (0.1, 0.15, 0.2, 0.3 mm) were used respectively to measure radiation dose. Using the TLD loaded with one metal plate, surface dose and the depth dose at the build-up maximum region were investigated. Results: Using a metal plate on TLD chip increased the surface dose. Surface dose curve shows the dose build-up against equivalent thickness of metal to water. The values of TL reading obtained by using metal plate at depth of build-up maximum are about 8% to 13% lower than those obtained by normal TLD chip. Conclusion: The metal technique used for TLD dosimetry could provide clinicals information about the build-up of dose up to 4.2mm depth in addition to a depth dose distribution. The results of TLD with a metal plate measurements may help with decisions to boost or bolus certain areas of the skin.

  • PDF