• Korean Journal of Materials Research
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• v.31 no.3
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• pp.150-155
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• 2021

Zinc oxide (ZnO) based transparent conducting oxides (TCO) thin films, are used in many applications such as solar cells, flat panel displays, and LEDs due to their wide bandgap nature and excellent electrical properties. In the present work, fluorine and aluminium-doped ZnO targets are prepared and thin films are deposited on soda-lime glass substrate using a RF magnetron sputtering unit. The aluminium concentration is fixed at 2 wt%, and the fluorine concentration is adjusted between 0 to 2.0 wt% with five different concentrations, namely, Al2ZnO98(AZO), F0.5AZO97.5(FAZO1), F1AZO97(FAZO2), F1.5AZO96.5(FAZO3), and F2AZO96(FAZO4). Thin films are deposited with an RF power of 40 W and working pressure of 5 m Torr at 270 ℃. The morphological analysis performed for the thin film reveals that surface roughness decreases in FAZO1 and FAZO2 samples when doped with a small amount of fluorine. Further, optical and electrical properties measured for FAZO1 sample show average optical transmissions of over 89 % in the visible region and 82.5 % in the infrared region, followed by low resistivity and sheet resistance of 3.59 × 10-4 Ωcm and 5.52 Ω/sq, respectively. In future, these thin films with excellent optoelectronic properties can be used for thin-film solar cell and other optoelectronics applications.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.49-54
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• 2021

The display industry is transitioning from traditional rigid products such as flat panel displays to flexible or wearable ones designed to be folded or rolled. Accordingly, colorless and optically transparent polyimide (CPI) films are one of the prime candidates to substitute traditional cover glass as a passivation layer to accommodate product flexibility. However, CPI films subjected to repetitive pure bending loads inevitably entail an accumulation of residual strain that can eventually cause wrinkles or delamination in the underlying component after a certain number of static and cyclic loading. The purpose of this study is to establish an experimental method to systematically evaluate the bending residual strain of CPI films. Films were monotonically and cyclically wrapped on mandrels of various diameters to ensure a constant strain in each. After unwrapping the wound CPI film, the residual radius of curvature remaining on the film was measured and converted into residual strain. The critical radius of curvature at which residual strain does not remain was about 5 mm, and the residual strain decreased in proportion to the log time. It is expected that flexible displays can be reliably designed using the data between the applied bending strain and the residual strain.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.33-38
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• 2022

With an attempt to suppress the moiré phenomenon caused by the interference between the black matrix of a display panel and the metal grid of a camera, we have fabricated an anti-moiré filter using light diffusing particles (LDPs) with the average diameter of 20 ㎛. It is demonstrated that the anti-moiré filter coated on a glass substrate (370 mm × 470 mm) using a table slot-die coater reduces the moiré intensity to a great extent when the area covered by LDPs is 50%. To quantify the intensity of moiré phenomenon, we have measured the lightness ratio and found that it is reduced from 132.12 down to 105.71 by the filter. To find the optimum area covered by LDPs, we have performed ray tracing simulations using Mie scatters as a substitute for LDPs. From the simulated irradiation distribution, we have calculated the standard deviation (SD) and contrast ratio (CR) to evaluate the moiré strength. As expected, the SD and CR values decrease with increasing covered area by LDPs. However, there exists a trade-off between the transmittance of the filter and its capability of reducing the moiré intensity in determining the area covered by LDPs.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.24 no.4
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• pp.110-115
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• 2010

Transparent conducting gallium-doped zinc oxide (GZO) thin films which were deposited on Corning glass substrate using an Gun-type rf magnetron sputtering deposition technology. The GZO thin films were fabricated with an GZO ceramic target (Zn : 97[wt%], $Ga_2O_3$ : 3[wt%]). The GZO thin films were deposited by varying the growth conditions such as the substrate temperature, oxygen pressure. Among the GZO thin films fabricated in this study, the one formed at conditions of the substrate temperature of 200[$^{\circ}C$], Ar flow rate of 50[sccm], $O_2$ flow rate of 5[sccm], rf power of 80[W] and working pressure of 5[mtorr] showed the best properties of an electrical resistivity of $2.536{\times}10^{-4}[{\Omega}{\cdot}cm]$, a carrier concentration of $7.746{\times}10^{20}[cm^{-3}]$, and a carrier mobility of 31.77[$cm^2/V{\cdot}S$], which indicates that it could be used as a transparent electrode for thin film transistor and flat panel display applications.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.676-680
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• 2010

Most TCOs such as ITO, AZO(Al-doped ZnO), FTO(F-doped $SnO_2$) etc., which have been widely used in LCD, touch panel, solar cell, and organic LEDs etc. as transparent electrode material reveal n-type conductivity. But in order to realize transparent circuit, transparent p-n junction, and introduction of transparent p-type materials are prerequisite. Additional prerequisite condition is optical transparency in visible spectral region. Oxide based materials usually have a wide optical bandgap more than ~3.0 eV. In this study, single-phase transparent semiconductor of $SrCu_2O_2$, which shows p-type conductivity, have been synthesized by 2-step solid state reaction at $950^{\circ}C$ under $N_2$ atmosphere, and single-phase $SrCu_2O_2$ thin films of p-type TCOs have been deposited by RF magnetron sputtering on alkali-free glass substrate from single-phase target at $500^{\circ}C$, 1% $H_2$/(Ar + $H_2$) atmosphere. 3% $H_2$/(Ar + $H_2$) resulted in formation of second phases. Hall measurements confirmed the p-type nature of the fabricated $SrCu_2O_2$ thin films. The electrical conductivity, mobility of carrier and carrier density $5.27{\times}10^{-2}S/cm$, $2.2cm^2$/Vs, $1.53{\times}10^{17}/cm^3$ a room temperature, respectively. Transmittance and optical band-gap of the $SrCu_2O_2$ thin films revealed 62% at 550 nm and 3.28 eV. The electrical and optical properties of the obtained $SrCu_2O_2$ thin films deposited by RF magnetron sputtering were compared with those deposited by PLD and e-beam.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.156-157
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• 2012

단일 셀에서 비휘발성 및 고속의 휘발성 메모리를 모두 구동할 수 있는 다기능 메모리는 모바일 기기 및 embedded 장치의 폭발적인 성장에 있어 그 중요성이 커지고 있다. 따라서 최근 이러한 fusion기술을 응용한 unified RAM (URAM)과 같은 다기능 메모리의 연구가 주목 받고 있다. 이러한 다목적 메모리는 주로 silicon on insulator (SOI)기반의 1T-DRAM과 SONOS기술 기반의 비휘발성 메모리의 조합으로 이루어진다. 하지만 이런 다기능 메모리는 주로 단결정기반의 SOI wafer 위에서 구현되기 때문에 값이 비싸고 사용범위도 제한되어 있다. 따라서 이러한 다기능메모리를 다결정 실리콘을 이용하여 제작한다면 기판에 자유롭게 메모리 적용이 가능하고 추후 3차원 적층형 소자의 구현도 가능하기 때문에 다결정실리콘 기반의 메모리 구현은 필수적이라고 할 수 있겠다. 본 연구에서는 다결정실리콘을 이용한 channel recessed구조의 다기능메모리를 제작하였으며 각 1T-DRAM 및 NVM동작에 따른 memory 특성을 살펴보았다. 실험에 사용된 기판은 상부 비정질실리콘 100 nm, 매몰산화층 200 nm의 SOI구조의 기판을 이용하였으며 고상결정화 방법을 이용하여 $600^{\circ}C$ 24시간 열처리를 통해 결정화 시켰다. N+ poly Si을 이용하여 source/drain을 제작하였으며 RIE시스템을 이용하여 recessed channel을 형성하였다. 상부 ONO게이트 절연막은 rf sputter를 이용하여 각각 5/10/5 nm 증착하였다. $950^{\circ}C$ N2/O2 분위기에서 30초간 급속열처리를 진행하여 source/drain을 활성화 하였다. 계면상태 개선을 위해 $450^{\circ}C$ 2% H2/N2 분위기에서 30분간 열처리를 진행하였다. 제작된 Poly Si MFM에서 2.3V, 350mV/dec의 문턱전압과 subthreshold swing을 확인할 수 있었다. Nonvolatile memory mode는 FN tunneling, high-speed 1T-DRAM mode에서는 impact ionization을 이용하여 쓰기/소거 작업을 실시하였다. NVM 모드의 경우 약 2V의 memory window를 확보할 수 있었으며 $85^{\circ}C$에서의 retention 측정시에도 10년 후 약 0.9V의 memory window를 확보할 수 있었다. 1T-DRAM 모드의 경우에는 약 $30{\mu}s$의 retention과 $5{\mu}A$의 sensing margin을 확보할 수 있었다. 차후 engineered tunnel barrier기술이나 엑시머레이저를 이용한 결정화 방법을 적용한다면 device의 특성향상을 기대할 수 있을 것이다. 본 논문에서는 다결정실리콘을 이용한 다기능메모리를 제작 및 메모리 특성을 평가하였다. 제작된 소자의 단일 셀 내에서 NVM동작과 1T-DRAM동작이 모두 가능한 것을 확인할 수 있었다. 다결정실리콘의 특성상 단결정 SOI기반의 다기능 메모리에 비해 낮은 특성을 보여주었으나 이는 결정화방법, high-k절연막 적용 및 engineered tunnel barrier를 적용함으로써 해결 가능하다고 생각된다. 또한 sputter를 이용하여 저온증착된 O/N/O layer에서의 P/E특성을 확인함으로써 glass위에서의 MFM구현의 가능성도 확인할 수 있었으며, 차후 system on panel (SOP)적용도 가능할 것이라고 생각된다.

• Journal of the Korean Society for Railway
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• v.11 no.4
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• pp.357-363
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• 2008

This study investigates the durability of carbon/epoxy composites for use on train car bodies under a salt water spray environment. Salt water solution with 5% NaCl, similar to natural salt water, was used for the salt water environmental tests. The specimens were obtained from a composite panel consisting of an epoxy matrix reinforced with T700 carbon fabric. The specimens were exposed to the salt water environment for up to 12 months. Mechanical tests were performed to obtain tensile properties, flexural properties, and shear properties. Dynamic mechanical analysis was used to measure such thermal properties as storage modulus, loss modulus, and tan $\delta$. Also FT/IR tests were conducted to investigate changes in chemical structure with exposure. The results revealed that fiber-dominated mechanical properties were not affected much by exposure time, but matrix-dominated mechanical properties decreased with increasing exposure time. Storage modulus was not very sensitive to exposure time, but glass transition temperature was affected, slightly decreasing with increasing exposure time. Although the peak intensity of FT/IR curves was affected slightly by exposure time, the peak shape and peak location of FT/IR curves were not noticeably changed. Carbon/epoxy composites used for this study were relatively stable to the salt water environment.

• Applied Chemistry for Engineering
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• v.16 no.6
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• pp.742-748
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• 2005

Transparent conductive indium-tin oxide (ITO) films are widely used as transparent electrodes for flat panel displays. Many of the ITO films for practical use have been prepared by magnetron sputtering, chemical vapor deposition, electron beam evaporation, etc. An oxide target composed of 10 wt% $SnO_2$ and 90 wt% $In_2O_3$ has been deposited onto polycyclic olefin polymer (POP) substrate by electron beam evaporation. POP has a higher glass transition temperature ($Tg=330^{\circ}C$) than other conventional polymers. In this study, the effects of substrate temperature and the $O_2$ introduction flow rate were investigated in terms of physical, electrical and optical properties of deposited ITO films. We investigated the effects of processing variables such as substrate temperature and the oxygen introduction flow rate. The best electrical and optical properties of deposited ITO films obtained from this study were electrical resistivity value of ${\rho}=1.78{\times}10^{-3}{\Omega}{\cdot}cm$ and optical transmittance of about 85% at 8 sccm (Standard Cubic Centimeter per Minute) $O_2$ introduction flow rate, $5{\AA}/sec$ deposition rate, $1000{\AA}$ deposited ITO thickness and $200^{\circ}C$ substrate temperature.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.