• 제목/요약/키워드: gallium-nitride(GaN)

검색결과 142건 처리시간 0.03초

A 6-16 GHz GaN Distributed Power Amplifier MMIC Using Self-bias

  • Park, Hongjong;Lee, Wonho;Jung, Joonho;Choi, Kwangseok;Kim, Jaeduk;Lee, Wangyong;Lee, Changhoon;Kwon, Youngwoo
    • Journal of electromagnetic engineering and science
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    • 제17권2호
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    • pp.105-107
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    • 2017
  • The self-biasing circuit through a feedback resistor is applied to a gallium nitride (GaN) distributed power amplifier (PA) monolithic microwave circuit (MMIC). The self-biasing circuit is a useful scheme for biasing depletion-mode compound semiconductor devices with a negative gate bias voltage, and is widely used for common source amplifiers. However, the self-biasing circuit is rarely used for PAs, because the large DC power dissipation of the feedback resistor results in the degradation of output power and power efficiency. In this study, the feasibility of applying a self-biasing circuit through a feedback resistor to a GaN PA MMIC is examined by using the high operation voltage of GaN high-electron mobility transistors. The measured results of the proposed GaN PA are the average output power of 41.1 dBm and the average power added efficiency of 12.2% over the 6-16 GHz band.

GaN FET의 과도특성 파라미터 추출 및 평가 (Transient-State Parameter Extraction and Evaluation of GaN FET)

  • 안정훈;이병국;김남준;김종수
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2013년도 추계학술대회 논문집
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    • pp.192-193
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    • 2013
  • 본 논문에서는 WBG(Wide Band Gap)특성을 갖는 GaN FET의 과도특성을 분석한다. 먼저, GaN(Gallium Nitride) FET의 공개된 정보를 바탕으로 스위칭 과도 특성과 관련된 파라미터들을 정량적으로 추출하고, GaN FET의 동특성을 반영하는 시뮬레이션 모델을 구성한다. 이 모델을 통하여 Si MOSFET과 비교하여 GaN FET의 성능을 예측한다.

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차세대 파워디바이스 SiC/GaN의 산업화 및 학술연구동향 (Commercialization and Research Trends of Next Generation Power Devices SiC/GaN)

  • 조만;구영덕
    • 에너지공학
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    • 제22권1호
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    • pp.58-81
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    • 2013
  • 탄화규소(SiC)나 질화갈륨(GaN)과 와이드갭 반도체를 이용한 전력소자의 생산기술이 크게 발전하여 그간 널리 사용되어 온 실리콘(Si) 전력소자와 비교하여 작동전압, 스위칭 속도 및 on-저항 등이 크게 향상되어 몇 개 기업은 제품화를 시작하였다. 내압 등 기술적 과제 등을극복하여 산업화를 하고자하는 움직임을 소개하고 아울러 연구동향도 분석한다.

Pt-AlGaN/GaN HEMT-based hydrogen gas sensors with and without SiNx post-passivation

  • Vuong, Tuan Anh;Kim, Hyungtak
    • 전기전자학회논문지
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    • 제23권3호
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    • pp.1033-1037
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    • 2019
  • GaN-based sensors have been widely investigated thanks to its potential in detecting the presence of hydrogen. In this study, we fabricated hydrogen gas sensors with AlGaN/GaN heterojunction and investigated how the sensing performance to be affected by SiN surface passivation. The gas sensor employed a high electron mobility transistors (HEMTs) with 30 nm platinum catalyst as a gate to detect the hydrogen presence. SiN layer was deposited by inductively-coupled chemical vapor deposition as post-passivation. The sensors with SiN passivation exhibited hydrogen sensing characteristics with various gas flow rates and concentrations of hydrogen in inert background gas at $200^{\circ}C$ similar to the ones without passivation. Aside from quick response time for both sensors, there are differences in sensitivity and recovery time because of the existence of the passivation layer. The results also confirmed the dependence of sensing performance on gas flow rate and gas concentration.

극한 환경용 반도체 기술 동향 (Technical Trends of Semiconductors for Harsh Environments)

  • 장우진;문재경;이형석;임종원;백용순
    • 전자통신동향분석
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    • 제33권6호
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    • pp.12-23
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    • 2018
  • In this paper, we review the technical trends of diamond and gallium oxide ($Ga_2O_3$) semiconductor technologies among ultra-wide bandgap semiconductor technologies for harsh environments. Diamond exhibits some of the most extreme physical properties such as a wide bandgap, high breakdown field, high electron mobility, and high thermal conductivity, yet its practical use in harsh environments has been limited owing to its scarcity, expense, and small-sized substrate. In addition, the difficulty of n-type doping through ion implantation into diamond is an obstacle to the normally-off operation of transistors. $Ga_2O_3$ also has material properties such as a wide bandgap, high breakdown field, and high working temperature superior to that of silicon, gallium arsenide, gallium nitride, silicon carbide, and so on. In addition, $Ga_2O_3$ bulk crystal growth has developed dramatically. Although the bulk growth is still relatively immature, a 2-inch substrate can already be purchased, whereas 4- and 6-inch substrates are currently under development. Owing to the rapid development of $Ga_2O_3$ bulk and epitaxy growth, device results have quickly followed. We look briefly into diamond and $Ga_2O_3$ semiconductor devices and epitaxy results that can be applied to harsh environments.

고입력 내성을 위한 GaN HEMT 기반 S-대역 저잡음 증폭기 (S-Band Low Noise Amplifier Based on GaN HEMT for High Input Power Robustness)

  • 김홍희;김상훈;최진주;최길웅;김형주
    • 한국전자파학회논문지
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    • 제26권2호
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    • pp.165-170
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    • 2015
  • 본 논문에서는 GaAs 기반 저잡음 증폭기가 사용되고 있는 레이더 수신기의 잡음지수를 낮추고, 저잡음 증폭기의 강인성(robustness)을 위하여 GaN HEMT 기반의 저잡음 증폭기를 설계하고 측정하였다. GaAs 기반의 저잡음 증폭기를 사용하는 레이더 수신기의 경우, 맨 앞단에 저잡음 증폭기를 보호하기 위한 리미터(limiter)가 필요하고, 이는 레이더 수신기 전체 잡음지수를 나빠지게 한다. 본 연구에서 측정한 GaN 기반 저잡음 증폭기의 잡음지수는 2 dB 이하로 측정되었다. 상용화된 GaAs 기반 저잡음 증폭기의 경우, 최대 입력 전력은 약 30 dBm인 반면 본 연구에서는 입력 전력이 43 dBm일 때 소자가 번아웃(burn-out)되었고, 전류 제한 모드로 동작시킬 경우 45.4 dBm에서도 강인성이 보장되었다.

Surface Analysis of Plasma Pretreated Sapphire Substrate for Aluminum Nitride Buffer Layer

  • Jeong, Woo Seop;Kim, Dae-Sik;Cho, Seung Hee;Kim, Chul;Jhin, Junggeun;Byun, Dongjin
    • 한국재료학회지
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    • 제27권12호
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    • pp.699-704
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    • 2017
  • Recently, the use of an aluminum nitride(AlN) buffer layer has been actively studied for fabricating a high quality gallium nitride(GaN) template for high efficiency Light Emitting Diode(LED) production. We confirmed that AlN deposition after $N_2$ plasma treatment of the substrate has a positive influence on GaN epitaxial growth. In this study, $N_2$ plasma treatment was performed on a commercial patterned sapphire substrate by RF magnetron sputtering equipment. GaN was grown by metal organic chemical vapor deposition(MOCVD). The surface treated with $N_2$ plasma was analyzed by x-ray photoelectron spectroscopy(XPS) to determine the binding energy. The XPS results indicated the surface was changed from $Al_2O_3$ to AlN and AlON, and we confirmed that the thickness of the pretreated layer was about 1 nm using high resolution transmission electron microscopy(HR-TEM). The AlN buffer layer deposited on the grown pretreated layer had lower crystallinity than the as-treated PSS. Therefore, the surface $N_2$ plasma treatment on PSS resulted in a reduction in the crystallinity of the AlN buffer layer, which can improve the epitaxial growth quality of the GaN template.

DC and RF Analysis of Geometrical Parameter Changes in the Current Aperture Vertical Electron Transistor

  • Kang, Hye Su;Seo, Jae Hwa;Yoon, Young Jun;Cho, Min Su;Kang, In Man
    • Journal of Electrical Engineering and Technology
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    • 제11권6호
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    • pp.1763-1768
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    • 2016
  • This paper presents the electrical characteristics of the gallium nitride (GaN) current aperture vertical electron transistor (CAVET) by using two-dimensional (2-D) technology computer-aided design (TCAD) simulations. The CAVETs are considered as the alternative device due to their high breakdown voltage and high integration density in the high-power applications. The optimized design for the CAVET focused on the electrical performances according to the different gate-source length ($L_{GS}$) and aperture length ($L_{AP}$). We analyze DC and RF parameters inducing on-state current ($I_{on}$), threshold voltage ($V_t$), breakdown voltage ($V_B$), transconductance ($g_m$), gate capacitance ($C_{gg}$), cut-off frequency ($f_T$), and maximum oscillation frequency ($f_{max}$).

Large Signal Determination of Non-Linear Output Capacitance of Gallium-Nitride Field Effect Transistors from Switch-Off Voltage Transients - A Numerical Method

  • Pentz, David;Joannou, Andrea
    • Journal of Power Electronics
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    • 제18권6호
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    • pp.1912-1919
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    • 2018
  • The output capacitance of power semiconductor devices is important in determining the switching losses and in the operation of some resonant converter topologies. Thus, it is important to be able to accurately determine the output capacitance of a particular device operating at elevated power levels so that the contribution of the output capacitance discharge to switch-on losses can be determined under these conditions. Power semiconductor switch manufacturers usually measure device output capacitance using small-signal methods that may be insufficient for power switching applications. This paper shows how first principle methods are applied in a novel way to obtain more relevant large signal output capacitances of Gallium-Nitride (GaN) FETs using the drain-source voltage transient during device switch-off numerically. A non-linear capacitance for an increase in voltage is determined with good correlation. Simulations are verified using experimental results from two different devices. It is shown that the large signal output capacitance as a function of the drain-source voltage is higher than the small signal values published in the data sheets for each of the devices. It can also be seen that the loss contribution of the output capacitance discharging in the channel during switch-on correlates well with other methods proposed in the literature, which confirms that the proposed method has merit.

(0001), (10${\bar{1}}$2)와 (11${\bar{2}}$0) Sapphire 기판에서 Gallium Nitribe 단결정 박막의 성장 (Single Crystal Growing of Gallium Nitride Films on (0001), (10${\bar{1}}$2) and(11${\bar{2}}$0) Sappire)

  • 황진수;알렉산
    • 한국결정학회지
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    • 제5권1호
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    • pp.24-32
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    • 1994
  • (0001),(1012) 및 (1120)면 sapphire 기판위에 성장되는 (0001), (1120) 및 (1011)면 GaN epitaxy 박막을 Ga/HCI/NH3/He 계를 사용한 HVPE(halide vapor phase epitaxy)방법에 의하여 성장시키는 연구를 수행하였다. 박막의 표면조직과 결정구조는 XRD, RHEED와 SEM으로 분석하였으며, 성장된 막의 화학적 조성은 XPS로 관찰되었다. (1120) sapphire위에는 각각 (0001)과 (1120) GaN epitaxy 박막의 두가지 배향관계가 관찰되었다. (0001)면 GaN epitaxy 박막은 (0001)과 (1120)면 sapphire 기판위에서 1050℃ 의 고온으로 성장시킬 때 이차원적인 성장구조를 보여주였으며, (1120) sapphire 기판위에 성장된 (1011) GaN 박막이 주사전자현미경과 RHEED 분석결과 가장 좋은 표면조직과 결정구조를 보여주었다.

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