• Journal of Power Electronics
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• 제9권1호
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• pp.36-42
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• 2009

This paper presents a review of an improved high power-high frequency III-V wide bandgap (WBG) semiconductor device, Gallium Nitride (GaN). The device offers better efficiency and thermal management with higher switching frequency. By having higher blocking voltage, GaN can be used for high voltage applications. In addition, the weight and size of passive components on the printed circuit board can be reduced substantially when operating at high frequency. With proper management of thermal and gate drive design, the GaN power converter is expected to generate higher power density with lower stress compared to its counterparts, Silicon (Si) devices. The main contribution of this work is to provide additional information to young researchers in exploring new approaches based on the device's capability and characteristics in applications using the GaN power converter design.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.248.2-248.2
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• 2014

In this study, the optical properties and structural characteristics of gallium nitride (GaN) thin films prepared by radio frequency (RF) magnetron sputtering were investigated. Auger electron and X-ray photoelectron spectra showed that the deposited films consisted mainly of gallium and nitrogen. The presence of oxygen was also observed. The optical bandgap of the GaN films was measured to be approximately 3.31 eV. The value of the refractive index of the GaN films was found to be 2.36 at a wavelength of 633 nm. X-ray diffraction data revealed that the crystalline phase of the deposited GaN films changed from wurtzite to zinc-blende phase upon decreasing the sputtering gas pressure. Along with the phase change, a strong dependence of the microstructure of the GaN films on the sputtering gas pressure was also observed. The microstructure of the GaN films changed from a voided columnar structure having a rough surface to an extremely condensed structure with a very smooth surface morphology as the sputtering gas pressure was reduced. The relationship between the phase and microstructure changes in the GaN films will be discussed.

• 자원리싸이클링
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• 제29권1호
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• pp.81-88
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• 2020

발광다이오드는 많은 양의 갈륨과 인듐을 함유하고 있어, 폐발광다이오드로부터 이들 원소의 회수는 최근 많은 관심을 받은 연구 분야이다. 본 연구에서는 폐발광다이오드에 포함된 질화갈륨으로부터 갈륨과 인듐을 회수하고자 시도하였다. 전체 공정은 물성분석, 알칼리배소, 침출의 세 단계로 구성되었다. 화학성분 분석결과 폐발광다이오드의 경우, 70.32% 갈륨, 5.31% 규소, 2.27% 알루미늄 및 2.07% 인듐이 함유됨을 확인하였다. 두 번째 단계인 알칼리배소 공정은 탄산나트륨과 함께, 900℃하에서 3시간의 반응이 최적 조건인 것으로 확인되었고, 이 공정을 통해 질화갈륨이 질화산화물로 변화되었다. 마지막은 침출 단계로서, 산의 종류 및 농도, 고액비, 반응시간에 따른 변화를 조사하여, 최적조건을 확립하였다. 최적조건은 반응온도 25℃ 및 2.0 M의 염산 환경에서 30 ml/g의 고액비와 반응시간 32분으로 나타났으며, 그 때의 침출 효율은 갈륨 96.88%와 인듐 96.61%로 나타났다.

• 한국결정학회지
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• 제9권2호
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• pp.131-137
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• 1998

결정결함의 밀도가 낮은 GaN epitaxy 막을 MOCVD(metal organic chemical vapour deposition) 방법에 의해 성장시켰다. 기판은 6H-SiC를 사용하였으며, AlN과 GaN으로 구성된 이중 buffer 층을 도입하였다. GaN buffer 층은 반응원료인 trimethyl gallium(TMG)과 NH3 가스를 교호식펄스공급(alternating pulsative supply, APS)방법에 의해 만들었다. AlN buffer/6H-SiC 위에 초기단계에 형성되는 GaN 섬은 APS처리에 의해 크기가 커지는 것을 AFM(atomic force microscope)으로 관찰하였다. Buffer 층의 역할은 그 위에 성막시킨 GaN epitaxy 막의 결정성과 결함밀도에 의해 조사하였다. 성막된 GaN의 결정구조와 결정성은 DCXRD(double crystal X-ray diffractormeter)에 의해 측정되었다. 결정결함은 EPD(etching pit density)를 측정하는 방법으로 알칼리혼합용에서 처리된 막을 SEM(scanning electron microscope)으로 관찰하였다.

• Electronic Materials Letters
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• 제14권6호
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• pp.784-792
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• 2018

In this letter, a standard deviation based optimization technique has been applied on High Resolution X-ray Diffraction symmetric and asymmetric scan results to accurately determine the Aluminum molar fraction and lattice relaxation of Molecular Beam Epitaxy grown compositionally graded Aluminum Gallium Nitride (AlGaN)/Aluminum Nitride/Gallium Nitride (GaN) heterostructures. Mathews-Blakeslee critical thickness model has been applied in an alternative way to determine the partially relaxed AlGaN epilayer thicknesses. The coupling coefficient determination has been presented in a different perspective involving sample tilt method by off set between the asymmetric planes of GaN and AlGaN. Sample tilt is further increased to determine mosaic tilt ranging between $0.01^{\circ}$ and $0.1^{\circ}$.

• International Journal of Internet, Broadcasting and Communication
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• 제12권2호
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• pp.30-36
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• 2020

We demonstrated a successful fabrication of 4" Gallium Nitride (GaN)/Diamond High Electron Mobility Transistors (HEMTs) incorporated with Inner Slot Via Hole process. We made in manufacturing technology of 4" GaN/Diamond HEMT wafers in a compound semiconductor foundry since reported [1]. Wafer thickness uniformity and wafer flatness of starting GaN/Diamond wafers have improved greatly, which contributed to improved processing yield. By optimizing Laser drilling techniques, we successfully demonstrated a through-substrate-via process, which is last hurdle in GaN/Diamond manufacturing technology. To fully exploit Diamond's superior thermal property for GaN HEMT devices, we include Aluminum Nitride (AlN) barrier in epitaxial layer structure, in addition to conventional Aluminum Gallium Nitride (AlGaN) barrier layer. The current collapse revealed very stable up to Vds = 90 V. The trapping behaviors were measured Emission Microscope (EMMI). The traps are located in interface between Silicon Nitride (SiN) passivation layer and GaN cap layer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제16회 학술발표회 논문개요집
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• pp.84-84
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• 1998

• 한국진공학회:학술대회논문집
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• 한국진공학회 1995년도 제9회 학술발표회 논문개요집
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• pp.50-50
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• 1995

• 전자공학회지
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• 제42권1호
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• pp.28-37
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• 2015

• 전기학회논문지
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• 제65권10호
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• pp.1664-1671
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• 2016

This paper presents the analysis of the gate-source voltage of the gallium nitride high electronic mobility transistor (GaN HEMT) in the half bridge structure focused on the mutual effects of two switching operation. Especially low side gate-source voltage is analyzed mathematically according to the high side switch turn-on and turn-off operation. Moreover, the influence of each gate resistance and parasitic component on the switching characteristic of other side switch is investigated, and the formula, simulation and experimental results are compared with theoretical data.