• 한국공작기계학회논문집
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• 제16권6호
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• pp.181-186
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• 2007

UBM (Under Bump Metallurgy) of flip chip assemblies consists of several layers such as the solder wetting, the diffusion barrier, and the adhesion layers. In addition, IMC layers are formed between the solder wetting layers (e.g. Cu, Ni) and the solder. The primary failure mechanism of the solder joints in flip chips is widely known as the fatigue failure caused by thermal fatigues or electromigration damages. Sometimes, the premature brittle failure occurs in the IMC layers. However, these phenomena have thus far been viewed from only experimental investigations. In this sense, this paper presents a method for solid modeling of IMC layers in flip chip assemblies, thus providing a pre-processing tool for finite element analysis to simulate the IMC failure mechanism. The proposed modeling method is CSG-based and can also be applied to the modeling of UBM structure in flip chip assemblies. This is done by performing Boolean operations according to the actual sequences of fabrication processes

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 수산해양기술연구
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• 제52권4호
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• pp.308-317
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• 2016

The tail flip of the decapod shrimp is a main feature in escaping behavior from the mesh of the codend in the trawl. The characteristics of tail flip in target prawn was observed and analyzed in a water tunnel in respect of flow condition and mesh penetration by a high speed video camera (500 fps). The tail bending angle or bending time in static water was significantly different than in flow water (0.7 m/s) and resultantly the angular velocity in static water was significantly higher than in flow water when carapace was fixed condition. When escaping through vertical traverse net panel in water flow the relative moving angle and relative passing angle to flow direction during tail flip, it significantly decreases the number of shrimps escaping than the case of blocking shrimp. The bending angles of tail flip between net blocking and passing through mesh were not significantly different while the bending time of shrimp passing through mesh was significantly longer than when shrimp blocking on the net. Accordingly the angular velocity of passing through mesh was significantly slower than blocking on the net although the angular velocity of the tail flip was not significantly related with carapace length. The main feature of tail flip for mesh penetration was considered as smaller diagonal direction as moving and passing angle in relation to net panel as right angle to flow direction rather than the angular velocity of tail flip.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2011년도 추계학술논문집 2부
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• pp.413-416
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• 2011

Flip top cap은 경량성, 가공성, 내식성 우수하여 최근에 생활 용기 뚜껑으로 많이 활용되고 있다. Flip top cap은 사출성형에 의해 제작 되며 사출성형 과정에서 힌지부분에 웰드라인(Weldline)이 형성되어 기계적 강도가 떨어지게 된다. Flip top cap은 생활용기에 사용되며 실제생활에서 많은 작동을 요구하기 때문에 힌지부분의 웰드라인은 제품불량에 큰 원인이 된다. 또한 Flip top cap은 생산성을 높이기 위해 멀티캐비티(Multi-cavity) 사출방식을 선호한다. 멀티캐비티 방식은 높은 사출압력을 요구하기 때문에 사출품의 불량과 사출기에 많은 부하가 예상된다. 본 연구에서는 게이트 위치를 조정함으로써 사출품 힌지부분에서 발생할 수 있는 웰드라인을 품질에 영향이 없는 곳으로 이동시키고 최적의 사출 압력을 찾기 위한 유동해석을 통해 최적의 사출조건을 도출함으로써 Flip top cap의 기계적 품질과 제품생산성 향상을 위한 연구가 수행되었다.

• 전기전자학회논문지
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• 제8권1호
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• pp.47-53
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• 2004

본 논문에서는 3치 논리 게이트를 바탕으로 하는 3치 데이터 처리를 위한 3치 flip-flop을 설계하였다. 제안한 flip-flop들은 3치 전압 모드 NMAX, NMIN, INVERTER 게이트를 사용하여 설계하였다. 또한 CMOS 기술을 사용하였고 다른 게이트들 보다 낮은 공급 전압과 낮은 전력소모 특성을 포함하고 있다. 제안한 회로는 0.35um 표준 CMOS 공정에서 설계되었고 3.3v의 공급 전압원을 사용하였다. 제안된 3치 flip-flop 구조는 3치 논리 게이트를 사용하여 VLSI 구현에 적합하고 높은 모듈성의 장점을 갖고 있다.

• 한국생산제조학회지
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• 제24권1호
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• pp.117-123
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• 2015

The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.

• 반도체공학회 논문지
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• 제1권1호
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• pp.14-22
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• 2023

본 논문에서는 dual change-sensing 기법을 사용하여 내부 노드 변환을 최소화시킨 저전력 플립플롭 회로를 제안한다. 제안하는 Dual Change-Sensing Flip-Flop(DCSFF)은 데이터 변환이 존재하지 않는 경우, 기존에 존재하던 플립플롭들 중 동적 전력 소모가 가장 낮다. 65nm CMOS 공정을 사용한 측정 결과에 따르면, conventional Transmission Gate Flip-Flop(TGFF)와 비교하여 data activity 가 0% 와 100% 일때, 각각 98%와 32%의 감소된 전력 소모를 보였다. 또한 Change-Sensing Flip-lop(CSFF)과 비교하여 제안하는 DCSFF 는 30% 의 낮은 전력 소모를 보였다.

• Asian-Australasian Journal of Animal Sciences
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• 제23권3호
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• pp.401-409
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• 2010

FLICE inhibitory protein (FLIP) is one of the important anti-apoptotic proteins in the Fas/FasL apoptotic path which has death effect domains, mimicking the pro-domain of procaspase-8. To reveal the intracellular signal transduction molecules involved in the process of follicular development in the bovine ovary, we cloned the c-FLIP(L) gene in bovine ovary tissue with the reverse transcription polymerase chain reaction (RT-PCR), deleted the termination codon in its cDNA, and directionally cloned the amplified c-FLIP(L) gene into eukaryotic expression vector pAcGFP-Nl, including AcGFP, and successfully constructed the fusion protein recombinant plasmid. After identifying by restrictive enzyme BglII/EcoRI and sequencing, pAcGFP-bFLIP(L) was then transfected into follicular granulosa cells, mediated by Lipofectamine 2000, the expression of AcGFP observed and the transcription and expression of c-FLIP(L) detected by RT-PCR and Western blot. The results showed that the cattle c-FLIP(L) was successfully cloned; the pAcGFPbFLIP(L) fusion protein recombinant plasmid was successfuly constructed by introducing a BglII/EcoRI cloning site at the two ends of the c-FLIP(L) open reading frame and inserting a Kozak sequence before the start codon. AcGFP expression was detected as early as 24 h after transfection. The percentage of AcGFP positive cells reached about 65% after 24 h. A 1,483 bp transcription was amplified by RT-PCR, and a 83 kD target protein was detected by Western blot. Construction of the pAcGFP-bFLIP(L) recombinant plasmid should be helpful for further understanding the mechanism of regulation of c-FLIP(L) on bovine oocyte formation and development.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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• pp.7-38
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• 2000

Performance, reliability, form factor drive flip chip use. BGAs and CSPs will provide stepping stone to FC DCA .Growing vendor infrastructure - Low cost, high density organic substrates -New generations of fluxes and underfills .Adhesives flip chip technology as a low cost flip chip alternatives -Low cost Au stud or Electroless Ni bumps -Reliable thermal cycling and electrical performance.