• Journal of Digital Contents Society
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• v.18 no.3
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• pp.577-584
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• 2017

Despite growing participation of many researchers, the cases of applying the transformative emotional display technology using physical materials and media are still in its early stages and the concept and structure are not properly established in Korea. The emerging global trend of physical display shows a possibility of new digital signage using emotional flip display. In this context, this study attempts to develop related element technology necessary in physical flip display and electromagnetic rotation module along with the integration platform of aesthetic arbitrarily-shaped display. The found results will be applied in researching the contents for the main subject which will be exhibited at the EXPO 2017 in Astana. It is to build up the foundation pioneering the localization of associated industry by means of diverse technological breakthroughs including flip-display technology, electromagnetic module technology, real-time video inter-working technology, high-speed rotation module technology, and transformative 3D frame technology.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• Journal of Animal Science and Technology
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• v.48 no.6
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• pp.949-956
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• 2006

The development of flip-graft, yield of antler and growth of antler in Sika deer, Red deer and Elk were investigated to establish the technology of transplantation of flip-graft. Pedicle flip-grafts were transplanted on the sides pedicle, on the midline of forehead and on the middle line of the skull. The success rate of transplantation was 42％, 5 animals out of 12. The yields of antler and number of point were 716g and 1,071g, and 2.3 and 1.0 in control and donor of flip-graft, respectively in red deer. The length and weight of anther of recipient of flip-graft in elk were 17cm, 302g. The length and weight of hard antler of recipient of flip-graft in red deer were 26cm and 122g. Flip-graft should be transplanted on the scull after removal of the corium for strong adherence.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.8 s.338
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• pp.43-52
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• 2005

An prescaler which uses PLL(Phase Locked Loop) must satisfy high speed operation and low power consumption. Thus the performance or TSPC(True Single Phase Clocked) D-flip flops which is applied at Prescaler is very important. Power consumption of conventional TSPC D-flip flops was increased with glitches from output and unnecessary discharge at internal node in precharge phase. We proposed a new D-flip flop which reduced two clock transistors for precharge and discharge Phase. With inserting a new PMOS transistor to the input stage, we could prevent from unnecessary discharge in precharge phase. Moreover, to remove the glitch problems at output, we inserted an PMOS transistor in output stage. The proposed flip flop showed stable operations as well as low power consumption. The maximum frequency of prescaler by applying the proposed D-flip flop was 2.92GHz and achieved power consumption of 10.61mw at 3.3V. In comparison with prescaler applying the conventional TSPC D-flip $flop^[6]$, we obtained the performance improvement of $45.4\%$ in the view of PDP(Power-Belay-Product).

• Journal of Korea Entertainment Industry Association
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• v.13 no.4
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• pp.241-253
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• 2019

The purpose of this study was to examine the phenomena that occurred when the students were practicing flip-learning lessons and to present the good points and the unsatisfactory points to improve the students' learning pleasure. Therefore, it is aimed to provide the basic data and the advantages and disadvantages which are needed to apply the flip learning method which is newly emerging recently to the university instruction. The method of this study was a questionnaire survey to understand the perception of flip learning. Based on the results of this study, the following conclusions are presented. First, the experience of flip learning instruction was first encountered by 50% of college students. Second, the students showed a very low tendency in practicing the flip learning instruction(video watching) the instructor intended. Third, college students have a habit of learning that they are not ready for pre-study of the subject. Fourth, the perception of flip learning lesson through the provision of video was highly positive. Fifthly, flip learning lessons have the advantage of being able to learn regardless of the time and place that they have, but they are not actively involved if they are not actually reflected in the test or grades. In conclusion, it was found that college students became accustomed to the incentive-style lessons due to the application of various learning techniques from elementary school age, making it difficult to participate in voluntary learning.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.41-42
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.1309-1310
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.641-642
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.925-926
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.531-532
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• 2008