• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.470-470
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• 2013

Recently, active materials such as amorphous silicon (a-Si), poly crystalline silicon (poly-Si), transition metal oxide semiconductors (TMO), and organic semiconductors have been demonstrated for flexible electronics. In order to apply flexible devices on the polymer substrates, all layers should require the characteristic of flexibility as well as the low temperature process. Especially, pentacene thin film transistors (TFTs) have been investigated for probable use in low-cost, large-area, flexible electronic applications such as radio frequency identification (RFID) tags, smart cards, display backplane driver circuits, and sensors. Since pentacene TFTs were studied, their electrical characteristics with varying single variable such as strain, humidity, and temperature have been reported by various groups, which must preferentially be performed in the flexible electronics. For example, the channel mobility of pentacene organic TFTs mainly led to change in device performance under mechanical deformation. While some electrical characteristics like carrier mobility and concentration of organic TFTs were significantly changed at the different temperature. However, there is no study concerning multivariable. Devices actually worked in many different kinds of the environment such as thermal, light, mechanical bending, humidity and various gases. For commercialization, not fewer than two variables of mechanism analysis have to be investigated. Analyzing the phenomenon of shifted characteristics under the change of multivariable may be able to be the importance with developing improved dielectric and encapsulation layer materials. In this study, we have fabricated flexible pentacene TFTs on polymer substrates and observed electrical characteristics of pentacene TFTs exposed to tensile and compressive strains at the different values of temperature like room temperature (RT), 40, 50, $60^{\circ}C$. Effects of bending and heating on the device performance of pentacene TFT will be discussed in detail.

• Structural Engineering and Mechanics
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• v.77 no.2
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• pp.167-177
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• 2021

Due to various benefits such as unlimited degrees of freedom, environment adaptability, and safety for humans, engineers have used soft materials with hyperelastic behavior in various industrial, medical, rescue, and other sectors. One of the applications of these materials in the fabrication of bending soft actuators (SA) is that they have eliminated many problems in the actuators such as production cost, mechanical complexity, and design algorithm. However, SA has complexities, such as predicting and monitoring behavior despite the many benefits. The first part of this paper deals with the prediction of SA behavior through mathematical models such as Ogden and Darijani, and its comparison with the results of experiments. At first, by examining different geometric models, the cubic structure was selected as the optimal structure in the investigated models. This geometrical structure at the same pressure showed the most significant bending in the simulation. The simulation results were then compared with experimental, and the final gripper model was designed and manufactured using a 3D printer with silicone rubber as for the polymer part. This geometrical structure is capable of bending up to a 90-degree angle at 70 kPa in less than 2 seconds. The second section is dedicated to monitoring the bending behavior created by the strain sensors with different sensitivity and stretchability. In the fabrication of the sensors, silicon is used as a soft material with hyperelastic behavior and carbon fiber as a conductive material in the soft material substrate. The SA designed in this paper is capable of deforming up to 1000 cycles without changing its characteristics and capable of moving objects weigh up to 1200 g. This SA has the capability of being used in soft robots and artificial hand making for high-speed objects harvesting.

• Smart Structures and Systems
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• v.5 no.1
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• pp.23-42
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• 2009

In order to reduce vibration or to control shape of structures made of metal or composites, piezoelectric materials have been extensively used since their discovery in 1880's. A recent trend is also seen to apply piezoelectric materials to flexible structures made of rubber-like materials. In this paper a non-linear finite element model using updated Lagrangian (UL) approach has been developed for static analysis of rubber-elastic material with surface-bonded piezoelectric patches. A compressible stain energy function has been used for modeling the rubber as hyperelastic material. For formulation of the nonlinear finite element model a twenty-node brick element is used. Four degrees of freedom u, v and w and electrical potential ${\varphi}$ per node are considered as the field variables. PVDF (polyvinylidene fluoride) patches are applied as sensors/actuators or sensors and actuators. The present model has been applied to bimorph PVDF cantilever beam to validate the formulation. It is then applied to study the smart rubber components under different boundary and loading conditions. The results predicted by the present formulation are compared with the analytical solutions as well as the available published results. Some results are given as new ones as no published solutions available in the literatures to the best of the authors' knowledge.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.35-40
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• 2018

Nd:YAG laser was used to carbonize polyimide films to produce carbon films. This is a simple manufacturing process to fabricate low cost sensors. By applying this method, we studied characteristics of flexible and low-cost piezoresistive. Previously, many studies focused on carbonization of polyimide using $CO_2$ laser with wavelength of $10.6{\mu}m$. In this paper, carbonization (carbonization process) was performed on polyimide films using an Nd:YAG laser with a wavelength of $1.064{\mu}m$. In order to increase the resolution, we optimized the laser conditions of the power density ($W/cm^2$) and the beam scan rate. In previous studies using $CO_2$ laser, the minimum line width was $140{\sim}220{\mu}m$ but in this study, carbon line width was reduced to $35{\sim}40{\mu}m$. The initial sheet resistance of the carbon sensor was $100{\sim}300{\Omega}/{\square}$. The resistance decreased by 30% under stretched with a curvature radius of 21 R. The calculated gauge factor was 56.6. This work offers a simple, highly flexible, and low-cost process to fabricate piezoresistive sensors.

• Science of Emotion and Sensibility
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• v.25 no.4
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• pp.45-52
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• 2022

Recently, interest in and demand for sensors that recognize physical activity and their products are increasing. In particular, the development of wearable materials that are flexible, stretchable, and able to detect the user's biological signals is drawing attention. In this study, an experiment was conducted to improve the dip-coating efficiency of a single-walled carbon nanotube dispersion solution after fine holes were made in a hydrophobic material with a micro needle. In this study, dip-coating was performed with a material that was not penetrated, and comparative analysis was performed. The electrical conductivity of the sensor was measured when the sensor was stretched using a strain universal testing machine (Dacell Co. Ltd., Seoul, Korea) and a multimeter (Keysight Technologies, Santa Rosa, CA, USA) was used to measure resistance. It was found that the electrical conductivity of a sensor that was subjected to needling was at least 16 times better than that of a sensor that was not. In addition, the gauge factor was excellent, relative to the initial resistance of the sensor, so good performance as a sensor could be confirmed. Here, the dip-coating efficiency of hydrophobic materials, which have superior physical properties to hydrophilic materials but are not suitable due to their high surface tension, can be adopted to more effectively detect body movements and manufacture sensors with excellent durability and usability.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.129-135
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• 2018

In the stretchable electronic devices, the stretchable substrate is a very essential material which determines the stretchability, performances and durability of the stretchable electronic devices. In particular, the current stretchable materials have hysteresis making difficult to used as sensors and other electronic devices. In this study, we developed a PDMS-Ecoflex hybrid stretchable substrate mixed with PDMS and Ecoflex material in order to increase stretchability and improve hysteresis characteristics. Mechanical behavior of the hybrid substrate was evaluated using a tensile test, and optical transmittance of the hybrid substrate was also measured. As the content of Ecoflex increases, the PDMS-Ecoflex hybrid substrate becomes more flexible, and the elastic modulus decreases. In addition, the PDMS substrate failed a tensile strain of 270%, while the PDMS-Ecoflex hybrid substrate did not fail even at 500% strain indicating excellent stretchability. In the repeated tensile test, the hybrid substrate with 2:1 mixing ratio of PDMS and Ecoflex showed hysteresis. On the other hand, in the case of the hybrid substrate with the mixing ratio of 1:1, hysteresis did not occur at a strain of 50% and 100%. Hence, we developed a stretchable substrate with over 150% stretchability and no hysteresis characteristics. The optical transmittance of the Ecoflex substrate was 68.6%, whereas the transmittances of the hybrid substrate with mixing ratio of 2:1 and 1:1 were 78.6% and 75.4%, respectively. These results indicate that the PDMS-Ecoflex hybrid substrate is a potential candidate for a transparent stretchable substrate.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.