• Tribology and Lubricants
• /
• v.29 no.3
• /
• pp.143-148
• /
• 2013

In this study, several sensor parts used to obtain better signal stability are designed, a separate control circuit for the sensor is developed, and the results obtained using this control circuit are analyzed. The capacitances of the whole sensor system are measured using the control circuit connected to an improved flexible printed circuit board and an asymmetric dual sensor coated with a ceramic material. To realize good discrimination for a small change in the measured capacitance as the engine oil deteriorates, a commercial application-specific integrated circuit is installed on the control circuit as a capacitance-to-digital converter. The absolute error of a measured signal is found to be approximately ${\pm}4fF$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.04b
• /
• pp.150-152
• /
• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.1
• /
• pp.62-65
• /
• 2018

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

• ETRI Journal
• /
• v.35 no.1
• /
• pp.1-6
• /
• 2013

In this paper, we present an implemented serial 40-Gb/s receiver optical subassembly (ROSA) module by employing a proposed TO-CAN package and flexible printed circuit board (FPCB). The TO-CAN package employs an L-shaped metal support to provide a straight line signal path between the TO-CAN package and the FPCB. In addition, the FPCB incorporates a signal line with an open stub to alleviate signal distortion owing to an impedance mismatch generated from the soldering pad attached to the main circuit board. The receiver sensitivity of the ROSA module measures below -9 dBm for 40 Gb/s at an extinction ratio of 7 dB and a bit error rate of $10^{-12}$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.34 no.2
• /
• pp.90-98
• /
• 2021

Piezoelectric ceramic fiber composite (PCFC) was fabricated using a planar electrode printed piezoelectric ceramic fiber driven in transverse mode for small-scale wind energy harvester applications. The PCFC consisted of an epoxy matrix material and piezoelectric ceramic fibers sandwiched by interdigitated electrode (IDE) patterned polyimide films. The PCFC showed an excellent mechanical performance under a continuous stress. For the fabrication of PCB cantilever harvester, five -PCFCs were vertically attached onto a flexible printed circuit board (PCB) substrate, and then PCFCs were serially connected through a printed Cu circuit. The energy harvesting performance was evaluated applying an inverted structure, which imples its free leading edge located at an open end but the trailing edge at a clamped end, to enhance strain energy in a wind tunnel. The output voltage of the PCB cantilever harvester was increased as the wind speed increased. The maximum output power was 17.2 ㎼ at a resistance load of 200 ㏀ and wind speed of 9 m/s. It is considered that the PCB cantilever energy harvester reveals a potential use for wind energy harvester applications.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.63-67
• /
• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2007.10a
• /
• pp.761-764
• /
• 2007

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.

• Particle and aerosol research
• /
• v.6 no.3
• /
• pp.131-138
• /
• 2010

Flexible electronics are the electronics on flexible substrates such as a plastic, fabric or paper, so that they can be folded or attached on any curved surfaces. They are currently recognized as one of the most innovating future technologies especially in the area of portable electronics. The conventional vacuum deposition and photolithographic patterning methods are well developed for inorganic microelectronics. However, flexible polymer substrates are generally chemically incompatible with resists, etchants and developers and high temperature processes used in conventional integrated circuit processing. Additionally, conventional processes are time consuming, very expensive and not environmentally friendly. Therefore, there are strong needs for new materials and a novel processing scheme to realize flexible electronics. This paper introduces current research trends for flexible electronics based on (a) nanoparticles, and (b) novel processing schemes: nanomaterial based direct patterning methods to remove any conventional vacuum deposition and photolithography processes. Among the several unique nanomaterial characteristics, dramatic melting temperature depression (Tm, 3nm particle~$150^{\circ}C$) and strong light absorption can be exploited to reduce the processing temperature and to enhance the resolution. This opens a possibility of developing a cost effective, low temperature, high resolution and environmentally friendly approach in the high performance flexible electronics fabrication area.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.4
• /
• pp.79-85
• /
• 2007

This study was focused on the feasibility of ultrasonic bonding of Au stud flip chip bumps on the flexible printed circuit board (FPCB) with three different surface finishes: organic solderability preservative (OSP), electroplated Au and electroless Ni/immersion Au (ENIG). The Au stud flip chip bumps were successfully bonded to the bonding pads of the FPCBs, irrespective of surface finish. The bonding time strongly affected the joint integrity. The shear force increased with increasing bonding time, but the 'bridge' problem between bumps occurred at a bonding time over 2 s. The optimum condition was the ultrasonic bonding on the OSP-finished FPCB for 0.5 s.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.75-81
• /
• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.