Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Analysis of Surface Characteristics for Clad Thin Film Materials

극박형 복합재료 필름의 표면 물성 분석에 대한 연구

  • Lee, Jun Ha (Department of Electronics Engineering, Sangmyung University)
  • 이준하 (상명대학교 전자공학과)
  • Received : 2018.03.12
  • Accepted : 2018.03.22
  • Published : 2018.03.31
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Abstract

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

Keywords

References

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