1 |
H. Elahi, M. Eugeni, F. Fune, L. Lampani, F. Mastroddi, G. P. Romano, and P. Gaudenzi, Micromachines, 11, 933 (2020). [DOI: https://doi.org/10.3390/mi11100933]
DOI
|
2 |
M. Zhou, Q. Chen, Z. Xu, and W. Wang, AIP Adv., 9, 035213 (2019). [DOI: https://doi.org/10.1063/1.5082811]
DOI
|
3 |
W. J. Su and W. Y. Lin, Int. J. Mech. Sci., 173, 105457 (2020). [DOI: https://doi.org/10.1016/j.ijmecsci.2020.105457]
DOI
|
4 |
F. M. Gharghani, M. A. Bijarchi, O. Mohammadi, and M. B. Shafii, Int. J. Low-Carbon Tech., (In press). [DOI: https://doi.org/10.1093/ijlct/ctaa060]
DOI
|
5 |
J. D. Hobeck and D. J. Inman, Smart Mater. Struct., 21, 105024 (2012). [DOI: https://doi.org/10.1088/0964-1726/21/10/105024]
DOI
|
6 |
H. Liu, S. Zhang, T. Kobayashi, T. Chen, and C. Lee, Micro Nano Lett., 9, 286 (2014). [DOI: https://doi.org/10.1049/mnl.2013.0750]
DOI
|
7 |
D. Zhao, X. Hu, T. Tan, Z. Yan, and W. Zhang, Energy Convers. Manage., 222, 113260 (2020). [DOI: https://doi.org/10.1016/j.enconman.2020.113260]
DOI
|
8 |
J. Wang, L. Geng, S. Zhou, Z. Zhang, Z. Lai, and D. Yurchenko, Acta Mech. Sin., 36, 592 (2020). [DOI: https://doi.org/10.1007/s10409-020-00928-5]
DOI
|
9 |
L. Zhao and Y. Yang, Smart Struct. Syst., 19, 67 (2017). [DOI: https://doi.org/10.12989/sss.2017.19.1.067]
DOI
|
10 |
J. Liu, H. Zuo, W. Xia, Y. Luo, D. Yao, Y. Chen, K. Wang, and Q. Li, Microelectron. Eng., 231, 111333 (2020). [DOI: https://doi.org/10.1016/j.mee.2020.111333]
DOI
|
11 |
J.A.D.C. Dias, V.C.D. Sousa, A. Erturk, and C.D.M. Junior, Smart Mater. Struct., 29, 105006 (2020). [DOI: https://doi.org/10.1088/1361-665X/ab9add]
DOI
|
12 |
A. Mohammadnia, A. Rezania, B. M. Ziapour, F. Sedaghati, and L. Rosendahl, Energy Convers. Manage., 205, 112352 (2020). [DOI: https://doi.org/10.1016/j.enconman.2019.112352]
DOI
|
13 |
Y. Xie, S. Wang, S. Niu, L. Lin, Q. Jing, Y. Su, Z. Wu, and Z. L. Wang, Nano Energy, 6, 129 (2014). [DOI: https://doi.org/10.1016/j.nanoen.2014.03.015]
DOI
|
14 |
H. Mutsuda, S. Rahmawati, N. Taniguchi, T. Nakashima, and Y. Doi, Sustainable Energy Technol. Assess., 35, 160 (2019). [DOI: https://doi.org/10.1016/j.seta.2019.07.001]
DOI
|
15 |
E. Celik, E. Kurt, and N. Ozturk, Int. J. Electron., 107, 226 (2019). [DOI: https://doi.org/10.1080/00207217.2019.1643039]
DOI
|
16 |
http://ko.wikipedia.org/wiki/%ED%92%8D%EB%A0%A5_%EB%B0%9C%EC%A0%84 (2020).
|
17 |
W. Wang, X. He, X. Wang, M. Wang, and K. Xue, Sens. Actuators, A, 279, 467 (2018). [DOI: https://doi.org/10.1016/j.sna.2018.06.059]
DOI
|
18 |
J. Wang, S. Gu, C. Zhang, G. Hu, G. Chen, K. Yang, H. Li, Y. Lai, G. Litak, and D. Yurchenko, Energy Convers. Manage., 213, 112835 (2020). [DOI: https://doi.org/10.1016/j.enconman.2020.112835]
DOI
|
19 |
Y. Feng, L. Zhang, Y. Zheng, D. Wang, F. Zhou, and W. Liu, Nano Energy, 55, 260 (2019). [DOI: https://doi.org/10.1016/j.nanoen.2018.10.075]
DOI
|
20 |
W. Sun, Z. Ding, Z. Qin, F. Chu, and Q. Han, Nano Energy, 70, 104526 (2020). [DOI: https://doi.org/10.1016/j.nanoen.2020.104526]
DOI
|
21 |
M. Perez, S. Boisseau, P. Gasnier, J. Willemin, M. Geisler, and J. L. Reboud, Smart Mater. Struct., 25, 045015 (2016). [DOI: https://doi.org/10.1088/0964-1726/25/4/045015]
DOI
|
22 |
S. Ju, S. H. Chae, Y. Choi, and C. H Ji, Sens. Actuators, A, 226, 126 (2015). [DOI: https://doi.org/10.1016/j.sna.2015.02.025]
DOI
|
23 |
L. Nelson, C. Bowen, R. Stevens, M. Cain, and M. Stewart, Proc. Smart Structures and Materials 2003: Active Materials: Behavior and Mechanics (Smart Structures and Materials, San Diego, USA, 2003) p. 556. [DOI: https://doi.org/10.1117/12.484738]
DOI
|
24 |
P. K. Vallittu, J. Prosthet. Dent., 81, 318 (1999). [DOI: https://doi.org/10.1016/S0022-3913(99)70276-3]
DOI
|
25 |
Z. Lu, Q. Wen, X. He, and Z. Wen, Appl. Sci., 9, 4823 (2019). [DOI: https://doi.org/10.3390/app9224823]
DOI
|
26 |
B. Yan, N. Yu, L. Zhang, H. Ma, C. Wu, K. Wang, and S. Zhou, Smart Mater. Struct., 29, 025022 (2020). [DOI: https://doi.org/10.1088/1361-665x/ab62e1]
DOI
|
27 |
M. Bi, Z. Wu, S. Wang, Z. Cao, Y. Cheng, X. Ma, and X. Ye, Nano Energy, 75, 104968 (2020). [DOI: https://doi.org/10.1016/j.nanoen.2020.104968]
DOI
|