• Journal of Welding and Joining
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• v.33 no.3
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• Transactions of Materials Processing
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• v.21 no.8
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• pp.479-484
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• 2012

The objective of this study is to compensate the elastic recovery in the flexible forming process using the predictive models. The target shape was limited to two-dimensional shape having only one curvature radius in the longitudinal-direction. In order to predict the shape error the regression and neural network models were established based on the finite element (FE) simulations. A series of simulations were conducted considering input variables such as the elastic pad thickness, the thickness of plate, and the objective curvature radius. Then, at sampling points in the longitudinal-direction, the shape errors between formed and objective shapes could be calculated from the FE simulations as an output variable. These shape errors were expressed to a representative error value by the root mean square error (RMSE). To obtain the correct objective shape the die shape was adjusted by the closed-loop using the neural network model since the neural network model shows a higher capability of estimating the shape error than the regression model. Finally the experimental result shows that the formed shape almost agreed with the objective shape.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.6
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• pp.97-104
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• 2010

In this paper, ICT (in circuit tester) inspection system and inspection algorithm is proposed and detects whether inferiority exists or not in the mounted device on the flexible PCB in cell phones or mobile display devices. The system is composed of PD (pin-driver) and GGM (ground guarding method). The structural characteristics of these flexible PCB are analyzed, which is needed to input or output the test signal. Test signal to investigate the characteristics of passive components is generated using modified circuit diagram and proposed inspection algorithm. PM (pin-map) is decided on the basis of circuit diagram and has the information about the kind of test signal to be applied and the pad number for the test signal to be connected. PD is designed to load a proper test signal for a specific pad and is adjusted according to PM so that the reconstructed circuit has minimum node and mash. The proposed ICT inspection system is realized using PD and GGM. Using the system, an experiment for each passive component is done to investigate the measurement accuracy of the developed system and an experiment for real flexible PCB model is done to verity the effectiveness of the system.

• Elastomers and Composites
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• v.43 no.3
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• pp.173-182
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• 2008

Rubber-pad forming process for materials such as metal in which portions of the die which act upon the material is composed of a natural or synthetic rubber or elastomer material. This makes the rubber pad forming process relatively cheap and flexible, high accuracy for small product series in particular. In this study, we carried out the physical test and finite element analysis of elastomer such as natural rubber and urethane for steel rack rube forming. The non-linear property of elastomer which are described as strain energy function are important parameter to design and evaluate of elastomer component. These are determined by material tests which are uni-axial tension and bi-axial tension. This study is concerned with simulation and investigation of the significant parameters associated with this process.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.1-5
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• 2004

A multi-layer flexible substrate is composed of copper(Cu)/polyimide that are known as good electrical conductivity, and low dielectric constant, respectively. In this study. conductor line of $5{\mu}m$-pitch was successfully fabricated without non-uniform pattern shape by electroplating copper and coating polyimide on patterned stainless steel. For multi-layer flexible substrate, via holes were drilled by UV laser and filled with electroplating copper and tin. And then, the PI layer with vias and conductor lines was stripped from stainless steel substrate. The PI layers were laminated at once with careful alignment between layers. Solid state reaction between tin and copper during lamination formed the intermetallic compounds of $Cu_6Sn_5$($\eta$-phase) and $Cu_3Sn$($\epsilon$-Phase) and achieved a complete inter-connection by vertically positioning the plugged via holes on via pad. The via formation process has several advantages; such as better electrical property and lower cost than V type via and paste via.

• Proceedings of the Korean Geotechical Society Conference
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• 1999.03a
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• pp.241-248
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• 1999

The existing bridge with deck joint has many problems during construction and maintenance. To overcome these difficulties, an integral bridge, which is defined as the practice of constructing bridges without deck joints, is proposed in this study. A test bridge with 3 spans of PC beam was selected to verify the function of the bridge and is under construction. Characteristics of integral bridge are followings: $\circled1$ Flexible H-piles under the abutment are installed to accommodate thermal movements of the superstructures of bridge. $\circled2$ PC beam of the superstructure and the abutment are integrated. $\circled3$ The existing approach and relief slabs are applied to minimize the stress transfer occurred from the bridge deck to the pavement. $\circled4$ A cyclic control joint is installed between approach and relief slabs to absorb the thermal movement. $\circled5$ It is used a dual direction bearing which is cheaper than single direction bearing and has a good workability as well. It is also installed a shear block on the top of pier coping to protect the lateral movement caused by temperature change and earthquake.

• Structural Engineering and Mechanics
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• v.33 no.1
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• pp.47-66
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• 2009

Radiation damping due to wave propagation in unbounded domains may cause a significant reduction of structural vibrations when excited near resonance. Here a novel matrix-valued algebraic Pad$\acute{e}$-like stiffness formulation in the frequency-domain and a corresponding state equation in the time domain are elaborated for a soil-structure interaction problem with a layered soil excited in a transient manner by a flexible rotor during startup and shutdown. The contribution of radiation damping caused by a soil-layer upon a rigid bedrock is characterized by the corresponding amount of critical damping as it is used in structural dynamics.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.21-28
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• 2008

The final polishing process is based on slurry, pad, conditioner, equipment. Therefore, the concept of wafer final polishing is also necessary for repeatability of results between polished wafers. In this study, the machining conditions have a pressure, table speed, machining time and slurry ratio. This research investigated the surface characteristics that apply variable machining conditions and response surface methodology was used to obtain more flexible and optimumal condition base on Taguchi method. On the base of estimated response surface curvature from the equation and results of Taguchi method, combined design of experiment was considered to lead to optimumal condition. Finally, polished wafer was obtained mirror like surface.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.5
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• pp.502-515
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• 2020

To identify the dynamic characteristics of the Auto-leveling system applied to the Tractor-Trailer type Transporter for mounting a large scale precision equipment, Dynamics Modeling & Simulation were performed using general Dynamics Analysis Program - RecurDyn(V9R2). The axial load data, transverse load data and pad trace data of leveling actuators were obtained from M&S. And they were analyzed and compared with each other by parameters, i.e. friction coefficients on the ground, landing ram speed of actuators, and direction & quantity of ground slope. It was observed that ground contact friction coefficients affected to transverse load and pad trace; the landing ram speed of actuators to both amplitude of axial & transverse load, and this phenomena was able to explain from the frequency analysis of the axial load data; the direction of ground slope to driving sequence of landing ram of actuators. But the dynamic behaviors on the two-directional slope were very different from them on the one-directional slope and more complex.

• Journal of the Korean Society of Clothing and Textiles
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• v.42 no.4
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• pp.612-625
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• 2018

This study designed 16 kinds of basic structure and 4 kinds of modified structure for impact protection pads with a spacer fabric shape. The pad is a structure in which hexagonal three-dimensional units, composed of a surface layer and a spacer layer, are interconnected. Designed pads were printed with flexible $NinjaFlex^{(R)}$ materials using a FDM 3D printer. The printed pads were evaluated for impact protection performance, compression properties and sensory properties. The evaluation of the impact protection performance indicated that basic structures better than CR foam material at 20cm height were DV1.5, DX1.5, DX1.0, DV1.0 and HV1.5. The evaluation of the compression properties for the five types, with good results in the impact protection performance, indicated that DV1.0, DX1.0, DV1.5, HV1.5 and DX1.5 showed good results, respectively. The sensory evaluation of DV1.0, DX1.0, and DV1.5, which with good results when considering both the impact protection performance and the compression performance, showed that DV1.0 were the best for surface, flexibility, compression and weight. Therefore, DV1.0 is shown to be the best structure for protection pads.