• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.29-36
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• 2004

A flexible packaging scheme, which includes chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending tests and finite element analysis. Thinned silicon chips (t<30 $\mu\textrm{m}$) are fabricated by chemical etching process to avoid possible surface damages on them. And the chips are stacked directly on $Kapton^{Kapton}$film by thermal compressive bonding. The low height difference between the thinned silicon chip and $Kapton^{Kapton}$film allows electroplating for electrical interconnection method. Because the 'Chip' is embedded in the flexible substrate, higher packaging density and wearability can be achieved by maximized usable packaging area.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.3-4
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• 2004

A flexible Packaging scheme, which embedded chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips ($t<50{\mu}m$) are fabricated by chemical etching process to avoid possible surface damages on them. These technologies can be use for a real-time monitoring of blood pressure. Our research targets are implantable blood pressure sensor and its telemetric measurement. By winding round the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessel.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.178-178
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• 2009

전자제품의 고속화, 고집적화, 고성능이 요구되어짐에 따라 IC's 성능 향상을 통해 패키징 기술의 소형화를 필요로 하고 있어 소재나 칩 부품을 이용해 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브 기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 3D 패키징이 가능한 flexible 소재에 능, 수동 소자를 내장하기 위한 다층 flexible 기판 공정 기술에 대한 연구를 수행하였다. 기판제작을 위해 flexible 소재에 미세 형성이 가능한 폴리머 필름을 접착하였고 flexible 위에 후막 저항체 패턴을 퍼|이스트를 이용하여 형성하였다. 또한, 능동소자 내장을 위해 test chip을 제작하여 플립칩 본더를 이용해 flexible 기판에 접합한 후에 bonding film을 이용한 build up 공정을 통해 via를 형성하고 무전해 도금 공정을 거쳐 전기적인 연결을 하였다. 위의 공정을 통해 앓고 가벼울 뿐만 아니라 자유롭게 구부러지는 특성을 갖고 있는 능, 수동 소자 내장형 flexible 기판의 변형에 따른 전기적 특성을 평가하였다.