• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.11a
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• pp.89-90
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• 2008

This paper studies the effect of pad at initial stage and wear during braking on the dynamic contact pressure distribution. Wear is influenced by variable factor (contact pressure, sliding speed, radius, temperature) during dynamic braking and variation in contact pressure distribution. Many researchers have conducted complex eigenvalue analysis considering wear characteristic with Lim and Ashby wear map. The conventional analysis method is assumed the pad has smooth and flat surfaces. The purpose of this paper is to validate that wear rate induced by braking is considered for the precise squeal prediction. After obtaining pad wear from experiment, it is incorporated with FE model of brake system. Finally, the comparisons in fugitive nature of squeal will be carried out between the complex eigenvalue analysis and noise dynamometer experiment.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.125-134
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• 2005

Recently, there have been reported on the results that the material life is reduced by fretting conditions and the initial crack made by low stress under fretting. The purpose of this paper is to show that the results of finite element analysis for the fretting contact problems of a flat rounded punch are nearly consistent with the theoretical solutions and to research that the results about effects of the contact zone according to geometries and mechanical properties of pad.

• Journal of the Korean Society of Clothing and Textiles
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• v.42 no.2
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• pp.211-223
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• 2018

In global apparel product development, flat is one of the most important key factor for technical design communication. Proportionally correct flats based on correct scaled human body figures are imperative to be successful in the fashion business. In this study the researchers were to develop body templates for flats for Korean women body types using data from 'Size Korea 2004 (5th)', which is a Korean government apparel sizing project to analyze women's body measurements (age range 7-49). We measured 13 height measurements, 6 width measurements, 8 circumference measurements, 6 length measurements, 3 angle measurements and 5 body measurements. A body figure (i.e., schema) for each group was created by Pattern Design Software (PAD) System 4.1. Muscle was added to the schema created by Adobe Illustrator to ensure a better visualization and convenience for industry uses for flats. Developed body figure template of representative type had the largest difference in height level compared to exiting figures. It had a bigger head, lower crotch level, and longer crotch depth and hip length than existing figures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.231-236
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• 2004

The area of flat glass panel displays such as LCD (Liquid crystal display) and PDP (Plasma display panel) has been increased more than 2 $\times$ 2 m$^2$ for productivity improvement. However, such a large panel area incurs large panel deflection during panel transfer using robots or AGV (Automated guided vehicle) systems. Therefore, electronic industries are making an effort to find an alternative transfer system for the large glass panels with small deflection. The air conveyor with porous pads is one plausible solution, but it becomes expensive because the large porous pads cost much and air consumption increases as the panel area increases. In this work, a simple air slit levitating conveyor was devised to lower the equipment cost and to reduce the air consumption of system. The air flow model between the LCD glass panel and conveyor was constructed and its validity was verified by experiments. To minimize the air consumption, the conveyor dimensions were optimized, and the air consumptions between the air conveyors with the air slit and that with the porous pad were compared.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.6
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• pp.937-944
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• 2013

This paper describes an improved model that can be used for configuring a non-contact pneumatic head to handle a large sheet of glass. The cylindrical head model is of a large size (70 mm). It operates on vortex flow, which can simultaneously generate suction and repulsion over the flat object's surface. The head allows for the minimal non-contact lifting of objects weighing over 3N by using reference conditions (working pressure and head dimensions). Additionally, a functional flow-guide is applied for inducing a developing tangential vortex flow to increase suction and repulsion to the reference head. The cylindrical flow-guide is associated with relatively low tangential velocity. The improved model generates greater lifting force than the reference model, as verified experimentally.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.3
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• pp.245-251
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• 2015

In an electrical reliability test of a printed circuit board (PCB), the impact of the micro probing pins on the PCB needs to be checked to ascertain the quality of the circuit. In this study, the impact of the dynamic movement of the probing pin on the pad was observed. As a misaligned pin can exert horizontal force on the pad of the PCB, this study focused on the behavior of a misaligned probing pin. The parameters of observation were the circular and flat edges of the probing pin. The effects of the speed of movement, diameter, and the length of projection of the probing pin were also investigated. The results demonstrated that slippage angle is strongly affected by the shape of the edge of the probing pin, and that projection length is an important factor affecting pin slippage. In contrast, the speed of movement of the probing pin was able to double the slippage angle.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.85-90
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• 2003

Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.116-125
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• 2008

In general, fretting is a contact damage process due to micro-slip associated with small amplitude oscillatory movement between two surfaces in contact. Previous studies in fretting fatigue have observed a contact size effect related to contact width. The volume-averaging method of theoretically predicted contact stress fields was required to emulate experimental trends and to predict the observed contact size effects. This contact size effect is captured by the mean values of stresses and strains at the element integration points of FE model and two critical plane models (SWT, FS) in the present paper. It is shown that crack nucleation and fretting fatigue life can be predicted by the FE-based critical plane models.