Browse > Article
http://dx.doi.org/10.3795/KSME-B.2015.39.3.245

Observation of Dynamic Movement of Probing Pin on PCB Pad Using Electrical Reliability Test  

Song, Seongmin (Dept. of Advanced Electronic Circuit Substrate Engineering, Chungnam Nat'l Univ.)
Cha, Gangil (Samsung Electro-Mechanics)
Kim, Myungkyu (Samsung Electro-Mechanics)
Jeon, Seungho (Samsung Electro-Mechanics)
Yu, SangSeok (Dept. of Mechanical Engineering, Chungnam Nat'l Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers B / v.39, no.3, 2015 , pp. 245-251 More about this Journal
Abstract
In an electrical reliability test of a printed circuit board (PCB), the impact of the micro probing pins on the PCB needs to be checked to ascertain the quality of the circuit. In this study, the impact of the dynamic movement of the probing pin on the pad was observed. As a misaligned pin can exert horizontal force on the pad of the PCB, this study focused on the behavior of a misaligned probing pin. The parameters of observation were the circular and flat edges of the probing pin. The effects of the speed of movement, diameter, and the length of projection of the probing pin were also investigated. The results demonstrated that slippage angle is strongly affected by the shape of the edge of the probing pin, and that projection length is an important factor affecting pin slippage. In contrast, the speed of movement of the probing pin was able to double the slippage angle.
Keywords
PCB; Impact; Probing Pin; Pad Delamination; High Speed CCD Camera;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Hong, S. K., 2011, PCB Manufacturing Technique, Bokdu, Seoul, pp. 30-36.
2 Varnau, M. J., 1996, "Impact of Wafer Probe Damage on Flip Chip Yields and Reliability," 1996 IEEE/CPMT Electronics Manufacturing Technology Nineteenth Symposium, pp. 293-297.
3 William, R. F., 2008, On-Chip Probe Metrology, ProQuest, Miami, pp. 11-13.
4 Jon, O. C., 2004, "Study and Recommendations into Using Lead Free Printed Circuit Board Finishes at Manufacturing in Circuit Test Stage," Agilent Technologies, California, pp. 3-6.
5 Michael, H., 2000, "Pad Damage due to Probing: Solutions for the Future," Infineon Technologies, Bavaria, pp. 2-14.
6 Liu, D. S., 2006, "Experimental Method and FE Simulation Model for Evaluation of Wafer Probing Parameters," Microelectronics Journal, Vol. 3, No. 1, pp. 871-883.