Thermal Fatigue Analysis of Wafer Level Embedded SiP by Changing Mold Compounds and Chip Sizes (몰드물성 종류 및 칩 크기 변화에 따른 웨이퍼 레벨 Sip에서의 열 피로 해석)
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- Journal of the Korean Society of Manufacturing Technology Engineers
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- v.22 no.3_1spc
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- pp.504-508
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- 2013