• 제목/요약/키워드: fine pitch

검색결과 180건 처리시간 0.026초

Pyrolysis kinetics and microstructure of thermal conversion products on toluene soluble component from two kinds of modified pitch

  • Zhu, Yaming;Zhao, Xuefei;Gao, Lijuan;Cheng, Junxia
    • Carbon letters
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    • 제28권
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    • pp.38-46
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    • 2018
  • Modified pitch A (MPA) and modified pitch B (MPB) were prepared by oxidative polymerization and thermal polycondensation reaction with refined pitch as the raw material, respectively. The toluene soluble components (TS-1 and TS-2) were obtained by solvent extraction from MPA and MPB, separately. The Flynn-Wall-Ozawa method and Kissinger-Akahira-Sunose method were used to calculate the pyrolysis activation energy of TS. The Satava-Sestak method was used to investigate the pyrolysis kinetic parameters of TS. Moreover, the optical microstructure of the thermal conversion products (TS-1-P and TS-2-P) by calcination shows that TS-1-P has more contents of mosaic structure and lower contents of fine fiber structure than TS-2-P. The research result obtained by a combination of X-ray diffraction and the curve-fitting method revealed that the ratios of ordered carbon crystallite (Ig) in TS-1-P and TS-2-P were 0.3793 and 0.4417, respectively. The distributions of carbon crystallite on TS-1-P and TS-2-P were calculated by Raman spectrum and curve-fitting analysis. They show that the thermal conversion product of TS-2 has a better graphite crystallite structure than TS-1.

잠재적 이방성 핏치를 이용한 탄소성형체 제조 (Preparation of Carbon Solid from Dormant Mesophase Pitch without using a Binder)

  • 김제영;이성영;최재훈;박양덕
    • 한국세라믹학회지
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    • 제29권5호
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    • pp.396-402
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    • 1992
  • Carbon solid was prepared from dormant mesophase pitch (DMPP) without using a binder and its properties were characterized. DMPP powder was stabilized with air or nitric acid in pretreatment stage so that it might not soften in later heat ttreatment stage. Optimum sintering properties were obtained from carbon powder with 2.36∼2.38 of C/H atomic ratio and 1.27∼1.40 of C/O atomic ration in air stabilization. In nitric acid stabilization, optimum sintering properties were obtained when 20∼40 vol.% of nitric acid solution was used. Compressive strength increased up to 1200$^{\circ}C$ of heat treatment temperature, and the highest compressive strength and bulk density of carbon solid from DMPP were 3000 kgf/㎤, respectively. The optical properties of carbon solid obtained was fine mosaic structure. Carbon solid after graphitization showed the properties of hard carbon due to stabilization and its shore hardness was 120.

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Novel Bumping Process for Solder on Pad Technology

  • Choi, Kwang-Seong;Bae, Ho-Eun;Bae, Hyun-Cheol;Eom, Yong-Sung
    • ETRI Journal
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    • 제35권2호
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    • pp.340-343
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    • 2013
  • A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

Novel Bumping Material for Solder-on-Pad Technology

  • Choi, Kwang-Seong;Chu, Sun-Woo;Lee, Jong-Jin;Sung, Ki-Jun;Bae, Hyun-Cheol;Lim, Byeong-Ok;Moon, Jong-Tae;Eom, Yong-Sung
    • ETRI Journal
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    • 제33권4호
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    • pp.637-640
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    • 2011
  • A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성 (Solderability of thin ENEPIG plating Layer for Fine Pitch Package application)

  • 백종훈;이병석;유세훈;한덕곤;정승부;윤정원
    • 마이크로전자및패키징학회지
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    • 제24권1호
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    • pp.83-90
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    • 2017
  • 본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다.

Discharge Characteristics of Counter Electrode Discharge Cells of PDP

  • Kim, Young-Jin;Kim, Yong-Seog
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.477-479
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    • 2006
  • In this study, a stripe type counter electrode discharge cell for PDP was attempted to realize high luminance efficiency and low firing voltage for fine pitch discharge cells. The cells were prepared using electroplated Cu/Ni electrodes coated with glass dielectric layer. The discharge behaviors of such cells were observed. These results indicate that the counter electrode discharge cells have different discharge behavior compared with coplanar cells, which may affect the luminance efficiency of the panel.

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액정핏치 형성에 관한연구 (Effect on Formation of Liquid Crystal Pitch)

  • 권영배;류해일
    • 한국기계연구소 소보
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    • 통권13호
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    • pp.15-25
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    • 1984
  • The infrared spectra were determined to discover the characteristics and properties of poff-, PV-, and cc-samples, and studied influence on the formation of mesophase or liquid crystal. The experimental results were as follows; a) Samples with long aliphatic side chain appear cracking texture on temperature forming liquid crystal. b) The fine isotropic microstructure appears in a heterogeneous material containing sulfur, 7.18 w%. c) In the size of molecular weight the lighter than 500 form liquid crystal. d) When poff-sample was treated at $400^{\circ}C$ aliphatic hydrocabon compounds decrease, presented well-oriented bulk liquid crystal.

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스트랩다운 관성항법시스템의 초기정렬 알고리즘 구현 (Implementation of an Initial Alignment Algorithm for a Stapdown Inertial Navigation system)

  • 김종혁;문승욱;이시호;김세환;황동환;이상정;나성웅
    • 제어로봇시스템학회논문지
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    • 제6권2호
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    • pp.138-145
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    • 2000
  • In this paper an initial alignment algorithm for a strapdown inertial navigation system is implemented using a RISC CPU board. The algorithm computes roll pitch and yaw angles of the direction cosine matrix utilizing measured components of the specific force and earth rate when the navigation system is stationary. The coarse alignment algorithm is performed first and then the fine alignment algorithm containing a 3rd-order gyrocompass loop follows. The experimental set consists of an IMU a CPU board and a monitoring system Experimental results show that the implemented algorithm can be utilized in navigation systems.

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A Study on The Performance of Supersonic Cascade with The Nozzle Inlet Boundary

  • Shin, Bong-Gun;Jeong, Soo-In;Kim, Kui-Soon;Lee, Eun-seok
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2004년도 제22회 춘계학술대회논문집
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    • pp.839-847
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    • 2004
  • In this study, the flow characteristics within supersonic cascades are numerically investigated by using Fine Turbo, a commercial CFD code. Cascade flows are computed for three different inlet conditions. : a uniform supersonic inlet condition, a linear nozzle and a converging-diverging nozzle located in front of cascades. The effect of inlet conditions is compared and flow characteristics including shock patterns and shock-boundary layer interaction are analyzed. Also the effect of design parameters such as pitch-chord ratio, blade angle and blade surface curvature on the flow within supersonic cascades are studied.

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체결 성능 향상을 위한 FPCB 커넥터의 형상설계 (Shape Design of FPCB Connector to Improve Assembly Performance)

  • 김대영;박형서;김웅겸;표창률;김헌영
    • 대한기계학회논문집A
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    • 제36권3호
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    • pp.347-353
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    • 2012
  • 최근 휴대폰은 스마트폰의 출연으로 다기능화가 요구되고 있으며, 각 보드의 전기적 신호를 연결시키는 커넥터는 필수 핵심 부품이 되었다. 커넥터는 많은 양의 전기신호를 처리하기 때문에 소형화, 협피치화가 필요하다. 하지만, 커넥터의 소형화 및 협피치화는 구조적 안전성을 저하시키며, 외부하중에 의한 접촉불량을 발생시킨다. 따라서 본 논문에서는 초소형 협피치 FPC 커넥터를 개발하기 위해 벤치마킹을 통한 초기설계안을 도출하였으며, 터미널 두께 0.2mm, 개수 50 개를 기준으로 하였다. 체결성능을 평가하기 위해 수치해석 모델을 구성하였으며, 다구찌 방법을 이용하여 형상 최적화를 수행하였다. 또한, 터미널의 한계수명을 예측하기 위해 피로해석을 수행하였으며, 체결 성능이 향상된 최종형상을 도출하였다.