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Shape Design of FPCB Connector to Improve Assembly Performance

체결 성능 향상을 위한 FPCB 커넥터의 형상설계

  • Received : 2011.08.08
  • Accepted : 2011.12.23
  • Published : 2012.03.01

Abstract

Recently, multi-functionalization (as in smart phones) has been in demand, and the connectors connecting the electrical signals of each board in a cellular phone have become key components. The miniaturization of these connectors is required to achieve a finer pitch design and enhance the electrical signal transfer capacity. However, the miniaturization of connectors reduces the structural safety, and a finer pitch design may cause contact problems under external impact. In this paper, a preliminary design for miniaturized, finer-pitch connectors is suggested for a product with 50 pins and a thickness of 0.2 mm. The assembly process of the FPCB (Flexible Printed Circuit Board) and connector was simulated to ensure the holding force between the two components and avoid overstressing. The design optimization process was performed with the Taguchi method. Fatigue analysis was also conducted to predict the fatigue life of the terminal, and the theoretical and experimental results were compared.

최근 휴대폰은 스마트폰의 출연으로 다기능화가 요구되고 있으며, 각 보드의 전기적 신호를 연결시키는 커넥터는 필수 핵심 부품이 되었다. 커넥터는 많은 양의 전기신호를 처리하기 때문에 소형화, 협피치화가 필요하다. 하지만, 커넥터의 소형화 및 협피치화는 구조적 안전성을 저하시키며, 외부하중에 의한 접촉불량을 발생시킨다. 따라서 본 논문에서는 초소형 협피치 FPC 커넥터를 개발하기 위해 벤치마킹을 통한 초기설계안을 도출하였으며, 터미널 두께 0.2mm, 개수 50 개를 기준으로 하였다. 체결성능을 평가하기 위해 수치해석 모델을 구성하였으며, 다구찌 방법을 이용하여 형상 최적화를 수행하였다. 또한, 터미널의 한계수명을 예측하기 위해 피로해석을 수행하였으며, 체결 성능이 향상된 최종형상을 도출하였다.

Keywords

References

  1. Kim, C. J., Han, S. Z., Jung, Y. C. and Lee, J. M., 1997, "Development of High Strength and High Elastic Alloy for Connectors," Bulletin of the Korean Inst. Of Met. & Mat, Vol.10, No.6, pp. 676.
  2. Kim, W. K., Pyo, C. R., Jeon, B. H., Park, H. S., Lee, S. I., Ko, T. S., Son, Y. S., Park, G. W. and Bang, I. W., 2010, "Optimization of Etching Process for Manufacturing the Burrless Connector Terminal," 2010 Spring Conference of Korea Socirty for Precision Engineering, pp. 223-224.
  3. Shibutani, T., Wuc, J., Yu, Q. and Pecht, M., 2008, "Key reliability concerns with lead-free connectors," Microelectronics Reliability, Vol. 48, pp. 1613-1627. https://doi.org/10.1016/j.microrel.2008.06.004
  4. Kim, S. W., Jung, W. W., Wei, S. H., Kim, H. M., Park, S. B. and Lee, D. H., 2008, "Reappearance of the Electrical Poor Contact in Connectors by Fretting Wear," 2008 KSME Autumn Conference, pp. 1361-1362.
  5. Jeon, B. H. and Ann, K. S., 1993, "A Study on the Interconnection Mechanism of Compliant Press-Fit Pin(II)," AUTO JOURNAL of KSAE, Vol. 15, No. 1, pp. 89-90.
  6. Park, S. H., 2006, "Design of Experiments," pp. 563-584.
  7. Gohn G., Guerard J. and Freynik H., 1956, "The Mechanical Properties of Wrought Phosphor Bronze Alloys," ASTM International, pp.20-114.
  8. Bedford, A. and Liechti, K. M., "Mechanics of Materials," 2004, Prentice Hall, pp. 516-518.