• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.108-109
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• 2006

ZnO semiconductor has a wide band gap of 3.37 eV and a large exciton binding energy of 60 meV, and displays excellent sensing and optical properties. In particular, ZnO based 1D nanowires and nanorods have received intensive attention because of their potential applications in various fields. We grew ZnO buffer layers prior to the growth of ZnO nanorods for the fabrication of the vertically well-aligned ZnO nanorods without any catalysts. The ZnO nanorods were grown on Si (111) substrates by vertical MOCVD. The ZnO buffer layers were grown with various thicknesses at $400^{\circ}C$ and their effect on the formation of ZnO nanorods at $300^{\circ}C$ was evaluated by FESEM, XRD, and PL. The synthesized ZnO nanorods on the ZnO film show a high quality, a large-scale uniformity, and a vertical alignment along the [0001]ZnO compared to those on the Si substrates showing the randomly inclined ZnO nanorods. For sample using ZnO buffer layer, 1D ZnO nanorods with diameters of 150-200 nm were successively fabricated at very low growth temperature, while for sample without ZnO buffer the ZnO films with rough surface were grown.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.884-889
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• 2009

Recently, the control of size, morphology and dimensionality in inorganic materials has been rapidly developed into a promising field in materials chemistry. 3D nanostructured flower-like ZnO architecture with different size and shapes have been simply synthesized by hydrothermal process, using zinc acetate and ammonium hydroxide as reactants. In this study, the ZnO thin-films were deposited by RF magnetron sputtering in other to get high adhesion and uniformity of 3D nanostructured flower-like ZnO architecture on a $SiO_2$ substrate. The XRD patterns identified that the obtained the nanocrystallized ZnO architecture exhibited a wurtzite structure. SEM images illustrated that the flower-like ZnO bundles consisted of flower-like or chestnut bur, which were characterized by polycrystalline and (002) preferential orientation.

• Journal of the Korean Vacuum Society
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• v.9 no.1
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• pp.7-15
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• 2000

An ECR-PECVD system with the characteristics of high ionization rat다 ability of plasma processing in a wide pressure range and deposition at low temperature was manufactured and characterized for the deposition of thin films. The system consists of a vacuum chamber, sample stage, vacuum gauge, vacuum pump, gas injection part, vacuum sealing valve, ECR source and a control part. The control of system is carried out by the microprocessor and the ROM program. We have investigated the vacuum characteristics of ECR-PECVD system, and also have diagnosed the characteristics of ECR microwave plasma by using the Langmuir probe. From the data of system and plasma characterization, we could confirmed the stability of pressure in the vacuum chamber according to the variation of gas flow rate and the effect of ion bombardment by the negative DC self bias voltage. The plasma density was increased with the increase of gas flow rate and ECR power. On the other hand, it was decreased with the increase of horizontal radius and distance between ECR source and probe. The calculated plasma densities were in the range of 49.7\times10^{11}\sim3.7\times10^{12}\textrm{cm}^{-3}$. It is also expected that we can estimate the thickness uniformity of film fabricated by the ECR-PECVD system from the distribution of the plasma density.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.1-7
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• 2017

Multi-wafer planetary type chemical vapor deposition reactors are widely used in thin film growth and suitable for large scale production because of the high degree of growth rate uniformity and process reproducibility. In this study, a two-dimensional model for estimating the effect of the gap between satellite and wafer on the wafer surface temperature distribution is developed and analyzed using computational fluid dynamics technique. The simulation results are compared with the results obtained from an analytical method. The simulation results show that a drop in the temperature is noticed in the center of the wafer, the temperature difference between the center and wafer edges is about $5{\sim}7^{\circ}C$ for all different ranges of the gap, and the temperature of the wafer surface decreases when the size of the gap increases. The simulation results show a good agreement with the analytical ones which is based on one-dimensional heat conduction model.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.5-9
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• 2019

Optical emission spectroscopy is used to identify chemical species and monitor the changes of process results during the plasma process. However, plasma process monitoring or fault detection by using emission signal variation monitoring is vulnerable to background signal fluctuations. IR heaters are used in semiconductor manufacturing chambers where high temperature uniformity and fast response are required. During the process, the IR lamp output fluctuates to maintain a stable process temperature. This IR signal fluctuation reacts as a background signal fluctuation to the spectrometer. In this research, we evaluate the effect of infrared background signal fluctuation on plasma process monitoring and improve the plasma process monitoring accuracy by using simple infrared background signal subtraction method. The effect of infrared background signal fluctuation on plasma process monitoring was evaluated on $SiO_2$ PECVD process. Comparing the $SiO_2$ film thickness and the measured emission line intensity from the by-product molecules, the effect of infrared background signal on plasma process monitoring and the necessity of background signal subtraction method were confirmed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.99-104
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• 2021

Ion-beam sputtering (IBS) was used to deposit semiconducting IZTO (indium zinc tin oxide) thin films onto heavily-doped Si substrates using a sintered ceramic target with the nominal composition In0.4Zn0.5Sn0.1O1.5, which could work as a channel layer for oxide TFT (oxide thin film transistor) devices. The crystallization behavior and electrical properties were examined for the films in terms of deposition parameters, i.e. target tilt angle and substrate temperature during deposition. The thickness uniformity of the films were examined using a stylus profilometer. The observed difference in electrical properties was not related to the degree of crystallization but to the deposition temperature which affected charge carrier concentration (n), electrical resistivity (ρ), sheet resistance (Rs), and Hall mobility (μH) values of the films.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.38-44
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• 2022

Plasma density in semiconductor fabrication equipment becomes higher to achieve the improved the throughput of the process, but the increase of surface corrosion of the ceramic coated chamber wall has been observed by the increased plasma density. Plasma chamber wall coating with aerosol deposition prefer to be firm and uniform to prevent the potential creation of particle inside the chamber from the deformation of the coating materials, and the aerosol discharge nozzle is a good control factor for the deposited coating condition. In this paper, we investigated the design of the nozzle of the aerosol deposition to form a high-quality coating film. Computational fluid dynamics (CFD) study was employed to minimize boundary layer effect and shock wave. The degree of expansion, and design of simulation approach was applied to found out the relationship between the divergence angle and nozzle length as the key parameter for the nozzle design. We found that the trade-off tendency between divergence angle and nozzle length through simulation and quantitative analysis, and present the direction of nozzle design that can improve the uniformity of chamber wall coating.

• Journal of Hydrogen and New Energy
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• v.32 no.6
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• pp.663-668
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• 2021

For the development of highly efficient quantum dot-sensitized solar cells (QDSCs), it is important to enhance the electrocatalytic activity of the counter electrodes (CEs). Herein, a fabrication process of Cu₂S CEs are optimized for the development highly efficient QDSCs. The surface of brass film is treated with HCl solution to prepare the Cu₂S CEs, and the concentraion as well as the temperature of HCl solution are controlled. It is found that the uniformity for the thickness of prepared Cu₂S CEs is enhanced when the diluted HCl solution is used, compared to the HCl solution of standard concentration. In addition, the electrocatalytic activity of the Cu₂S CEs is also increased with the modificed process, which is confirmed by impedance data and Tafel polarization curves. As a result, the photoconversion efficiency of QDSCs is improved from 4.49% up to 5.73%, when the concentraion and temperature of the HCl treatment are efficiently optimized.

• Current Optics and Photonics
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• v.7 no.6
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• pp.745-754
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• 2023

In order to test the recognition ability and accuracy of a target imaging simulator under the irradiation of solar stray light in a laboratory environment, it needs to be fixed on a five-axis turntable during a hardware-in-the-loop simulation test, so the optical system of the simulator should have a long exit pupil distance. This article adopts a secondary imaging method to design a projection optical system suitable for thin-film-transistor liquid crystal displays. The exit pupil distance of the entire optical system is 1,000 mm, and the final optimization results in the 400 nm-850 nm band show that the modulation transfer function (MTF) of the optical system is greater than 0.8 at the cutoff frequency of 72 lp/mm, and the distortion of each field of view of the system is less than 0.04%. Combined with the design results of the optical system, TracePro software was used to model the optical system, and the simulation of the target imaging simulator at the magnitude of -1 to +6 Mv was analyzed and verified. The magnitude error is less than 0.2 Mv, and the irradiance uniformity of the exit pupil surface is greater than 90%, which meets the requirements of the target imaging simulator.

• Journal of Ceramic Processing Research
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• v.22 no.3
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• pp.253-257
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• 2021

Among various thin film encapsulation (TFE) methods, thin films prepared by atomic layer deposition (ALD) have been shown to provide superior protection against the permeation of moisture and oxygen. This technique has numerous of advantages such as excellent uniformity, precise thickness control, and strong adhesion. Therefore, with ozone-based ALD, we conducted the influence of the thickness of aluminum oxide (Al2O3) on moisture barrier properties. From the results of an electrical calcium test, Al2O3 had two distinctly different permeation regimes. Between 10 and 25 nm of Al2O3 thickness, the water vapor transmission rate (WVTR) decreased exponentially from 6.3 × 10-3 to 1.0 × 10-4 g m-2 day-1 (1/60 times). In contrast, as thickness increased from 25 to 100 nm, the WVTR values decreased by only two-thirds, from 1.0 × 10-4 to 6.6 × 10-5 g·m-2·day-1. To better understand the change from an exponential to a sub-exponential regime, defect density and refractive index of Al2O3 were measured. The thickness dependence on defect density and refractive index was analogous with one of moisture barrier performance. These results confirmed the existence of a critical thickness at which the WVTR decreased drastically.