• 제목/요약/키워드: film structure

검색결과 3,909건 처리시간 0.03초

Strain hardening behavior of linear polymer melts

  • Hong Joung Sook;Ahn Kyung Hyun;Lee Seung Jong
    • Korea-Australia Rheology Journal
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    • 제16권4호
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    • pp.213-218
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    • 2004
  • Linear high-density polyethylene (PE) was controlled to induce strain-hardening behavior by introducing a small amount of second component with an anisotropic structure. In order to form an anisotropic structure in the PE matrix, the polymer was extruded through a twin-screw extruder, and the structure was controlled by varying the extrusion conditions. Depending on conditions, the second component formed a film, thread and droplet structure. If the second component was kept rigid, the morphology evolution could be delayed and the second component could maintain its film or thread structure without further relaxation. In par­ticular, the second component of the thread structure made a physical network and gave rise to remarkable strain hardening behavior under high extension. This study suggests a new method that induces strain hard­ening behavior by introducing a physically networked second component into the linear polymer melt. This result is anticipated to improve the processibility of linear polymers especially when extensional flow is dominant, and to contribute to our understanding of strain hardening behavior.

강유전성 박막의 형성 및 수소화 된 비정질실리콘과의 접합 특성 (The Contact Characteristics of Ferroelectrics Thin Film and a-Si:H Thin Film)

  • 허창우
    • 한국정보통신학회논문지
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    • 제7권3호
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    • pp.468-473
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    • 2003
  • 본 연구에서는 박막트랜지스터의 특성 향상을 위하여 강유전성 박막을 게이트 절연층으로 사용하기 위하여 강유전성 박막과 a-Si:H의 계면특성을 조사하였다. 먼저 강유전성 박막 중에 대표적인 SrTiO$_3$를 I-BEAM 증착기로 박막을 형성시켰다. 형성된 박막은 N2 분위기에서 $150^{\circ}C∼600^{\circ}C$로 1시간 ANNEALING하여 전자현미경으로 표면을 측정하였다. SrTiO$_3$의 유전상수는 50∼100 정도였으며 항복전계는 1∼l.5 MV/cm로 매우 우수한 유전특성을 갖고 있었다. 강유전체 박막 위에 a-SiN:H,a-Si:H(n-type a-Si:H) 등을 PECVD로 증착하여 MFNS구조를 형성하였다. 계면특성을 C-V PLOTTER로 측정한 결과 SrTiO$_3$ 박막은 SiN과의 접합이 매우 안정되어 있었고 C-V특성은 SiN/a-Si:H과 유사하였다. 그러나 FERROELECTRIC/a-S:H의 경우가 훨씬 CAPACITANCE 값이 컸으며, 이는 강유전체 박막의 높은 유전상수에 기인 된 것이라 생각된다.

금속산화 박막 전기소자의 전기적 특성 연구 (A Study on the Electrical Properties of Transition Metal Oxides Thin Film Device)

  • 최성재
    • 한국인터넷방송통신학회논문지
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    • 제11권6호
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    • pp.9-14
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    • 2011
  • $AlO_x$ 박막 소자를 제작하여 전기적 특성을 조사하였다. 소자는 Electrode를 Top-bottom구조로 제작하였으며 스위칭 특성을 연구하기 위해 전극간의 $AlO_x$ 박막의 전도특성이 측정되었다. 박막소자의 저항변화는 전압을 선형적으로 인가하여 측정하였다. 제작된 소자는 MIM구조로써 외부에서 인가하는 전기적 신호에 의하여 전기전도도가 큰 On-state와 전기전도도가 낮은 Off-state로 바뀌는 특성을 나타내었다. 본 연구에 사용된 $AlO_x$ 박막은 초기 저항 상태가 저저항 On 상태였으며, 전압을 인가함에 따라 저저항 On 상태와 고저항 Off 상태의 가역적 저항 변화 특성을 나타내었다. 본 연구를 통하여 $AlO_x$ 박막소자는 차세대 비휘발성 메모리로는 물론 다른 전기적 응용도 기대되는 물질임을 확인하게 되었다.

Organic-Inorganic Nanohybrid Structure for Flexible Nonvolatile Memory Thin-Film Transistor

  • 윤관혁;;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.118-118
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    • 2011
  • The Nano-Floating Gate Memory(NFGM) devices with ZnO:Cu thin film embedded in Al2O3 and AlOx-SAOL were fabricated and the electrical characteristics were evaluated. To further improve the scaling and to increase the program/erase speed, the high-k dielectric with a large barrier height such as Al2O3 can also act alternatively as a blocking layer for high-speed flash memory device application. The Al2O3 layer and AlOx-SAOL were deposited by MLD system and ZnO:Cu films were deposited by ALD system. The tunneling layer which is consisted of AlOx-SAOL were sequentially deposited at $100^{\circ}C$. The floating gate is consisted of ZnO films, which are doped with copper. The floating gate of ZnO:Cu films was used for charge trap. The same as tunneling layer, floating gate were sequentially deposited at $100^{\circ}C$. By using ALD process, we could control the proportion of Cu doping in charge trap layer and observe the memory characteristic of Cu doping ratio. Also, we could control and observe the memory property which is followed by tunneling layer thickness. The thickness of ZnO:Cu films was measured by Transmission Electron Microscopy. XPS analysis was performed to determine the composition of the ZnO:Cu film deposited by ALD process. A significant threshold voltage shift of fabricated floating gate memory devices was obtained due to the charging effects of ZnO:Cu films and the memory windows was about 13V. The feasibility of ZnO:Cu films deposited between Al2O3 and AlOx-SAOL for NFGM device application was also showed. We applied our ZnO:Cu memory to thin film transistor and evaluate the electrical property. The structure of our memory thin film transistor is consisted of all organic-inorganic hybrid structure. Then, we expect that our film could be applied to high-performance flexible device.----못찾겠음......

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Study on the Optical Properties of Light Diffusion Film with Plate Type Hollow Silica

  • Lee, Ji-Seon;Moon, Seong-Cheol;Noh, Kyeong-Jae;Lee, Seong-Eui
    • 한국세라믹학회지
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    • 제54권5호
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    • pp.429-437
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    • 2017
  • Micro hollow plate type silica with low refraction properties was synthesized and its hollow structure was applied as an optical structure to develop a light diffusion material that simultaneously satisfies the requirements of good light diffusibility, high transmissibility, and high luminance. The developed light diffusion material was applied to a light diffusion film and the film's optical properties were assessed. Hollow silica was synthesized by precipitation method using $Mg(OH)_2$ core particles, sodium silicate, and ammonium sulfate as the silica precursors. The concentration of the silica precursor was adjusted to control hollow silica shell thickness. The total light transmittance of the light diffusion film composed of the hollow silica was 94.55%, which was 4.57% higher than that of the PC film; new film's haze was 71.20%, which was 70.9% higher. Furthermore, the luminance increased by 5.34% compared to that of the light source. The reason for the results is not only that the micro plate type hollow silica, which has a low refractive property, played a role in reducing the difference in refractive index between the medium boundaries, but also that there was a light-concentrating effect due to the changing of light paths to the front direction inside the hollow structure. Optical simulation verified the enhanced optical properties when hollow silica was applied to the light diffusion film.

저압 화학 기상 증착 조건에서 Si$H_4$, W$F_6$ 환원 반응에 의한 텅스텐 박막의 성장 양식 (Growth Mode of Tungsten Thin Film by Using Si$H_4$ Reduction of W$F_6$ in LPCVD System)

  • 김성훈
    • 한국결정성장학회지
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    • 제3권2호
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    • pp.107-116
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    • 1993
  • LPCVD 조건하에서 Si 기판을 이용하여 W$F_6$를 환원시키거나 Si$H_4$를 이용하여 W$F_6$를 환원시켜 Si(100) 기판위에 텅스텐 박막을 증착하였다. 증착된 박막들의 표면 및 단면 형상과 특성들을 조사하였으며 박막들의 결정구조는 체심입방구조를 이루는${alpha}$-W임을 알수 있었다. 박막내의 텅스텐의 양과 grain들의 크기는 박막이 성장함에 따라 증가하였다. 실험적인 결과와 이론적인 고찰들로부터 텅스텐 박막은 Volmer-Weber 성장양식인 island growth를 이룸을 알 수 있었고 세부적인 박막 성장양식을 제시하였다. 또한 텅스텐 박막이 성장할수록 박막의 결정구조는 점점 단결정화 하여감을 알수 있었다.

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Reduction of reflection from PET (polyethylene terephthalate) film surface by natural plasma etching

  • Oh, Hoon;Song, Yu-Jin;Whang, Ki-Woong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1419-1424
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    • 2006
  • We could reduce the reflection from PET(polyethylene terephthalate) film surface by natural plasma etching which does not use etch masks. The plasma etched PET film showed lower reflectance and higher transmittance which is resulted by making subwavelength structure(SWS) on the film surface by the plasma etch rate difference between the amorphous and crystalline region in the surface of PET film.

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Effusion Cell 방식에 의한 <111> 결정구조의 Au 박막의 제작 (Au Thin Film Fabrication of <111> Crystal Structure by Effusion Cell Process)

  • 표경수;김강대;김용규;송정근
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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    • pp.383-386
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    • 2004
  • The one of important requisites for fabricating molecular electronic device is the single crystal direction of bottom substrate nowadays. [1,2]. We obtain the optimum SAM result when the Au crystal is <111> structure for Self-Assembled molecular. To get the <111> crystal Au, we generally repeat heating and cooling course after evaporating Au [3]. However, we can fabricate <111> crystal Av thin film except post treatment because we simultaneously evaporate and anneal using Effusion Cell. In this paper, we study on thin film growth of <111> crystal Au as bottom electrode which is essential for Self-Assembled molecular by Effusion Cell and analyze crystal structure, thickness, surface conductivity and so on as each process condition.

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화학증착법에 의한 PbTiO3박막의 조성분석 및 전기적성질에 관한 연구 (Study on the Composition Analysis and Electrical Properties of Chemical Vapor Deposited PbTiO3 Thin Film)

  • 이혜용;윤순길;김호기
    • 한국세라믹학회지
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    • 제26권5호
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    • pp.670-676
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    • 1989
  • The PbTiO3 is well known materials having remarkable ferroelectric, piezoelectric, and pyroelectric properties. PbTiO3 thin films with a perovskite structure were successfully fabricated on titanium substrate by chemical vapor deposition. These films were characterized according to composition, crystal structure, and electrical properties. Semi-quantitative compositional analysis of the deposited films was made by Auger Electron Spectroscopy(AES). The PbTiO3 film deposited on titanium substrate at the deposition temperature 75$0^{\circ}C$, the Ti(C2H5O)4 fraction 0.15, and O2 partial pressure 0.06atm, has a columnar structure and grows with(001) preferred orientation, and has stoichiometric composition. A clear dielectric transition and offset in the dc conductivity near the transition temperature(48$0^{\circ}C$) were observed in the deposited lead titanate film.

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오프셋 마스크를 이용하지 않는 새로운 자기 정합 폴리 실리콘 박막 트랜지스터 (A novel self-aligned offset gated polysilicon thin film transistor without an additional offset mask)

  • 민병혁;박철민;한민구
    • 전자공학회논문지A
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    • 제32A권5호
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    • pp.54-59
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    • 1995
  • We have proposed a novel self-aligned offset gated polysilicon TFTs device without an offset mask in order to reduce a leakage current and suppress a kink effect. The photolithographic process steps of the new TFTs device are identical to those of conventional non-offset structure TFTs and an additional mask to fabricate an offset structure is not required in our device due to the self-aligned process. The new device has demonstrated a lower leakage current and a better ON/OFF current ratio compared with the conventional non-offset device. The new TFT device also exhibits a considerable reduction of the kink effect because a very thin film TFT devices may be easily fabricated due to the elimination of contact over-etch problem.

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