• Korean Journal of Environmental Agriculture
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• v.22 no.4
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• pp.255-260
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• 2003

Silicon is known to accumulate in plants and results in greater resistance to diseases and insect pests. In this study, we investigated the effect of silicate fertilizer applied in soil on the development of powdery mildew of oriental melon. Oriental melon seedlings of four-leaf stage were transplanted and grown in a plastic film house. Silicate fertilizer was applied to maintain soil available $SiO_2$ level of 200 mg/kg one week before transplanting. Fungicide triflumizol was sprayed three times; one, two, and three weeks after transplanting. Sphaerotheca fuliginea was inoculated 2 weeks after transplanting. The number of infected leaf and the number of fungal colony in leaves were measured one, two, and three weeks after the inoculation. Three weeks after the fungal inoculation, in the treatment of fungicide triflumizol. infected leaf numbers and number of colony per leaf were reduced by 10 and 58%, respectively. In the silicate fertilizer treatment, infected leaf numbers and numbers of colony per infected leaf were suppressed only by 6 and 16%, respectively, and the efficacy was lower than that of the fungicide triflumizol. The combined treatment of silicate fertilizer and the fungicide suppressed powdery mildew more effectively, and infected leaf numbers and numbers of colony per leaf were reduced by 31 and 80%, respectively. These results indicate that although silicate fertilizer itself is not much effective in the suppression of powdery mildew, it can significantly enhance the efficacy of the fungicide.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.1-7
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• 1999

We developed Fabrication process of embedded passive components in MCM-D substrate. The proposed MCM-D substrate is based on Cu/photosensitive BCB multilayer. The substrate used is Si wafer and Ti/cu metallization is used to form the interconnect layer. Interconnect layers are formed with 1000$\AA$ Ti/3000$\AA$ Cu by sputtering method and 3$\mu\textrm{m}$ Cu by electrical plating method. In order to form the vias in photosensitive BCB layer, the process of BCB and plasma etch using $C_2F_6$ gas were evaluated. The MCM-D substrate is composed of 5 dielectric layers and 4 interconnect layers. Embedded resistors are made with NiCr and implemented on the $2^{nd}$ dielectric layer. The sheet resistance of NiCr is controlled to be about 21 $\Omega$/sq at the thickness of 600$\AA$. The multi-turn sprial inductors are designed in coplanar fashion on the $4^{th}$ interconnect layer with an underpass from the center to outside using the lower $3^{rd}$ interconnect layer. Capacitors are designed and realized between $1^{st}$ interconnect layer and $2^{nd}$ interconnect layer. An important issue in capacitor is the accurate determination of the dielectric thickness. We use the 900$\AA$ thickness of PECVD silicon nitride film as dielectric. Capacitance per unit area is about 88nF/$\textrm {cm}^2$at the thickness of 900$\AA$. The advantage of this integration process is the compatibility with the conventional semiconductor process due to low temperature PECVD silicon nitride process and thermal evaporation NiCr process.

• Polymer(Korea)
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• v.33 no.1
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• pp.79-83
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• 2009

Thin electric insulation layers were coated on aluminum plates and aluminum condenser cases by plasma polymerization of HMDSO+$O_2$. Electric resistances of the films were higher than 1.0 M$\Omega$ if they are thicker than 0.5 ${\mu}m$ independently of the type of films but their surface morphologies and adhesion strengths were dependent on the process conditions. Deposition rate and adhesion strength of the films were dependent on $O_2$/HMDSO flow ratio and discharge power. The best result was obtained at $O_2$/HMDSO flow ratio of 4 and discharge power of 60 W. Adhesion strength could also be highly improved if aluminum was pre-treated in boiling water for 30 min through the formation of Al-O-Si bonding between the film and the aluminum surface. The coated films showed excellent chemical and thermal resistances.

• Polymer(Korea)
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• v.34 no.4
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• pp.313-320
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• 2010

New cinnamate group-containing copolymers for a self-curable, humidity-sensitive polyelectrolyte and polymeric anchoring agents were prepared by copolymerization of [2-[(methacryloyloxy) ethyl]dimethyl]propyl ammonium bromide(MEPAB), methyl methacrylate(MMA), 3-(trimethoxysilyl) propyl methacrylate(TMSPM) and 2-(cinnamoyloxy)ethyl methacrylate(CEMA). Photocrosslinkable copolymer composed of MEPAB/MMA/TMSPM/CEMA＝70/20/0/10 were used for humidity-sensitive membrane, and those of 50/0/20/30 and 0/0/50/50 were used for polymeric anchoring agents. 3- (Triethoxysilyl)propyl cinnamate(TESPC) was also used as a surface-pretreating agent for the comparison of capability of attachment of polyelectrolyte to the electrode surface with polymeric photocurable silanecoupling agents. Pretreatment of the electrode substrate with anchoring agents was performed to form a cinnamate thin film on the electrode through covalent bonds. When the sensors were irradiated with UV light, the anchoring of a polyelectrolyte into the substrate was carried out via the [2$\pi$+2$\pi$] cycloaddition. The resulting sensors using polymeric anchoring agents and TESPC showed water durability with increase of resistance by 60~85%, which is corresponding to the reduction of 2.25~3.15%RH, after soaking in water for 24 h. They showed good hysteresis (-0.2%RH), response time (90 sec) and long-term stability at high temperature and humidity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.3
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• pp.201-206
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• 2019

This report constitutes the first demonstration in Korea of single-crystal lateral gallium oxide ($Ga_2O_3$) as a metal-oxide-semiconductor field-effect-transistor (MOSFET), with a breakdown voltage in excess of 480 V. A Si-doped channel layer was grown on a Fe-doped semi-insulating ${\beta}-Ga_2O_3$ (010) substrate by molecular beam epitaxy. The single-crystal substrate was grown by the edge-defined film-fed growth method and wafered to a size of $10{\times}15mm^2$. Although we fabricated several types of power devices using the same process, we only report the characterization of a finger-type MOSFET with a gate length ($L_g$) of $2{\mu}m$ and a gate-drain spacing ($L_{gd}$) of $5{\mu}m$. The MOSFET showed a favorable drain current modulation according to the gate voltage swing. A complete drain current pinch-off feature was also obtained for $V_{gs}<-6V$, and the three-terminal off-state breakdown voltage was over 482 V in a $L_{gd}=5{\mu}m$ device measured in Fluorinert ambient at $V_{gs}=-10V$. A low drain leakage current of 4.7 nA at the off-state led to a high on/off drain current ratio of approximately $5.3{\times}10^5$. These device characteristics indicate the promising potential of $Ga_2O_3$-based electrical devices for next-generation high-power device applications, such as electrical autonomous vehicles, railroads, photovoltaics, renewable energy, and industry.

• Korean Chemical Engineering Research
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• v.57 no.4
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• pp.525-530
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• 2019

The performance and stability of solid oxide fuel cells (SOFCs) depend on the microstructure of the electrode and electrolyte. In anode, porosity and pore distribution affect the active site and fuel gas transfer. In an electrolyte, density and thickness determine the ohmic resistance. To optimizing these conditions, using costly method cannot be a suitable research plan for aiming at commercialization. To solve these drawbacks, we made high performance unit cells with low cost and highly efficient ceramic processes. We selected the NiO-YSZ cermet that is a commercial anode material and used facile methods like die pressing and dip coating process. The porosity of anode was controlled by the amount of carbon black (CB) pore former from 10 wt% to 20 wt% and final sintering temperature from $1350^{\circ}C$ to $1450^{\circ}C$. To achieve a dense thin film electrolyte, the thickness and microstructure of electrolyte were controlled by changing the YSZ loading (vol%) of the slurry from 1 vol% to 5 vol. From results, we achieved the 40% porosity that is well known as an optimum value in Ni-YSZ anode, by adding 15wt% of CB and sintering at $1350^{\circ}C$. YSZ electrolyte thickness was controllable from $2{\mu}m$ to $28{\mu}m$ and dense microstructure is formed at 3vol% of YSZ loading via dip coating process. Finally, a unit cell composed of Ni-YSZ anode with 40% porosity, YSZ electrolyte with a $22{\mu}m$ thickness and LSM-YSZ cathode had a maximum power density of $1.426Wcm^{-2}$ at $800^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.3
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• pp.492-498
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• 2021

This feasibility study evaluated an optically transparent planar antenna using liquid salt-water as the conducting material. The most significant reason behind using liquid salt-water for transparent antenna applications is its excellent average optical transparency (OTav) (> 95% at a salinity of 40 ppt) compared to other typical solid transparent thin-film electrodes, such as indium tin oxide (ITO:> 73%) or multi-layer films (MLF: > 78%). Each conductive arm of the proposed dipole is constructed from a salt-water layer held between two clear planar acrylic layers (��r = 2.61, tan�� = 0.01, OTav > 90%) (acrylic/salt-water/acrylic; ASA) due to surface tension. To examine the electrical and optical properties of the ASA structure, the surface tension was measured to determine the thickness of the salt-water layer that finalized its sheet resistance and OTav. The average gain and efficiency of the antenna were 1.72 dBi and 74%, respectively, in the operating UHF (Ultra high frequency) band (470-771 MHz). Therefore, the proposed antenna can be a good candidate for applications as a transparent planar antenna using salt-water.

• Applied Chemistry for Engineering
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• v.32 no.1
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• pp.28-34
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• 2021

SiO2/Ag core-shell nanoparticles were synthesized by combining modified Stöber process and reverse micelle method using acetoxime as a reducing agent in water/dodecylbenzenesulfonic acid (DDBA)/cyclohexane reverse micells. The SiO2/Ag core-shells were studied for structure, morphology and size using UV-visible spectroscopy, XRD, SEM and TEM. The size of a SiO2/Ag core-shell could be controlled by changing the [water]/[DDBA] molar ratio (WR) values. The size and the polydispersity of SiO2/Ag core-shells increased with increase of the WR value. The resultant Ag nanoparticles exhibit a strong surface plasmon resonance (SPR) peak at 430 nm over the amorphous SiO2 nanoparticles. The SPR peak shifted to the red side with increase in nanoparticle size. Conductive pastes with 70 wt% SiO2/Ag core-shell were prepared, and the pastes were coated on the PET films using a screen-printing method. The printed paste film of the SiO2/Ag core-shell showed higher surface resistance than the commercial Ag paste in the range of 460~750 µΩ/sq.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.105-111
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• 2023

Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.

• Composites Research
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• v.37 no.3
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• pp.238-245
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• 2024

In this study, as part of the development of a monitoring system for the efficient maintenance of steel pipes, an experimental study was conducted to evaluate the performance of steel pipes treated with modified polyethylene coating. In the case of the conventional mechanical pre-coating method, there was a deterioration in polyethylene adhesion during expansion testing, which led to the application of a chemical pre-treatment process using a calcium-mixed phosphate zinc film to resolve this issue. SEM and EDX analyses showed that the densest structure was observed at a Zn/Ca ratio of 1.0, and improved heat resistance compared to the conventional method was confirmed. Additionally, to prevent coating detachment during expansion, an evaluation of adhesion and elongation was conducted on steel pipes with modified polyethylene coating, incorporating materials such as elastomers based on maleic anhydride grafting, metal oxides, blocking agents, and slip agents. Experimental results showed that the specimen (S4) containing all modified materials exhibited more than a 25% performance improvement compared to the specimen (S2) containing only metal oxides. Lastly, the development and performance evaluation of wedge-shaped socketing and pressing wheels, which are part of the pipe fixing accessories, were conducted to prevent surface coating damage on the completed pipes.