• Title/Summary/Keyword: filling-in

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Flow Analysis of Filling Imbalance according to Runner Shapes in Injection Mold (사출금형의 러너시스템 형상에 따른 충전불균형 유동해석 모델)

  • Jang, Min-Kyu;Go, Seung-Woo;Kim, Yeong-Min;Noh, Byeong-Su;Jeong, Yeong-Deug
    • Design & Manufacturing
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    • v.2 no.5
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    • pp.16-20
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    • 2008
  • Almost all injection molds have multi-cavity runner system for mass production, which are designed with geometrically balanced runner system in order to accomplish filling balance between cavity to cavity during processing; However, even though geometrically balanced runner is used, filling imbalances have been observed. In these day, the CAE has been used widely in injection molding. However, CAE with fusion mesh can't indicate such as jetting, flow mark and filling imbalance in multi cavity mold. In this study, we investigated the filling imbalance according to runner shapes by CAE analysis. As a result in CAE, in case of binary branch runner system, filling imbalance was indicated between cavity to cavity, but the flow pattern of each cavity uniformed in unary branch runner system.

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Degree of Filling Balance according to Runner Shapes in Injection Mold (사출금형의 러너시스템 형상에 따른 균형 충전도)

  • Han, Dong-Yeop;Jeong, Yeong-Deug
    • Design & Manufacturing
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    • v.6 no.1
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    • pp.52-57
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    • 2012
  • Aspect of filling imbalance that is originated from imbalanced share rate in runner is changed by material property, runner layout that are factors of changing viscosity and by injection pressure, injection speed, melt temperature and mold temperature that are injection conditions. In this paper, we made a study of runner system that is one of factor of filling imbalance and Sharp Conner Effect and Groove Corner Effect that are recently released. The study are showed that filling rate of between inside and outside cavity was influenced on shape of runner. Also, we suggested runner system for filling imbalance by adapting the two effects at multi cavity of unary branch type and theoretical investigated flow in the Shrap Conner runner type.

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An Experimental Study for the Filling Balance of the Family Mold (Family 금형의 충전 균형을 위한 실험적 연구)

  • Park H. P.;Cha B. S.;Rhee B. O.
    • Transactions of Materials Processing
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    • v.15 no.1 s.82
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    • pp.47-56
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    • 2006
  • It is well known that the family-mold has an advantage to reduce the cost for production and mold. However, defects are frequently occurred by over packing the smaller volume cavity during molding, especially when the family-mold has a volumetric difference between two cavities. In this study, the cavity-filling imbalance was confirmed by the temperature and the pressure sensors, and a variable-runner system was developed for balancing the cavity-filling. Experiments of balancing the cavity filling was carried out in the family-mold with the variable-runner system, and balancing the cavity-filling was confirmed by changing the cross-sectional area of a runner in the variable-runner system with the temperature and pressure sensors. The influence of the injection speed to the balancing-capability of the variable-runner system was also examined in the experiment.

Filling Imbalance in Injection Mold with Branch Type Runner System (나뭇가지형 러너시스템을 갖는 사출금형에서의 충전 불균형)

  • Han, Dong-Yeop;Jeong, Yeong-Deug
    • Design & Manufacturing
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    • v.1 no.1
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    • pp.45-50
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    • 2007
  • Recently, the study for filling imbalance in thermoplastic polymer has gradually been increased. However, it is hard to find the researches for filling imbalance of thermoplastic elastomer(TPE). The experiment of filling imbalance was conducted for thermoplastic vulcanize(TPV) and PP, ABS polymers in the mold with un-geometrically balanced runner system(Branch Type Runner System). In this experiment, the effects of the melt temperature, injection pressure and injection speed on the filling imbalance were investigated.

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용탕유동과 응고를 고려한 주조공정의 유한요소해석

  • 윤석일;김용환
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.04a
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    • pp.620-625
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    • 1995
  • Finite element analysis tool was developed to analyze the casting process. Generally, casting processes consists of mold filling and solifification. In order to investigate the effects of process variables and to predict the defects, both filling and solidiffication process were simulated simultaneously. At filling process, especiallywe consider thermal coupling to investigate thermal history of material during the filling stage. And thermal condition at the final stage of filling is used as the initial conditions in a solidification process for the exact simulation of the actual casting processes. At mold filling process, Lagrangian-type finite element method with automatic remashing scheme was used to find the material flow. To avoid numerical instability in low viscous fluid, a perturbation method with artificial viscosity is adopted. At solififfication process, enthalpy-based finite element method was used to solve the heat transfer problem with phase change. And elastic stress analysis has been performed to predict the thermal residual stress. Through the FE analysis, solidiffication time, position of solidus line, liquidus line and thermal residual stress are studied. Finite element tools developed in this study will be used process design of casting process and maybe basic structure for total CAE system of castigs which will be constructed afterward.

Micro-computed tomographic evaluation of the flow and filling ability of endodontic materials using different test models

  • Torres, Fernanda Ferrari Esteves;Guerreiro-Tanomaru, Juliane Maria;Chavez-Andrade, Gisselle Moraima;Pinto, Jader Camilo;Berbert, Fabio Luiz Camargo Villela;Tanomaru-Filho, Mario
    • Restorative Dentistry and Endodontics
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    • v.45 no.2
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    • pp.11.1-11.9
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    • 2020
  • Objectives: This study compared the flow and filling of several retrograde filling materials using new different test models. Materials and Methods: Glass plates were manufactured with a central cavity and 4 grooves in the horizontal and vertical directions. Grooves with the dimensions used in the previous study (1 × 1 × 2 mm; length, width, and height respectively) were compared with grooves measuring 1 × 1 × 1 and 1 × 2 × 1 mm. Biodentine, intermediate restorative material (IRM), and mineral trioxide aggregate (MTA) were evaluated. Each material was placed in the central cavity, and then another glass plate and a metal weight were placed over the cement. The glass plate/material set was scanned using micro-computed tomography. Flow was calculated by linear measurements in the grooves. Central filling was calculated in the central cavity (㎣) and lateral filling was measured up to 2 mm from the central cavity. Results: Biodentine presented the least flow and better filling than IRM when evaluated in the 1 × 1 × 2 model. In a comparison of the test models, MTA had the most flow in the 1 × 1 × 2 model. All materials had lower lateral filling when the 1 × 1 × 2 model was used. Conclusions: Flow and filling were affected by the size of the test models. Higher grooves and materials with greater flow resulted in lower filling capacity. The test model measuring 1 × 1 × 2 mm showed a better ability to differentiate among the materials.

The Effects of Current Types on Through Via Hole Filling for 3D-SiP Application (전류인가 방법이 3D-SiP용 Through Via Hole의 Filling에 미치는 영향)

  • Chang, Gun-Ho;Lee, Jae-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.4
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    • pp.45-50
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    • 2006
  • Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

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A COMPARATIVE STUDY ON THE APICAL LEAKAGE OF VARIOUS RETROFILLING MATERIALS (Retrofilling시 수종충전재료의 변연누출에 관한 연구)

  • Ohn, Yeong-Suck;Son, Ho-Hyun
    • Restorative Dentistry and Endodontics
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    • v.16 no.2
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    • pp.118-125
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    • 1991
  • Eighty - eight recently extracted teeth were used to evaluate the leakage characteristics of the following retrofilling materials; amalgam, zinc oxide eugenol cement, glass - ionomer cement, and cermet glass - ionomer cement. Root canals were prepared with step - back method and obturated with gutta percha and zinc oxide eugenol sealer. Root apex were resected 2 mm from apex and class I cavities were prepared with 2 mm or 4 mm depth. The cavities were filled with above materials. After application of varnish on all surface except resected surface, the roots were placed in 1 % methylene blue solution for 6 days. After longitudinal polishing to expose cental parts of filled materials, penetrated depths of dye were measured. The results were as follws. 1. As retrofilling material, glass ionomer cement filling groups showed less leakage than the other groups except zinc oxide eugenol cement filling group(p<0.01). 2. Amalgam filling groups had greater leakage than zinc oxide eugenol cement filling group(p<0.01). 3. 4 mm depth of retrofilled cavity had no effect on leakage characteristics compared with 2 mm depth cavity(p>0.05). 4. Glass ionomer cement and cermet glass ionomer cement filling groups showed less apical leakage than amalgam filling groups. But there was no statistical significance(p>0.05). 5. There was no difference in apical leakage between glass ionomer cement filling groups and cermet glass ionomer cement filling groups(p>0.05).

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Development of Tip Device for Hydraulic Filling Efficiency Improvements (수압식 충전의 효율 향상을 위한 선단장치 개발에 관한 연구)

  • Yu, Sung-Kon;Kim, Tae-Heok;Shin, Dong-Chun
    • Tunnel and Underground Space
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    • v.22 no.6
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    • pp.403-411
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    • 2012
  • In recent, the using of the hydraulic filling method has increased on the underground reinforcement of the abandoned mine in Korea, however it is the lack of research on the efficient filling method. In this study, tank model tests and field tests were conducted for development of tip device for filling efficiency improvements on the hydraulic filling method. In tank model experiments, the filling efficiency was evaluated according to the form and angle of the nozzle on tip device in the same condition. Then tip device model designed by tank model tests was applied to the field experiment. As a result, the amount of filling of nozzle $90^{\circ}$ tube is increased by approximately 18% compared to the common vertical injection pipe. The angle of repose was $30.82^{\circ}$. Filling hole spacing in the field is usually designed from 5m up to 10m assumed to be $40^{\circ}$ of the angle of repose. According to the results of this study, it is possible that the filling hole spacing expands at least 10m up to 15m applied to be $30^{\circ}{\sim}35^{\circ}$ of the angle of repose. Therefore, it is expected to be economical and efficient mine filling.

Numerical simulation of hot embossing filling (핫엠보싱 충전공정에 관한 수치해석)

  • Kang T. G.;Kwon T. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.43-46
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    • 2005
  • Micro molding technology is a promising mass production technology for polymer based microstructures. Mass production technologies such as the micro injection/compression molding, hot embossing, and micro reaction molding are already in use. In the present study, we have developed a numerical analysis system to simulate three-dimensional non-isothermal cavity filling for hot embossing, with a special emphasis on the free surface capturing. Precise free surface capturing has been successfully accomplished with the level set method, which is solved by means of the Runge-Kutta discontinuous Galerkin (RKDG) method. The RKDG method turns out to be excellent from the viewpoint of both numerical stability and accuracy of volume conservation. The Stokes equations are solved by the stabilized finite element method using the equal order tri-linear interpolation function. To prevent possible numerical oscillation in temperature Held we employ the streamline upwind Petrov-Galerkin (SUPG) method. With the developed code we investigated the detailed change of free surface shape in time during the mold filling. In the filling simulation of a simple rectangular cavity with repeating protruded parts, we find out that filling patterns are significantly influenced by the geometric characteristics such as the thickness of base plate and the aspect ratio and pitch of repeating microstructures. The numerical analysis system enables us to understand the basic flow and material deformation taking place during the cavity filling stage in microstructure fabrications.

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