• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.11a
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• pp.795-796
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• 2011

During launch process, ground support facilities perform its duty in established processes by communications with launch vehicle. All ground support systems are operated independently or organically. This paper studied algorithm of propellant filling process and method for liquid oxygen filling system in launch operation in Naro space complex.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• Journal of Powder Materials
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• v.9 no.4
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• pp.245-250
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• 2002

In this paper we presented numerical method for the simulation of powder injection molding filling process, which is one of the key processes in powder injection molding. Rheological properties of powder binder mixture such as slip phenomena and yield stress were introduced into the numerical analysis model of powder injection molding filling simulation. Numerical model can be classified into two types. One is 2.5D model which can be introduced to a arbitrary thin geometry and the other is full 3D model which can be applied to a general 3D shape. For 2.5D model we showed the validity of our CAE system with several verification examples. Finally we suggested flow analysis model for 3D powder injection molding filling simulation.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.11
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• pp.969-976
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• 2015

In the present study, a numerical investigation of an insert injection molding process was carried out for the development of thermoplastic microfluidic chip plates with metal electrodes. Insert injection molding technology enables efficient realization of a plastic-metal hybrid structure and various efforts have been undertaken to produce novel components in several application fields. The microfluidic chip with metal inserts was proposed as a representative example and its molding process was analyzed. The important characteristics of the filling stage, such as the effects of filling time and thickness of the part cavity, were characterized. Furthermore, the detailed distributions of pressure and temperature at the end of the filling stage were investigated, revealing the significance of metal insert temperature.

• Design & Manufacturing
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• v.6 no.2
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• pp.31-36
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• 2012

Now days CAE has been used for almost all injection molding designs in order to find the best injection conditions. Almost all CAE use 2-D mesh, but the CAE with 2-D mesh can't indicate such as jetting, flow-mark and filling imbalance in multi cavity mold. In this study, we suggested a new 3D meshing. the method which can indicate the filling imbalance in geometrically balanced runner system with Mold Flow MPI 6.1 and we found out that the calculation times are saved. As a feasibility study, we verified that Melt Flipper, RC Pin etc appeared the balanced filling behaviors. of geometrically balanced runner system and Melt Flipper, filling imbalance was indicated more accurately.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

• Tunnel and Underground Space
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• v.16 no.5 s.64
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• pp.368-376
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• 2006

After heavy rainfall, It was occurred massive plane failure along bedding plane of shale in the center of rock slope. It was observed filling material and trace of underground water leakage around of the slope. We tried to find the cause for slope failure, and the result of examination showed that primary factors of the failure were low shear strength of clay filling material and water pressure formed within tension crack existed in the top of the slope. In this research, in order to examine the features of shear strength of filled rock joint, shear test of filled rock joint was conducted using of artificial filling material such as sand and clay..Also we made an investigation into the characteristics of shear strength with different thickness of filling materials.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.121-127
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• 2008

Nowdays CAE has been used for almost all injection molding designs in order to find the best injection conditions. Almost all CAE use 2-D mesh, but the CAE with 2-D mesh can't indicate such as jetting, flow-mark and filling imbalance in multi cavity mold. In this study, we suggested a new 3D meshing. the method which can indicate the filling imbalance in geometrically balanced runner system with Mold Flow MPI 6.1 and we found out that the calculation times are saved. As a feasibility study, we verified that Melt Flipper, RC Pin etc appeared the balanced filling behaviors. of geometrically balanced runner system and Melt Flipper, filling imbalance was indicated more accurately.

• Proceedings of the Korean Geotechical Society Conference
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• 2006.10a
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• pp.256-267
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• 2006

After heavy rainfall, It was occurred massive plane failure along bedding plane of shale in the center of rock slope. It was observed filling material and trace of underground water leakage around of the slope. We tried to find the cause for slope failure, and the result of examination showed that primary factors of the failure were low shear strength of clay filling material and water pressure farmed within tension crack existed in the top of the slope. In this research, in order to examine the features of shear strength of filled rock joint, shear test of filled rock joint was conducted using of artificial filling material such as sand and clay. Also we made an investigation into the characteristics of shear strength with different thickness of filling materials.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.36 no.4C
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• pp.232-240
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• 2011

While the water-filling algorithm is an efficient power allocation method that maximizes the ergodic capacity of adaptive MIMO systems, its excessive residual power causes spectrum loss in real systems employing discrete modulation indices. In this paper we propose new power allocation algorithms that improve the spectral efficiency of MIMO systems by efficiently reallocating the residual power of the water-filling algorithm. We apply the proposed algorithms to the adaptive turbo-coded MIMO system to verify their performance through computer simulation in various environments. Simulation results show that the spectral efficiency of the proposed algorithms is better than that of the water-filling algorithm by about 8.9% at SNR of 20dB in Rayleigh fading environments.