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http://dx.doi.org/10.5695/JKISE.2013.46.4.158

Effects of Chloride Ion on Accelerator and Inhibitor during the Electrolytic Cu Via-Filling Plating  

Yu, Hyun-Chul (Department of Advanced Materials Engineering, Korea Polytechnic University)
Cho, Jin-Ki (Department of Advanced Materials Engineering, Korea Polytechnic University)
Publication Information
Journal of the Korean institute of surface engineering / v.46, no.4, 2013 , pp. 158-161 More about this Journal
Abstract
Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.
Keywords
Via-Filling; $Cl^-$; SPS; PEG; Copper electroplating;
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