• Transactions of Materials Processing
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• v.14 no.4 s.76
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• pp.351-359
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• 2005

The semi-solid processing is now becoming of great interest for the production of various parts by pressure die casting. Also, the rheo-casting has been substituted for thixo-casting, because the rheo-casting can control the solid particles to globular and non-dendritic solid phase. In the rheo-casting process, the important thing is to control the solid particles behavior in semi-solid materials. So in this paper, to control solid particles behavior in semi-solid materials, we experimented about the die filling tests during the semi-solid die casting in 0.3, 0.4, 0.5 and 0, 6 solid fraction. The die filling in semi-solid die casting were simulated by MAGMA soft/thixo module. By the die filling tests and computer simulation, the effect of solid particles behavior in rheology flow had been investigated.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.3
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• pp.56-59
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• 2006

UV laser micromachining is generally used to create microstructures for micro-products through a sequence of lithography-based photo-patterning steps. However, the micromachining process is not suitable for rapid realization of complex 3D micro-products because it depends on worker experience. In addition, the cost and time required to make many masks are excessive. In this paper, a more effective and rapid micro-manufacturing process, which was developed based on laser micromachining, is proposed for fabricating micro-products directly using UV laser ablation and phase-change filling. The filling process is useful for holding the micro-products during the ablation step. The proposed rapid micro-manufacturing process was demonstrated experimentally by fabricating 3D micro-products from functional UV-sensitive polymers using 3D CAD data.

• Journal of the Korean Geosynthetics Society
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• v.11 no.3
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• pp.37-42
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• 2012

The cement paste is mostly used as the filling materials of bored pile in Korea. The use of filling material based on cement paste is inefficient at field construction because it needs a lot of the charging mass. In addition, it has environmental problem according to the large amount of cement use because its strength is also larger than criterion. The excavated soil with stabilizer can be used as the filling materials when the bored pile is constructed. Therefore, this paper describes field application of solidified soil for economical efficiency and environment-friendly. The injection capacity of solidified soil is compared with cement paste's based on unconfined compressive strength test and field load test, and the appropriate of test results is evaluated by design criterion. The evaluation result shows that the capacity of excavated soil with stabilizer is similar to cement paste and the solidified soil is able to apply as filling materials of bored pile because it is satisfied with design criterion.

• Transactions of Materials Processing
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• v.6 no.3
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• pp.239-249
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• 1997

The behaviour of alloys in the semi-solid state strongly depends on the imposed stress state and on the morphology of the phase which can vary from dendritic to globular. To optimal net shape forging of semi-solid materials, it is important to investigate for filling phenomena in forging process of arbitrarily shaped dies. To produce a automotive part which has good mechanical property, the filling pattern according to die velocity and solid fraction distribution has to be estimated for arbitrarily shaped dies. Therefore, the estimation of filling characteristic in the forging simulation with arbitrarily shaped dies of semi-solid materials are calculated by finite element method with proposed algorithm. The proposed theoretical model and a various boundary conditions for arbitrarily shaped dies is investigated with the coupling calculation between the liquid phase flow and the solid phase deformation. The simulation process with arbitrarily shaped dies is performed to the isothermal conditions of two dimensional problems. To analysis of forging process by using semi-solid materials, a new stress-strain relationship is described, and forging analysis is performed by viscoelastic model for the solid phase and the Darcy's law for the liquid flow. The calculated results for forging force and filling limitations will be compared to experimental data. The filling simulation of simple products performed with the uniform billet temperature(584$^{\circ}C$) from the induction heating by the commercial package MAGMAsoft. The initial step of computation is the touching of semi-solid material with the end of die gate and the initial concept of proposed system just fit with the capability of MAGMAsoft.

• Journal of Korea Foundry Society
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• v.31 no.2
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• pp.79-82
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• 2011

Various grain refining alloying elements such as Sr, TiB, and Ca were added to AZ91D and their effects on the mechanical properties and mold filling ability were investigated. The average grain sizes of those alloys were significantly reduced by the small amounts of the alloying elements. Ca addition was the most remarkably effective in reducing the grain size, however it was found to deteriorate the mold filling ability and tensile properties. TiB addition was observed to be the most efficient for both grain refinement and mold filling.

• Transactions of Materials Processing
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• v.14 no.1 s.73
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• pp.49-56
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• 2005

In the semi-solid die casting process, an important thing is the flow behavior of semi-solid materials. The flow patterns of the semi-solid material can make the defects during die filling. To control the flow patterns is very important and difficult. In this paper, the flow behavior of the semi-solid A356 alloy material during die filing at various die gate shapes has been observed with the grain size controlled material. The effect of the gate shape on the die filling characteristics was investigated. The filling tests in each plunger stroke were experimented, and also simulated on the semi-solid material die casting process by MAGMAsoft. According to the filling tests and computer simulation, the effect of the gate shape on liquid segregation has been investigated.

• Advanced Composite Materials
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• v.16 no.3
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• pp.207-221
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• 2007

The filling process of resin injection/compression molding (I/CM) can be divided into injection and compression phases. During the resin injection the mold is kept only partially closed and thus a gap is present between the reinforcements and the upper mold. The gap results in preferential flow path. After the gap is filled with the resin, the compression action initiates and forces the resin to penetrate into the fiber preform. In the present study, the resin flow in the gap is simplified by using the Stokes approximation, while Darcy's law is used to calculate the flow field in the fiber mats. Results show that most of the injected resins enter into the gap during the injection phase. The resin injection time is extremely short so the duration of the filling process is determined by the final closing action of the mold cavity. Compared with resin transfer molding (RTM), I/CM process can reduce the mold filling time or injection pressure significantly.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• Restorative Dentistry and Endodontics
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• v.19 no.2
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• pp.409-428
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• 1994

Endodontic surgery is performed when conventional endodontic therapy fails or is contraindicated. In such cases, retrograde filling materials including amalgam, composite resin, and various cements have been used. Biocompatibilty and margin sealing ability of retrograde filling materials are important for the long term success of endodontic surgery. In vitro cell culture is frequently used as the method of measuring the biocompatibilty of dental materials. The purpose of this study was to evaluate the cytotoxicity of six kinds of retrograde filling materials including newly developed light curing glass ionomer cements. Each material was mixed according to. the manufacture's instruction and evaluated as : freshly mixed, 24-hour after mixing, and 168-hour after mixing respectively. The elution solution was extracted after 24-hour contact with materials using media. Cytotoxicity was evaluated by direct contact, or elution contact. Test results of radiochromium($^{51}Cr$) release, cell viability using tetrazolium dye (3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyl dimethyltetrazolium bromide(MTT) test and lactate dehydrogenase(LD) of damaged L929 cells were analyzed. In the $^{51}Cr$ release of direct contact, all experimental retrograde filling materials except amalgam and glass ionomer cement showed increased cytotoxicity compared to control. In the $^{51}Cr$ release of elution solution, the released $^{51}Cr$ was so minimal that it was impossible. to evlauate the cytotoxicity exactly. The elution solutions of glass ionomer cement and IRM showed marked cytotoxicity in MTT test. LD enzyme activity was highest in tests of direct contact with composite, light curing composite, and light curing glass ionomer cement and IRM. Amalgam revealed least cytotoxicity while IRM showed cytotoxicity using all three methods. Composite, light curing composite and light curing glass iomomer cement were cytotoxic in the tests of $^{51}Cr$ release and LD activity. Glass ionomer cement showed cytotoxic effect only in the MTT method. From these results it is suggested that the standardization and optimization of cytotoxicity testing, especially using elution solutions, should be strongly advised.

• Korean Journal of Metals and Materials
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• v.50 no.2
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• pp.152-158
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• 2012

The effect of current waveform on Cu filling into TSV (through-silicon via) and the bottom-up ratio of Cu were investigated for three dimensional (3D) Si chip stacking. The TSV was prepared on an Si wafer by DRIE (deep reactive ion etching); and its diameter and depth were 30 and $60{\mu}m$, respectively. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. The current waveform was varied like a pulse, PPR (periodic pulse reverse) and 3-step PPR. As experimental results, the bottom-up ratio by the pulsed current decreased with increasing current density, and showed a value of 0.38 on average. The bottom-up ratio by the PPR current showed a value of 1.4 at a current density of $-5.85mA/cm^2$, and a value of 0.91 on average. The bottom-up ratio by the 3-step PPR current increased from 1.73 to 5.88 with time. The Cu filling by the 3-step PPR demonstrated a typical bottom-up filling, and gave a sound filling in a short time.