• Steel and Composite Structures
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• v.45 no.1
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• pp.147-157
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• 2022

This study assessed the compressive and tensile strengths and modulus of elasticity of waste polyethylene terephthalate (PET) using the ASTM standard tests. In addition, short carbon and glass fibers were mixed with waste PET to examine the improvements in ductility and strength during compression. The bonding was examined via field-emission scanning electron microscopy. The strength degradation of the waste PET tested under UV was 40-50%. However, it had a compressive strength of 32.37 MPa (equivalent to that of concrete), tensile strength of 31.83 MPa (approximately ten times that of concrete), and a unit weight of 12-13 kN/m3 (approximately half that of concrete). A finite element analysis showed that, compared with concrete, a waste PET pile foundation can support approximately 1.3 times greater loads. Mixing reinforcing fibers with waste PET further mitigated this, thereby extending ductility. Waste PET holds excellent potential for use in foundation piles, especially while mitigating brittleness using short reinforcing fibers and avoiding UV degradation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.1
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• pp.23-31
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• 2016

In this study, we modified the conventional tensile split Hopkinson bar(TSHB) apparatus typically used for the high strength steel to evaluate the tensile deformation behavior of soft metallic sheet materials under high strain rates. Stress-strain curves of high purity single and multi-crystalline materials were obtained using this experimental procedure. Grain morphology and initial crystallographic orientation were characterized by EBSD(Electron Backscattered Diffraction) method measured in a FE-SEM(Field emission-scanning electron microscopy). The fractured surfaces were observed by using optical microscopy. The relationship between plastic deformation of aluminum crystalline materials under high-strain rates and the initial microstructure and the crystallographic orientations has been addressed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.1
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• pp.25-32
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• 2007

We investigated the silicide reaction stability between 10 nm-Col-xNix alloy films and silicon substrates with the existence of 4 nm-thick natural oxide layers. We thermally evaporated 10 nm-Col-xNix alloy films by varying $x=0.1{\sim}0.9$ on naturally oxidized single crystal and 70 nm-thick polycrystalline silicon substrates. The films structures were annealed by rapid thermal annealing (RTA) from $600^{\circ}C$ to $1100^{\circ}C$ for 40 seconds with the purpose of silicidation. After the removal of residual metallic residue with sulfuric acid, the sheet resistance, microstructure, composition, and surface roughness were investigated using a four-point probe, a field emission scanning electron microscope, a field ion bean4 an X-ray diffractometer, and an Auger electron depth profiling spectroscope, respectively, to confirm the silicide reaction. The residual stress of silicon substrate was also analyzed using a micro-Raman spectrometer We report that the silicide reaction does not occur if natural oxides are present. Metallic oxide residues may be present on a polysilicon substrate at high silicidation temperatures. Huge residual stress is possible on a single crystal silicon substrate at high temperature, and these may result in micro-pinholes. Our results imply that the natural oxide layer removal process is of importance to ensure the successful completion of the silicide process with CoNi alloy films.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.79-80
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• 2013

The purpose of this study was to investigate $2^{nd} $nanotube formed surface observation of the Ti-25Ta-xZr alloys using ATO(anodic titanium oxide) technique. Ti-25Ta-xZr alloy was anodized in 1M $H_3PO_4$ electrolytes containing 0.8 Wt. % NaF at room temperature. After formation of nanotube was achieved out, nanotube was eliminated, and then anodization was carried out repeatedly. The microstructures, phase transformation, and morphology of nanotubular Ti-25Ta-xZr alloys and process of nanotube growth by using ATO method was examined by optical microscopy (OM), X-ray diffraction (XRD), and field emission scanning electron microscopy (FE-SEM). The ${\alpha}$ phase and ${\beta}$ phases were affected to form the second nanotube morphology of Ti-25Ta-xZr alloys.

• Korean Journal of Materials Research
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• v.26 no.8
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• pp.417-421
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• 2016

We improve the energy conversion efficiency (ECE) of a dye sensitized solar cell (DSSC) by preparing a working electrode (WE) with localized surface plasmon resonance (LSPR) by inducing Au thin films with thickness of 0.0 to 5.0 nm, deposited via sputtering. Field emission scanning electron microscopy and atomic force microscopy were used to characterize the microstructure of the blocking layer (BL) of the Au thin films. Micro-Raman measurement was employed to confirm the LSPR effect, and a solar simulator and potentiostat were used to evaluate the photovoltaic properties, including the impedance and the I-V of the DSSC of the Au thin films. The results of the microstructural analysis confirmed that nano-sized Au agglomerates were present at certain thicknesses. The photovoltaic results show that the ECE reached a value of 5.34% with a 1-nm thick-Au thin film compared to the value of 5.15 % without the Au thin film. This improvement was a result of the increase in the LSPR of the $TiO_2$ layer that resulted from the Au thin film coating. Our results imply that the ECE of a DSSC may be improved by coating with a proper thickness of Au thin film on the BL.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.7
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• pp.584-588
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• 2011

The ZnO thin films doped with Ga and Ge (GZO:Ge) were prepared on glass substrate using RF sputtering system. Structural, morphological and optical properties of the films deposited in different temperatures were studied. Proportion of the element of using target was 97 wt% ZnO, 2.5 wt% Ga and 0.5 wt% Ge with 99.99% highly purity. Structural properties of the samples deposited in different temperatures with 200 w RF power were investigated by field emission scanning electron microscopy, FE-SEM images and x-ray diffraction XRD analysis. Atomic force microscopy, AFM images were able to show the grain scales and surface roughness of each film rather clearly than SEM images. it was showed that increasing temperature have better surface smoothness by FE-SEM and AFM images. Transmittance study using UV-Vis spectrometer showed that all the samples have highly transparent in visible region (300~800 nm). In addition, it can be able to calculate bandgap energy from absorbance data obtained with transmittance. The hall resistivity, mobility, and optical band gap energy are influenced by the temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.333-333
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• 2013

The poor conductivity of poly (3,4-ethylene dioxythiophene): poly (styrenesulfonate) (PEDOT:PSS) film hinders to use for a flexible electrode in solar cells. In this report we demonstrate that the conductivity of PEDOT:PSS film can be enhanced by modifying structures in a mixture of PEDOT: PSS aqueous solution and various organic solvents such as polar protic (2-propanol, methanol, ethanol, formic acid) and aprotic solvents (acetone and acetonitrile). To comparatively study the structural effects on the resulted electrical properties, the films are spin-coated on glasses and ITO. At the same time, a contact angle goniometer is used for clarifying a mechanism of wettability of PEDOT (hydrophobic) and PSS (hydrophilic) on the observed conductivity. The structures and electrical properties are investigated by FE-SEM (Field Emission Scanning Electron Microscopy), AFM (Atomic Force Microscopy), and 4-point probe, respectively.

• Journal of Powder Materials
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• v.23 no.3
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• pp.213-220
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• 2016

In this study, bulk nickel-carbon nanotube (CNT) nanocomposites are synthesized by a novel method which includes a combination of ultrasonication, electrical explosion of wire in liquid and spark plasma sintering. The mechanical characteristics of the bulk Ni-CNT composites synthesized with CNT contents of 0.7, 1, 3 and 5 wt.% are investigated. X-ray diffraction, optical microscopy and field emission scanning electron microscopy techniques are used to observe the different phases, morphologies and structures of the composite powders as well as the sintered samples. The obtained results reveal that the as-synthesized composite exhibits substantial enhancement in the microhardness and values more than 140 HV are observed. However an empirical reinforcement limit of 3 wt.% is determined for the CNT content, beyond which, there is no significant improvement in the mechanical properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.3-6
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• 2009

Aluminum nitride (AIN) thin films were deposited on a polycrystalline 3C-SiC intermediate layer by a pulsed reactive magnetron sputtering system. Characteristics of the AIN/SiC heterostructures were investigated by field emission scanning electron microscopy (FE-SEM), atomic force microscopy (AFM), X-ray diffraction (XRD), and Fourier transform infrared spectroscopy (FT-IR). The columnar structure of AIN thin films was observed by FE-SEM. The surface roughness of AlN films on the 3C-SiC buffer layer was measured using AFM. The XRD pattern of AlN films on SiC buffer layers was highly oriented at (002). Full width at half maximum (FWHM) of the rocking curve near (002) reflections was $1.3^{\circ}$. The infrared absorbance spectrum indicated that the residual stress of AIN thin films grown on SiC buffer layers was nearly negligible. The 3C-SiC intermediate layers are promising for the realization of nitride based electronic and mechanical devices.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.3
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• pp.261-264
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• 2005

The 90 nm gate pattern technology have been virtualized by employing the hard mask and the planarization of fate poly silicon. We fabricated 70nm poly-Si on $200 nm-SiO_2/p-Si(100)$ substrates using low pressure chemical vapor deposition (LPCVD) to investigate roughness evolution by varying rapid annealing temperatures. The samples were annealed at the temperatures of $700^{\circ}C\~1100^{\circ}C$ for 40 seconds with a rapid thermal annealer. The surface image and the surface roughness were measured by a field emission scanning electron microscopy (FESEM) and an atomic force microscopy (AFM), respectively. The poly silicon surface became more rough as temperature increased due to surface agglomeration. The optimum conditions of poly silicon planarization were achieved by annealed at $700^{\circ}C$ for 40 seconds.