• 한국지진공학회:학술대회논문집
• /
• 한국지진공학회 2006년도 학술발표회 논문집
• /
• pp.589-596
• /
• 2006

Torsional behavior of eccentric structures under seismic loading may cause stress and/or strain concentration, which result in the failure of the structures in an unexpected manner. This study propose how to assess the seismic capacity of plan-irregular RC wall structures. The seismic capacities ate expressed in terms of lateral displacement capacity of each wall. The seismic demands for displacement are assessed by so called displacement-based design approach. Those seismic capacity and demands are combined D-R coordinate, which is made up of lateral displacement and rotation angle. To expand these concepts to the inelastic region the adaptive modal analysis method is used. In addition, the failure mechanisms including torsional failure are defined on D-R coordinate. Finally, seismic assessments of two 3-story plan-irregular wall structures ate presented.

• Structural Engineering and Mechanics
• /
• 제37권1호
• /
• pp.79-93
• /
• 2011

A simple mechanical model is proposed to demonstrate qualitatively the pancake progressive collapse of multi-storey structures. The impact between two collapsed storeys is simulated using a simple algorithm that builds on virtual mass-spring-damper system. To analyze various collapse modes, columns and beams are considered separately. Parametric studies show that the process of progressive collapse involves a large number of complex mechanisms. However, the proposed model provides a simple numerical tool to assess the overall behavior of collapse arising from a few initiating causes. Unique features, such as beam-to-beam connection failure criterion, and beam-to-column connection failure criterion are incorporated into the program. Besides, the criterion of local failure of structural members can also be easily incorporated into the proposed model.

• 한국산학기술학회논문지
• /
• 제18권6호
• /
• pp.37-43
• /
• 2017

본 논문에서는 고출력 전자기파 (Electromagnetic pulses, EMP) 영향에 의해 발생하는 반도체 부품의 물리적 상호작용에 대한 원리와 고장 발생 메커니즘의 연구를 위해 선행된 연구 내용을 고찰하였다. 반도체 부품에서의 전자기파 전이 과정은 3층 (공기/유전체/도체) 구조로 설명할 수 있으며, 복소반사계수에 의하여 이론적으로 흡수되는 에너지를 예상할 수 있다. 반도체 부품에 전달된 과도한 고출력 전자기파로 인한 반도체 부품의 주요 고장 원인은 전자기파 커플링에 의한 부품 소재의 줄 열에너지의 발생이다. 전기장에 의한 유전가열과 자기장에 의한 맴돌이손실에 의해 반도체 칩의 P-N 접합 파괴, 회로패턴의 burn-out과 리드 프레임과 칩을 연결하는 와이어의 손상 등이 발생한다. 즉, 반도체 부품에 전달된 전자기파는 반도체 내부 물질과 상호작용을 하며, 쌍극자분극과 이온 전도도 현상이 동시에 발생하여, 칩 내부의 P-N 접합 부분에 과도한 역전압이 형성되어 P-N 접합 파괴를 유발한다. 향후 고 신뢰성을 요구하는 전기전자시스템에 대한 EMP 내성을 향상하기 위한 반도체 부품 수준의 연구가 필요하다.

• 대한치과교정학회지
• /
• 제30권1호
• /
• pp.67-82
• /
• 2000

치아의 맹출장애에 관한 연구들은 많은 경우 치아의 유착이나 물리적인 장애에 의한 영구치의 맹출지연, 매복 등을 다루어 왔다. 그러나 치아의 맹출장애는 단순히 국소적이며 물리적인 현상일 수도 있지만 전신적 발육이상의 발현일 가능성도 높음을 간과해서는 안 된다. 이는 중요한 전신질환의 일부 현상으로 나타나는 경우가 많으며 맹출기전 자체에 이상이 있는 경우도 있다. 특히 영구치의 맹출장애는 치열 및 악골의 발육에 영향을 미치고 치주조직의 손상을 야기하며 기능장애 및 심미적인 문제를 가져올 수 있다. 그러므로 정상적인 치아의 맹출은 악안면의 성장과 발육,기능에 중요하다고 할 수 있다. 따라서 교정임상의로서 우리는 치아의 맹출에 이상이 있는 환자를 조기에 진단, 발견하여 그 원인을 밝히고 이에 따라 적절히 대처할 수 있는 능력을 가져야 할 것이다. 본 연구에서는 치아의 맹출장애를 일으키는 윈인요소 및 이에 따른 치료방법의 차이에 대해 알아보고 그 중 골형성 부전증 및 primary failure of eruption환자를 예로 들었다.

• Tribology and Lubricants
• /
• 제33권4호
• /
• pp.127-133
• /
• 2017

In order to characterize the adhesive properties and failure mechanisms of diamond-like carbon (DLC) films of two different thicknesses (130 nm and $1.2{\mu}m$), deposited by plasma-enhanced chemical vapor deposition on a Si substrate, scratch testing with a micro-indenter ($12.5{\mu}m$ tip radius) was performed under a linearly increasing load. These scratch tests were conducted under the same test conditions for both films. The critical load of each film was estimated from the scratch test results, based on a sharp increase in the coefficient of friction and a clear distinction of failure modes. The critical load was the basis for evaluating the adhesion strength of the films, and the $1.2{\mu}m-thick$ DLC film had superior adhesion strength. For better understanding of the failure modes, the following analyses were conducted: friction behavior and scratch tracks analysis using scanning electron microscopy, energy-dispersive spectroscopy, and 3-D profilometry. The scratch test results showed that failure modes were related to the thickness of the films. The 130 nm-thick DLC film underwent cohesive failure modes (cracks and chipping) before reaching to a gross failure stage. On the other hand, the thicker DLC film ($1.2{\mu}m-thick$) did not exhibit micro cracks before a sudden gross failure of the film together with the evidence of cracking and chipping of the Si substrate.

• KSII Transactions on Internet and Information Systems (TIIS)
• /
• 제10권9호
• /
• pp.4023-4043
• /
• 2016

Network virtualization has been regarded as a core attribute of the Future Internet. In a network virtualization environment (NVE), multiple heterogeneous virtual networks can coexist on a shared substrate network. Thus, a substrate network failure may affect multiple virtual networks. In this case, it is increasingly critical to provide survivability for the virtual networks against the substrate network failures. Previous research focused on mechanisms that ensure the resilience of the virtual network. However, the resource efficiency is still important to make the mapping scheme practical. In this paper, we study the survivable virtual network embedding mechanisms against substrate link and node failure from the perspective of improving the resource efficiency. For substrate link survivability, we propose a load-balancing and re-configuration strategy to improve the acceptance ratio and bandwidth utilization ratio. For substrate node survivability, we develop a minimum cost heuristic based on a divided network model and a backup resource cost model, which can both satisfy the location constraints of virtual node and increase the sharing degree of the backup resources. Simulations are conducted to evaluate the performance of the solutions. The proposed load balancing and re-configuration strategy for substrate link survivability outperforms other approaches in terms of acceptance ratio and bandwidth utilization ratio. And the proposed minimum cost heuristic for substrate node survivability gets a good performance in term of acceptance ratio.

• 한국해양환경ㆍ에너지학회지
• /
• 제1권2호
• /
• pp.82-95
• /
• 1998

이 논문에서는 LS/DYNA3D를 이용하여 다음과 같은 2가지 수치 시뮬레이션을 수행한다: 첫 번째 시뮬레이션은 310,000 DWT 이중선체 VLCC (피충돌선)과 35,000 및 105,000 DWT의 2척의 유조선(충돌선)들과의 충돌에 관한 경우로서, 충돌선들은 VLCC의 중심선에 직각으로 중앙부에 충돌하는 것으로 가정한다. 두 번째는 40,000 DWT급의 재래식과 개량식 이중선체 유조선의 선저구조의 2가지 모델, CONV/PD328과 ADH/PD328에 대한 좌초에 관한 시뮬레이션이다. 이 연구의 전체적인 목적은 이중선체 유조선의 선측 및 선저구조에 충돌 및 좌초가 각각 발생하는 동안에 이중선체의 내판이 찢어지기 시작하고 운동에너지가 소산되면서 선체가 정지되는 등의 구조적인 파손 및 흡수에너지의 역학적인 거동을 이해하는 것이다. 이러한 수치 시뮬레이션을 통하여 충돌 및 좌초시의 손상 정도를 쉽게 추정할 수 있을 것이고 유조선의 설계 시 안전도의 개선에 이바지할 수 있게 할 것이다.

• 수산해양기술연구
• /
• 제39권2호
• /
• pp.158-163
• /
• 2003

Thermosetting matrix composites have disadvantages in terms of moulding time, repairability and manufacturing cost. Thus the high-performance thermoplastic composites to eliminate such disadvantages have been developed so far. As a result of environmental and economical concerns, there is a growing interest in the use of thermoplastic composites. However, since their mechanical properties are very sensitive to the environment such as moisture, temperature etc., those behaviors need to be studied. Particularly the temperature is a very important factor influencing the mechanical behavior of thermoplastic composites. The effect of temperature have not yet been fully quantified. Since engineering applications of reinforced composites necessitate their fracture mechanic characterization, work is in progress to investigate the fracture and related failure behavior. An approach which predicts the tensile strength was perpormed in the tensile test. The main goal of this work is to study the effect of temperature on the result of tensile test with respect to GF/PE composite. The tensile strength and failure mechanisms of GF/PE composites were investigated in the temperature range 6$0^{\circ}C$ to -5$0^{\circ}C$. The tensile strength increased as the fiber volume fraction ratio increased. The tensile strength showed the maximum at -5$0^{\circ}C$, and it tended to decrease as the temperature increased from -5$0^{\circ}C$. The major failure mechanism was classified into the fiber matrix debonding, the fiber pull-out, the delamination and the matrix deformation.

• 한국재료학회지
• /
• 제22권10호
• /
• pp.545-551
• /
• 2012

In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

• 동의생리병리학회지
• /
• 제29권1호
• /
• pp.1-10
• /
• 2015

This article is a study on palpitation of which disease cause, disease mechanism and formulas were analyzed with reference to annotations on "Shanghanlun" and "Jinkuiyaolue". And the scope of modern diseases related with palpitation was drawn by research on clinical papers. The source books are "Zhujieshanghanlun" and "Jinkuiyaoluefanglun" and the clinical papers are searched in China Academic Journals(CAJ) of China National Knowledge Infrastructure(CNKI). 13 clauses in "Shanghanlun" and 9 clauses in "Jinkuiyaolue" and 12 formulas are related with palpitation. Disease mechanisms of palpitation were classified as yang deficiency, yin deficiency, qi deficiency, blood deficiency, retained fluid, cold, etc and these days, qi stagnation, phlegm turbidity, blood stasis and fire heat are also considered as disease mechanisms. Modern diseases related with palpitation are arrhythmia(extrasystole, atrial fibrillation, bradycardia, tachycardia, sick sinus syndrome, atrioventricular block), vascular diseases(arterial occlusion, phlebothrombosis, Buerger's disease, coronary artery disease, vasculitis), blood pressure disorder(hypertension, hypotension) and heart diseases such as heart failure, angina pectoris, myocardial infarction, myocarditis, cardiomyopathy, pericardial effusion. And diseases related with psychological change(cardiac neurosis, anxiety neurosis, neurosis, depression, hyperthyroidism, hypothyroidism), pyrexia, anemia, drug intoxication, etc are also related with palpitation. Zhen Wu Tang showing an efficacy in dilating blood vessels and strengthening cardiac function, Wuling Powder with diuretic effect and Fried Glycyrrhizae Decoction acting on the ${\beta}$ receptor are applied to heart failure in different ways. Fried Glycyrrhizae Decoction(308 cases), Zhen Wu Tang(154), Wuling Powder(54), Xiao Chaihu Tang(34), Sini San(20) are reported to have been clinically applied to cardiovascular diseases and Zhen Wu Tang and Wuling Powder mainly applied to heart failure, Fried Glycyrrhizae Decoction, Lizhong Wan, Sini San and Zhen Wu Tang chiefly applied to arrhythmia related diseases. This study focuses on the general research and consideration on clinical applications and is a preliminary study to understand relations between Korean Medicine's symptoms and categories of modern diseases.