• IE interfaces
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• v.12 no.3
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• pp.437-447
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• 1999

Modeling and system development for the fabrication process in the semiconductor manufacturing is presented in this paper. Maximization of wafer production can be achieved by the wafer flow balance under high utilization of bottleneck machines. Relatively simpler model is developed for the fabrication line by considering main characteristics of logistics. Simulation system is developed to evaluate the line performance such as balance rate, utilization, WIP amount and wafer production. Scheduling rules and input rules are suggested, and tested on the simulation system. We have shown that there exists good combination of scheduling and input rules.

• Proceedings of the Korean Nuclear Society Conference
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• 1996.05c
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• pp.441-446
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• 1996

A preliminary conceptual design of the DUPIC fuel fabrication plant with production capacity of 400 MTHE/yr is presented. Capital and operating costs are also included. The levelized unit fabrication cost (LUC) for a reference mode was estimated at $509/kgHE, and sensitivity of some variable parameters to this reference was analysed.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2001.02a
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• pp.114-116
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• 2001

This paper deals with the design and fabrication of loop superconducting Persistent Current Switch(PCS) circuit. The self and mutual inductances of the circuits are calculated and compared to the measured values. The size of loop circuits was determined using the calculated inductances, and the fabrication processes of the superconducting persistent current switch are described.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.656-659
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• 2003

Although Hereafter a mass production will claim for patterning nano sized thickness or line in micro-nano industry. existent lithography fabrication has many usable fields, it has complex fabrication steps, expensive values and row work rates. Development of Dip-pen type nano plotter using polymer actuator can construct row cost mass production system because it will change existent lithography fabrication more simple and easy.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.6
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• pp.992-997
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• 1987

This paper describes the design and fabrication of an integrated circuit that can separate the horizontal SYNC., vertical SYNC. and composite SYNC. signal included in a composite video signal. The circuit that is based on the comparator level samplign method can separate a stable SYNC. signal even from an external circuit with large variation. It has been fabrivated by the SST bipolar process. Its chip size is 1.5x1.5mm\ulcorner As a result, we succeeded in fabrication of IC which satisfied DC characteristics and SYNC. singal separator function.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.6
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• pp.840-845
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• 1986

In this Part II of the paper, we evaluated the fabrication error and dividing characteristics for the opticalfilters proposed in the Part I. Furthermore, we propose an integrated optical filter with a new function that can eliminate the fabdrication error. The fabrication method and filtering characteristics have been tested by experiments, thereby confirming the validity of the design theory.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.10a
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• pp.103-105
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• 2003

The high speed of RSFQ circuits is based on the self-resetting in the overdamped Josephson junctions. The SIS technology using Nb/A1$_2$O$_3$/Nb trilayer has been successfully adopted as a standard technology. However the newly suggested SINIS technology attracts interest because the junction itself is overdamped without any external shunt, and provides possibility of simplification of RSFQ circuit design and fabrication. In this paper we demonstrate RSFQ circuit fabrication process using SINIS technology.

• Journal of the Optical Society of Korea
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• v.8 no.1
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• pp.21-28
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• 2004

When femtosecond laser pulses are focused inside the bulk of transparent materials, the intensity in the focal volume becomes high enough to produce permanent structural modifications. This technique has been applied to fabricate three-dimensional photonic structures such as optical memory, waveguides, gratings, and couplers inside a wide variety of transparent materials. In this paper, we review the fabrication of optical elements in glasses with femtosecond laser pulses, including the fabrication of waveguides, couplers, Bragg gratings, zone plates, holographic memory, and micro holes.

• Polymer Science and Technology
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• v.17 no.3
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• pp.338-347
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• 2006

• Journal of Mechanical Science and Technology
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• v.20 no.4
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• pp.554-560
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• 2006

This paper describes the demonstration of successful fabrication and initial characterization of micromachined pressure sensors and micromachined jets (microjets) fabricated for use in macro flow control and other applications. In this work, the microfabrication technology was investigated to create a micromachined fluidic control system with a goal of application in practical fluids problems, such as UAV (Unmanned Aerial Vehicle)-scale aerodynamic control. Approaches of this work include: (1) the development of suitable micromachined synthetic jets (microjets) as actuators, which obviate the need to physically extend micromachined structures into an external flow; and (2) a non-silicon alternative micromachining fabrication technology based on metallic substrates and lamination (in addition to traditional MEMS technologies) which will allow the realization of larger scale, more robust structures and larger array active areas for fluidic systems. As an initial study, an array of MEMS pressure sensors and an array of MEMS modulators for orifice-based control of microjets have been fabricated, and characterized. Both pressure sensors and modulators have been built using stainless steel as a substrate and a combination of lamination and traditional micromachining processes as fabrication technologies.