• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권12호
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• pp.773-776
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• 1999

A newly proposed lateral dual-gate thyristor was fabricated and measured, which has excellent current saturation characteristics of $1200A/cm^2$ even at an anode-gate voltage of 29V, through the elimination of the structurally existing parasitic thyristor. And through the comparison with the LIGBT, the excellent current saturation characteristics of a newly proposed device was verified.

• JSTS:Journal of Semiconductor Technology and Science
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• 제6권1호
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• pp.10-15
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• 2006

Various sizes of erbium/platinum silicided n/p-type Schottky barrier metal-oxide-semiconductor field effect transistors (SB-MOSFETs) are manufactured from $20{\mu}m$ to 10nm. The manufactured SB-MOSFETs show excellent DIBL and subthreshold swing characteristics due to the existence of Schottky barrier between source and channel. It is found that the minimization of trap density between silicide and silicon interface and the reduction of the underlap resistance are the key factors for the improvement of short channel characteristics. The manufactured 10 nm n-type SBMOSFET showed $550{\mu}A/um$ saturation current at $V_{GS}-V_T$ = $V_{DS}$ = 2V condition ($T_{ox}$ = 5nm) with excellent short channel characteristics, which is the highest current level compared with reported data.

• 대한의용생체공학회:의공학회지
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• 제38권5호
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• pp.256-263
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• 2017

By using the buildup characteristics of the radiophotoluminescence glass dosimeter(RPLGD), it is aimed to help the measurement of the accurate dose by measuring the radiation dose according to the time of the glass element. Five glass elements were arranged on the table and the source to image receptor distance(SID) was set to 100 cm for the build-up radiation dose measurement of the fluorescent glass dosimeter glass element(GD-352M). Radiation doses and saturation rates were measured over time according to irradiation time, with the tube voltage (30, 60, 90 kVp) and tube current (50, 100 mAs) Repeatability test was repeated ten times to measure the coefficient of variation. The radiation dose increased from 0.182 mGy to 12.902 mGy and the saturation rate increased from 58.3% with increasing exposure condition and time. The coefficient of variation of the glass elements of the fluorescent glass dosimeter was ranged from 0.2 to 0.77 according to the X - ray exposure conditions. X - ray exposure showed that the radiation dose and saturation rate were increased with buildup characteristics, and degeneration of glass elements was not observed. The reproducibility of the variation coefficient of the radiation generator was included within the error range and the reproducibility of the radiation dose was excellent.

• 대한전자공학회논문지SD
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• 제40권1호
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• pp.1-10
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• 2003

본 연구에서는 Metal-Ferroelecric-Semiconductor FET (MFSFET) 소자의 특성을 시뮬레이션 하였다. 시뮬레이션에서는 field-dependent polarization 모델과 square-law FET 모델이 도입되었다. MFSFET 시뮬레이전에서 C-V/sub G/ 곡선은 축적과 공핍 및 반전 영역을 확실하게 나타내었다. 게이트 전압에 따른 캐패시턴스, subthreshold 전류 그리고, 드레인 전류특성에서 강유전체 항전압이 0.5, 1V 일 때, 각각 1, 2V 의 memory window 를 나타내었다. 드레인 전류-드레인 전압 곡선은 증가영역과 포화영역으로 구성되었다. 드레인 전류-드레인 전압 곡선에서 두 부분의 문턱전압에 의해 나타난 포화드레인 전류차이는 게이트 전압이 0, 0.1, 0.2 그리고, 0.3V 일 때, 각각 1.5, 2.7, 4.0 그리고 5.7㎃ 이었다. 시간경과 후의 드레인 전류를 분석하였는데, PLZT(10/30/70) 박막은 10년 후에 약 18%의 포화 전류가 감소하여 우수한 신뢰성을 보였다. 본 모델은 MFSFET 소자의 동작을 예측하는데 중요한 역할을 할 것으로 판단된다.

• 한국군사과학기술학회지
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• 제12권4호
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• pp.483-490
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• 2009

In this paper, a novel low-damage silicon nitride passivation for 100nm InAlAs/InGaAs MHEMTs has been developed using remote ICPCVD. The silicon nitride deposited by ICPCVD showed higher quality, higher density, and lower hydrogen concentration than those of silicon nitride deposited by PECVD. In particular, we successfully minimized the plasma damage by separating the silicon nitride deposition region remotely from ICP generation region, typically with distance of 34cm. The silicon nitride passivation with remote ICPCVD has been successfully demonstrated on GaAs MHEMTs with minimized damage. The passivated devices showed considerable improvement in DC characteristics and also exhibited excellent RF characteristics($f_T$of 200GHz).The devices with remote ICPCVD passivation of 50nm silicon nitride exhibited 22% improvement(535mS/mm to 654mS/mm) of a maximum extrinsic transconductance($g_{m.max}$) and 20% improvement(551mA/mm to 662mA/mm) of a maximum saturation drain current ($I_{DS.max}$) compared to those of unpassivated ones, respectively. The results achieved in this work demonstrate that remote ICPCVD is a suitable candidate for the next-generation MHEMT passivation technique.

• 한국전기전자재료학회논문지
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• 제21권9호
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• pp.835-843
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• 2008

We have fabricated the source-drain electrodes for OTFTs by screen printing method and manufactured Ag pastes as conductive paste. To obtain excellent conductivity and screen-printability of Ag pastes, the dispersion characteristics of Ag pastes prepared from two types of acryl resins with different molecular structures and Ag powder treated with caprylic acid, triethanol amine and dodecane thiol as surfactant respectively were investigated. The Ag pastes containing Ag powder treated with dodecane thiol having thiol as anchor group or AA4123 with carboxyl group(COOH) of hydrophilic group as binder resin exhibited excellent dispersity. But, Ag pastes(CA-41, TA-41, DT-41) prepared from AA4123 fabricated the insulating layer since the strong interaction between surface of Ag powder and carboxyl group(COOH) of AA4123 interfered with the formation of conduction path among Ag powders. The viscosity behavior of Ag pastes exhibited shear-thinning flow in the high shear rate range and the pastes with bad dispersion characteristic demonstrated higher shear-thinning index than those with good dispersity due to the weak flocculated network structure. The output curve of OTFT device with a channel length of 107 ${\mu}m$ using screen-printed S-D electrodes from DT-30 showed good saturation behavior and no significant contact resistance. And this device exhibited a saturation mobility of $4.0{\times}10^{-3}$ $cm^2/Vs$, on/off current ratio of about $10^5$ and a threshold voltage of about 0.7 V.

• 한국정보통신학회논문지
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• 제11권3호
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• pp.570-576
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• 2007

본 연구에서는 field-dependent polarization 모델과 square-law FET 모델을 이용하여 Metal- ferroelectic-semiconductor FET (MFSFET) 소자의 특성을 연구하였다. 게이트 전압에 따른 드레인 전류특성에서 강유전체 박막의 항전압이 0.5 와 1 V 일 때, 각각 1와 2 V의 메모리 창 (memory window) 을 나타내었다. 드레인 전류-드레인 전압곡선에서 두 부분의 문턱전압에 의해 나타난 포화 드레인 전류차이는 게이트 전압이 0, 0.1, 0.2, 0.3 V 일 때, 각각 1.5, 2.7, 4.0, 5.7 mA로 명확한 차이를 나타내었다. PLZT(10/30/70), PLT(10), PZT(30/70) 박막의 이력곡선 시뮬레이션과 리텐션 특성의 fitting 결과를 바탕으로 시간경과 후의 드레인 전류를 분석한 결과, PLZT(10/30/70) 박막이 10년 후에도 약 18%의 포화 전류가 감소하는 가장 우수한 신뢰성을 나타내었다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.176-176
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• 2003

The effects of oxide thickness and gate length of MgO/GaN metal oxide semiconductor field effect transistors (MOSFETs) on I-V, threshold voltage and breakdown voltage characteristics were examined using a drift-diffusion model. The saturation drain current scales in an inverse logarithmic fashion with MgO thickness and is < 10$^{-3}$ A.${\mu}{\textrm}{m}$$^{-1}$ for 0.5 ${\mu}{\textrm}{m}$ gate length devices with oxide thickness > 600 $\AA$ or for all 1 ${\mu}{\textrm}{m}$ gate length MOSFETs with oxide thickness in the range of >200 $\AA$. Gate breakdown voltage is > 100 V for gate length >0.5 ${\mu}{\textrm}{m}$ and MgO thickness > 600 $\AA$. The threshold voltage scales linearly with oxide thickness and is < 2 V for oxide thickness < 800 $\AA$ and gate lengths < 0.6 ${\mu}{\textrm}{m}$. The GaN MOSFET shows excellent potential for elevated temperature, high speed applications.

• ETRI Journal
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• 제27권6호
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• pp.685-690
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• 2005

DC and RF characteristics of $0.15{\mu}m$ GaAs power metamorphic high electron mobility transistors (MHEMT) have been investigated. The $0.15{\mu}m{\times}100{\mu}m$ MHEMT device shows a drain saturation current of 480 mA/mm, an extrinsic transconductance of 830 mS/mm, and a threshold voltage of -0.65 V. Uniformities of the threshold voltage and the maximum extrinsic transconductance across a 4-inch wafer were 8.3% and 5.1%, respectively. The obtained cut-off frequency and maximum frequency of oscillation are 141 GHz and 243 GHz, respectively. The $8{\times}50{\mu}m$ MHEMT device shows 33.2% power-added efficiency, an 18.1 dB power gain, and a 28.2 mW output power. A very low minimum noise figure of 0.79 dB and an associated gain of 10.56 dB at 26 GHz are obtained for the power MHEMT with an indium content of 53% in the InGaAs channel. This excellent noise characteristic is attributed to the drastic reduction of gate resistance by the T-shaped gate with a wide head and improved device performance. This power MHEMT technology can be used toward 77 GHz band applications.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.623-624
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• 2006

In this paper, we introduce the design and fabrication of V-band power amplifier MMIC with excellent gain-flatness for IEEE 802.15.3c WPAN system. The V-band power amplifier was designed using ETRI' $0.12{\mu}m$ PHEMT process. The PHEMT shows a peak transconductance ($G_{m,peak}$) of 500 mS/mm, a threshold voltage of -1.2 V, and a drain saturation current of 49 mA for 2 fingers and $100{\mu}m$ total gate width (2f100) at $V_{ds}$=2 V. The RF characteristics of the PHEMT show a cutoff frequency, $f_T$, of 97 GHz, and a maximum oscillation frequency, $f_{max}$, of 166 GHz. The gains of the each stages of the amplifier were modified to have broadband characteristics of input/output matching for first and fourth stages and get more gains of edge regions of operating frequency range for second and third stages in order to make the gain-flatness of the amplifier excellently for wide band. The performances of the fabricated 60 GHz power amplifier MMIC are operating frequency of $56.25{\sim}62.25\;GHz$, bandwidth of 6 GHz, small signal gain ($S_{21}$) of $16.5{\sim}17.2\;dB$, gain flatness of 0.7 dB, an input reflection coefficient ($S_{11}$) of $-16{\sim}-9\;dB$, output reflection coefficient ($S_{22}$) of $-16{\sim}-4\;dB$ and output power ($P_{out}$) of 13 dBm. The chip size of the amplifier MMIC was $3.7{\times}1.4mm^2$.