• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제48권5호
• /
• pp.396-401
• /
• 1999

In this study, $Ar^+$ ion laser etching process of single/poly-crystalline Si with $CCl_2F_2$ gas is investigated for MEMS applications. In general, laser direct etching process is useful in microelectronic process, fabrication of micro sensors and actuators, rapid prototyping, and complementary processing because of the advantages of 3D micromachining, local etching/deposition process, and maskless process with high resolution. In this study, a pyrolytic method, in which $CCl_2F_2$ gasetches molten Si by the focused laser, was used. In order to analyze the temperature profile of Si by the focused laser, the 3D heat conduction equation was analytically solved. In order to investigate the process parameters dependence of etching characteristics, laser power, $CCl_2F_2$ gas pressure, and scanning speed were varied and the experimental results were observed by SEM. The aspect ratio was measured in multiple scanning and the simple 3D structure was fabricated. In addition, the etching characteristics of $6\mum$ thick poly-crystalline Si on the insulator was investigated to obtain flat bottom and vertical side wall for MEMS applications.

• 한국결정성장학회지
• /
• 제24권4호
• /
• pp.135-139
• /
• 2014

수소화기상증착에피탁시로 성장된 GaN 단결정의 표면 특성을 정밀하게 측정하기 위해, 용융 KOH/NaOH 습식화학에칭법을 적용하였다. KOH/NaOH 습식화학에칭법에 에칭속도는 기존의 황산, 인산과 같은 etchant에 비해 느린데, 이는 불용성 코팅층의 형성에 의한 것이다. 따라서 이 방법으로 etch pits density를 더 효율적으로 평가할 수 있었다. 성장된 GaN 단결정을 XRD(X-Ray Diffraction), XRC(X-ray rocking curve)로 결정성을 분석하였으며, 에칭 특성과 표면 형상은 주자전자현미경을 이용하여 관찰하였다. 에칭 실험 결과 격자결함들이 독립적으로 잘 분리되어 있고 그들의 형태가 명확하게 나타나는 최적 에칭 조건은 $410^{\circ}C$, 25분이었다. 이 조건에서 얻은 결함밀도 값은 $2.45{\times}10^6cm^{-2}$이었으며, 이는 상업적으로 이용 가능 한 정도의 재료임을 확인할 수 있었다.

• E2M - 전기 전자와 첨단 소재
• /
• 제10권5호
• /
• pp.481-486
• /
• 1997

This paper describes the anisotropic etching characteristics of Si in acqueous TMAH/IPA solutions. The etch rates of (100) oriented Si crystal planes decrease with increasing TMAH concentration and IPA concentration. Etchant concentration and etch temperature have a large effect on hillock density. Hillock density strongly increase with lower TMAH concentration and higher etch temperature. The etched (100) planes are covered by pyramidal-shaped hillocks below TMAH 15 wt.%, but very smooth surface is obtained TMAH 25 wt.%. The addition of IPA to TMAH solution leads to smoother surfaces of sidewalls etched planes. Undercutting ratio of pure TMAH solution is much higher than KOH. But, addition of IPA to TMAh the underrcutting ratio reduces by a factor of 3∼4. Therefore, acqueous TMAH/IPA solution is able to use as anisotropic etchant of Si because of full compability with IC fabrication process.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1996년도 하계학술대회 논문집 C
• /
• pp.1980-1981
• /
• 1996

Laser direct dry etching is a new technique in semiconductor processing which has a lot of advantage, including decrease of etching-induced damage, maskless, photoresistiess, and high selectivity. This study presents characteristics of a laser direct dry etching for $Al_{0.3}Ga_{0.7}As/GaAs$ multi-layer structures for the first time. In this study, we were able to obtain the unusual aching profiles. The cross sectional analysis of etched groove was peformed for reaction characteristics and their applications.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
• /
• pp.860-863
• /
• 2002

In this study, Ag thin films deposited on LCD-grade glass were etched using inductively coupled fluorine-based plasmas and the effect of various $CF_4$-based gas mixtures on the Ag etching characteristics were studied. When $CF_4$-based gas mixtures were used with $N_2$, due to the very low vapor pressure of etch products, etch products remained on the substrate after the etching. However, when $CF_4$ used with Ar, residue-free Ag etching could be obtained due to the removal of etch product by sputtering by $Ar^+$ ions.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제53권2호
• /
• pp.62-66
• /
• 2004

This paper investigated the characteristics of a newly developed high density hollow cathode plasma (HCP) system and its application for the etching of silicon wafers. We used SF$_{6}$ and $O_2$ gases in the HCP dry etch process. Silicon etch rate of $0.5\mu\textrm{m}$/min was achieved with $SF_6$$O_2$plasma conditions having a total gas pressure of 50mTorr, and RF power of 100 W. This paper presents surface etching characteristics on a crystalline silicon wafer and large area cast type multicrystlline silicon wafer. The results of this experiment can be used for various display systems such as thin film growth and etching for TFT-LCDs, emitter tip formations for FEDs, and bright plasma discharge for PDP applications.s.

• 한국자기학회지
• /
• 제5권5호
• /
• pp.538-542
• /
• 1995

The etching characteristics of magnetic thin films of permalloy and Fe-based alloys are investigated. The thin films are fabricated by rf magnetron sputtering and the substrates used are silicon and glass. Etching is done by ion beam technique and the main process parameters investigated are beam voltage, beam current and accelerating voltage. The etch rate of the magnetic films is proportional to the beam current, but it is not directly related to the accelerating voltage and beam voltage. The dependence of etch rate on the process parameters can be explained by ion current density. It is found that the ion beam etching is effective in obtaining well-developed micro-patterns on the permalloy and Fe- based magnetic thin films.

• 한국염색가공학회지
• /
• 제8권2호
• /
• pp.56-63
• /
• 1996

Low-temperature plasma treatment or sputter etching is of interest as one of the techniques to modify polymer surface. In this study, poly(ethylene terephthalate)(PET), nylon 6 and cotton fabrics dyed three black dyes were subjected to low-temperature argon plasma and also sputter etching. In relation to bathochromic effect, the surface characteristics of the treated fabrics and films were investigated by means of critical surface tension, SEM and ESCA measurement. The depth of shade of fabrics more increased by the sputter etching technique than argon plasma treatment. Many microcraters on the fiber surface formed by the sputter etching resulted in increase of surface area of the fiber and wettability, but the hydrophobic group was increased by the results of ESCA analysis. In particular the change in reflective index of the fibers was much more effective than the chemical composition of the fiber surface on increasing of the depth of shade.

• 대한전기학회논문지
• /
• 제36권9호
• /
• pp.636-639
• /
• 1987

In this study, we investigate the etching characteristics of a-Se75 Ge25 thin films. Etching properties are revealed as a function of obliqueness, temperature and concentraction of the etching solution. As the increase of obliqueness, selective etching effect increase rapidly by 35% at 80 obliqueness, and the etching rate increase the elevated temperature of the solution. The change of etching rate with obliqueness are related closely to the optical change due to the band gap illumination. We obtained clear pattern of 1.5um linewidth.

• 대한전자공학회논문지
• /
• 제26권11호
• /
• pp.1686-1690
• /
• 1989

Using the anisotropic etching characteristics of N2H4-H2O solutions, Si diaphragm was fabricated for the integrated sensors. The optimal composition and temperature of the etching solution in (100) Si etching process was established to be 50mol% N2H4 in H2O at 105\ulcorner\ulcorner for both higher etch rate (=2.6\ulcorner/min) and better surface quality of etched (100) planes. Based on the above optimal etching condition, the electrochemical etch-stop technique was employed to form n-type Si diaphragm having a thickness of 20\ulcorner and the thickness of diapragm could exactly be controlled to 20\ulcorner\ulcorner.