• Advances in aircraft and spacecraft science
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• v.4 no.6
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.

• Journal of Conservation Science
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• v.31 no.1
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• pp.37-46
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• 2015

In the case of adhesives & restoration agents currently being used for the preservation treatment of ceramics and earthenware, epoxy type, cellulose type and cellulose type are mainly being used. However, they are showing various problems such as re-detachment from severe contraction, color change from yellowing, work inconvenience of staining on tools and hand during usage and irreversibility. For the purpose of solving the issues of yellowing and irreversibility of epoxy resin being used to restore ceramics, urethane synthetic resin with low yellowing excellent reversibility has been developed in this study. The adhesive strength of urethane resin that has been developed has excellent properties with 2.07MPa for undiluted solution, which is 1.5 times higher than that of existing material EPO-$TEK301^{(R)}$ 1.21MPa. The result of workability measurement showed that the wear rate of urethane resin (in Talc 50wt%) was 1.09%, which was somewhat higher than that of existing material Quick $Wood^{(R)}$ (1.02%). In addition, its wear rate is two times higher than that of $EPO-TEK301^{(R)}$ (0.41%) and $L30^{(R)}$ (0.39%), thereby showing an advantage in its forming process compared to existing materials. As for the advantage of urethane resin of reversibility experiment, 12 hours after acetone, ethyl alcohol deposition, urethane resin and filler talc were dissolved 100% while showing powdering phenomenon. Compared to 0% reversibility of existing epoxy resin, it has much superior reversibility. The result of UV rays experiment to evaluate its durability showed that ${\Delta}E^*ab$ color change value based on undiluted solution of urethane resin was 2.76 before & after UV rays exposure, which was a decrease by about 7-20 times compared to that of existing resin, thereby minimizing the issue of heterogeneity.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.41-46
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• 2010

The interfacial adhesion strengths between screen-printed Ag film and epoxy resin-coated polyimide were evaluated by $180^{\circ}$ peel test method. Measured peel strength value was initially around $164.0{\pm}24.4J/m^2$, while the heat treatment during 24h at $120^{\circ}C$ increase peel strength up to $220.8{\pm}19.2J/m^2$. $85^{\circ}C/85%$ RH temperature/humidity treatment decrease peel strength to $84.1{\pm}50.8J/m^2$, which seems to be attributed to hydrolysis bonding reaction mechanism between metal and adhesive epoxy resin coating layer.

• Korean Journal of Materials Research
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• v.21 no.5
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• Journal of Conservation Science
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• v.30 no.1
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• pp.103-109
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• 2014

This study aimed to develop materials to compensate for problems of restoration for lost parts and material problems in the conservation treatment. First, there are several problems with existing materials as follows: secondary damage due to the high shrinkage rate and low adhesive strength, sense of difference due to the severe yellowing, remelting due to irreversibility of materials, processability due to the high strength, sag due to the prolonged setting time in the work process and surface contamination of artifacts due to tools or gloves. In order to solve these problems, this study set developmental goals after understanding the types and physical properties based on epoxy resin among the currently used restoration materials of pottery and earthenware. The developed epoxy resin is epoxy putty, which is cured within 5 minutes, for earthenware restoration. In the earthenware restoration method, the epoxy putty enhanced the workability by quickly curing in paste form and compensated disadvantages such as surface contamination. In addition, the use of white micro-balloon for the epoxy stock solution made coloring easier and weight lighter, and a restoration material with low shrinkage and superior processability was developed.

• Proceedings of the Korea Concrete Institute Conference
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• 2006.05b
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• pp.349-352
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• 2006

Pull-off test is generally used as a method of evaluating bond strength of FRP with concrete at the job site. However, pull-off test damages FRP composites and the maximum pull-off strength is limited up to tensile strength of concrete. Accordingly, it is required to set-up a test method that can simply evaluate bond performance of structural adhesive. This study suggested compression and bending test of epoxy resin as test methods that can indirectly evaluate performance of adhesive, as well as standardized test specification for different types of specifications from various countries. In this study, the section dimension of compression and bending test specimens is unified, and standard test specimen size is achieved by test results.

• Proceedings of the Korea Concrete Institute Conference
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• 2006.05b
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• pp.353-356
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• 2006

Hardening of 2 component adhesive such as epoxy resin used in saturating FRP composite is triggered by mixing each component part within a batch. Chemical reactions occur explosively after a certain time after mixing the batch, viscosity and temperature rapidly increase. As a results, bond performance remarkably decreases and workability declines due to increase in viscosity. Therefore, adhesion should be completed before chemical hardening reaction is rapidly going on. This study examined pot life of structural adhesive for FRP composites by means of change in apparent viscosity and means of exothermic reaction temperature proposing in existing test standards. Result of each test method was compared and analyzed, and reasonable test method and evaluation method are suggested.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.38-43
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• 2001

The interfacial adhesive joining characteristics of the foams are very important for the structural integrity of sandwich structures. Peel strength is one of the best criteria for the interfacial characteristics of the sandwich structures and peel energy is most commonly used for the interfacial characteristics. The peel strength is the first peak force per unit width of bond line required to produce progressive separation by the wedge or other crack opening type action of two adherends where one or both undergo significant bending and the peel energy is the surface active energy per unit width of bond line. In this work, to investigate the strengthening effect of resin treatment on the interfacial surface of foam material, peel strength and peel energy of epoxy resin treated polyurethane foam core sandwich structures were obtained by the cleavage peel tests and compared with those of non surface treated polyurethane foam core sandwich structures.

• Journal of Radiation Industry
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• v.4 no.1
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• pp.19-23
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• 2010

Vinyl ester (VE) resins, introduced in the late 1960s, have made large strides in reinforced plastics applications as adhesive and matrix materials on their appropriate mechanical performance characteristics in the glassy state. Generally, VE resins are a group of dimethacrylate resins based on bisphenol A type epoxy resin. They exhibit easy handling properties as well as good resistance to most chemical agents due to their mechanical and thermal properties. In this study, the effects of curing methods of vinyl ester resins on gel contents, flexural strength and dynamic mechanical properties were investigated. Thermal curing (room temperature, $80^{\circ}C$) and electron beam curing were used to crosslink a VE resin/styrene complex (65/35 wt%) with methyl ethyl ketone peroxide (MEKPO) as a catalyst and an 8 wt% cobalt naphthenate in styrene solution as a accelerator. For the samples, gel contents as well as flexural strength and dynamic mechanical properties were characterized and compared by soxhlet apparatus, universal testing machine (UTM) and dynamic mechanical analysis (DMA). As a result, the electron-cured VE resin was confirmed as a better condition than those for gel contents, flexural strength and dynamic mechanical properties, respectively.