• Korean Journal of Materials Research
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• v.15 no.1
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• pp.1-5
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• 2005

Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.6-13
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• 2005

Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2139-2157
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• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of Adhesion and Interface
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• v.14 no.3
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• pp.135-145
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• 2013

Epoxy resin compositions were studied on the view of self-extinguishing properties without retardant additives and suitability as materials of eco-friendly EMC (Epoxy molding compound). Cured epoxy and phenolic resin composition having conjugated double bond of aromatic structure exhibited self-extinguishing properties and low heat release capacity. In this study, the structure of long conjugated double bond of hetero-atom type azomethyne group between conjugated double bonds of aromatic structure showed lower heat release capacity. Low heat release capacity seemed to be related with high reaction enthalpy, $T_g$ and reactivity affected by hetero-atom structure in azomethyne group.

• Journal of the Korea Organic Resources Recycling Association
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• v.31 no.1
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• pp.5-14
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• 2023

In this study, LiDAR-reflective black hollow-structured silica/titania(B-HST) materials are successfully synthesized by employing the NaBH₄ reduction and etching method on silica/titania core/shell(STCS) materials, which also effectively enhance near-infrared(NIR) reflectance. Moreover, core-etched supernatant solutions are collected and recycled for the synthesis of extracted silica(e-SiO₂) process, which successfully applies as filler materials for semiconductor epoxy molding compound(EMC). In detail, B-HST materials, fabricated by the sequential experimental steps of sol-gel, reduction, and sonication-mediated etching method, manifest blackness(L^*) of 13.2 similar to black paint and excellent NIR reflectance(31.1%). Consequently, B-HST materials are successfully prepared as LiDAR-reflective black materials. Additionally, core-etched supernatant solution with silanol precursors are employed for synthesis of homogeneous silica filler materials via sol-gel method. As-synthesized silica fillers are incorporated with epoxy resin and carbon black for the preparation of semiconductor EMC. Experimentally synthesized EMC exhibits comparable mechanical-chemical properties to commercial EMC. Conclusively, this study successfully proposes designing procedure and practical experimental method for simultaneously synthesizing the NIR-reflective black materials for self-driving vehicles and EMC materials for semiconductors, which are materials suitable for the industrial 4.0 era, and presented their applicability in future industries.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Proceedings of the Korea Inteligent Information System Society Conference
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• 2001.01a
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• pp.224-229
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• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.72-72
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• 2003

전기 및 전자산업의 발달과 더불어 규석 관련 제품에 대하여 고기능성 초미립 분말이 요구되고 있으며, 한편으로는 취급과 활용성이 우수한 형상인 구형 분말을 요구하고 있다. 본 연구에서는 평균 입도 1.0$\mu\textrm{m}$이하의 규석 초미립 분말 제조기술 개발과 유기용매 및 계면활성제 등을 첨가하여 형상이 구형인 기능성 분말과 항균, 항곰팡이 효과가 우수한 교질 상태의 실리카를 제조하여 기능성 재료 및 코팅용 실란 등에 활용이 가능하도록 물리적 단순공정을 통하여 평균 입도 1.0$\mu\textrm{m}$이하의 초미립 규석분말을 제조함으로써 고무, 타이어, 토너, 도료, EMC(epoxy molding compound) 등의 충전제, 이형제, 연마재 등으로 활용이 가능하게 하였으며 제조된 규석 초미립 분말은 분산성이 양호하도록 spray dryer 방법으로 건조하여 각 제품에 알맞은 적용이 용이하도록 하였다.