Browse > Article
http://dx.doi.org/10.17702/jai.2013.14.3.135

Study on the Thermal Properties of Epoxy Resin Compositions having Conjugated Double Bond in Backbone  

Lee, KyoungEun (Reliability Assessment Center, Korea Research Institute of Chemical Technology)
Yoo, Min Jae (Reliability Assessment Center, Korea Research Institute of Chemical Technology)
Kim, Young Chul (Research Center for Green Fine Chemicals, Korea Research Institute of Chemical Technology)
Publication Information
Journal of Adhesion and Interface / v.14, no.3, 2013 , pp. 135-145 More about this Journal
Abstract
Epoxy resin compositions were studied on the view of self-extinguishing properties without retardant additives and suitability as materials of eco-friendly EMC (Epoxy molding compound). Cured epoxy and phenolic resin composition having conjugated double bond of aromatic structure exhibited self-extinguishing properties and low heat release capacity. In this study, the structure of long conjugated double bond of hetero-atom type azomethyne group between conjugated double bonds of aromatic structure showed lower heat release capacity. Low heat release capacity seemed to be related with high reaction enthalpy, $T_g$ and reactivity affected by hetero-atom structure in azomethyne group.
Keywords
flame retardancy; heat release capacity; epoxy resin; conjugated double bond; azomethine;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Y. Kiuchi, M. Iji, H. Nagashima, and T. Miwa, J. Appl. Polym. Sci., 101, 3367 (2006).   DOI   ScienceOn
2 M. Zammarano, M. Franceschi, S. Bellayer, J. W. Ilman, and S. Meriani, Polymer, 46, 9314 (2005).   DOI   ScienceOn
3 M. Iji and Y. Kiuchi, J. Mater. Sci.-Mater. Electron., 15, 175 (2004).
4 Y. Kiuchi, M. Iji, H. Suzuki, and H. Osuga, Kobunshi Ronbunshu, 54, 117 (2005).
5 Y. Kiuchi and M. Iji, Kobunshi Ronbunshu, 64, 191 (2007).   DOI
6 김경만, 김영철, 김종생, 정영호, 김도훈, 김미숙, KR 출원 2010-117701 (2010).
7 김봉섭, KR 등록 10-0557530 (2006).
8 이은정, 박윤곡, 한승, 이영균, KR 등록 10-0715-102 (2007).
9 岩崎 憤一, JP 특개 2003-176335 (2003).
10 木內幸浩, 位地 正年. JP 특개 2003-226727 (2003).
11 生田 優司, 木內幸浩. JP 특개 2003-277628 (2003).
12 木內幸浩, 位地 正年. JP 특개 2007-146177 (2007).
13 김영철, 차옥자, 김경만, 접착 및 계면, 11, 168 (2010).
14 최수정, 김영철, 접착 및 계면, 12, 138 (2011).
15 植原 隆治, 押見 克彦, 川井 宏一, 稲垣 真也, 須永 高男. JP 특개 2010-163540 (2010).
16 飛田 雅之, 木村 亨, 石垣 司, 下山 直之, 青木 恒, 越智 光一, 原田 美由紀. JP 특개 2004-331811 (2004).
17 X. H. Zhang, L. H. Huang, S. Chen, and G. R. Qi. eXPRESS Polym. Lett., 1, 326 (2007).   DOI
18 류이열, 최호경, KR 등록 10-1260346 (2013).
19 W. Mormann and M. Brocher, Polymer, 39, 4905 (1998).   DOI   ScienceOn
20 W. F. A. Su, K. C. Chen, and S. Y. Tseng, J. Appl. Polym. Sci., 78, 446 (2000).   DOI
21 W.-F. Su, H.-W. Huang, and W.-P. Pan, Thermochim. Acta, 392, 391 (2002).
22 R. N. Walters and R. E. Lyon, J. Appl. Polym. Sci., 87, 548 (2003).   DOI   ScienceOn
23 D. W. Van Krevelen, Polymer, 16, 615 (1975).   DOI   ScienceOn
24 www.concept-e.co.uk (2013. 9. 13).
25 越智光一, 岩越眞佐夫, 新保正樹, 日本接着協會誌, 10, 266 (1974).
26 越智光一, 佐佐木勝美, 新保正樹, 日本接着協會誌, 13, 410 (1977).
27 S. C. Misra, J. A. Manson, and L. H. Sperling, Epoxy Resin Chemistry, R. S. Bauer. 114, pp. 157, American Chemical Society, Washington D.C. (1979).