Browse > Article
http://dx.doi.org/10.3740/MRSK.2005.15.1.001

Comparative Study on the Failure of Polymer/Roughened Metal Interfaces under Mode-I Loading I: Experimental Result  

Lee Ho-Young (School of Mechanical and Aerospace Engineering, Seoul National University)
Kim Sung-Ryong (Department of Polymer Science and Engineering, Chungju National University)
Publication Information
Korean Journal of Materials Research / v.15, no.1, 2005 , pp. 1-5 More about this Journal
Abstract
Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.
Keywords
leadframe; brown oxide; black oxide; epoxy; failure path;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Z. Suo and J. W. Hutchinson, Mater. Sci. Eng. A107, 135 (1989)   DOI   ScienceOn
2 H. Y. Lee, Trans. Electric. Electron. Mater., 1(3), 23 (2000)
3 H. Y. Lee and S. R. Kim, J. Korean Inst. Surf. Eng., 33(4), 241 (2000)
4 H. Y. Lee and S. R. Kim, J. Microelectron. Packag. Sci., 7(2), 7 (2000)
5 C. Kembell, Adhesion, D. D. Eley, Oxford University Press, London, 19 (1961)
6 B. J. Love and P. F. Packham, J. Adhesion, 40, 139 (1993)   DOI   ScienceOn
7 H. K. Yun, K. Cho, J. H. An and C. E. Park, J. Mater. Sci., 27, 5811 (1992)   DOI
8 H. Y. Lee and J. Yu, Korean J. Mater. Res., 9(10), 992 (1999)
9 H. Lee and Y. Y. Earmme, IEEE CPMT, 19(2), 168 (1996)   DOI
10 S. Omi, K. Fujita, T. Tsuda and T. Maeda, IEEE CHMT, 14(4), 818 (1991)
11 H. Y. Lee, Mater. Eng. A, 311(1-2), 217 (2001)   DOI   ScienceOn
12 A. A. Gallo and R. Munamarty, IEEE Trans. Reliab., 44(3), 362 (1995)   DOI   ScienceOn