• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.44-51
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• 2020

The basic catalyst 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was synthesized and analyzed by FT-IR and ¹H-NMR. A crystalized biphenyl-based epoxy was synthesized by using tetramethyl biphenol (TMBP) and epichlorohdrine. In order to consider the curing tendency of the synthesized BMH, the mass ratio was changed to 0.5, 1.0, 2.0 wt.% under heated conditions and the curing tendency was analyzed by differential scanning calorimeter (DSC). As a result, the BMH catalyst showed a fast curing result in the stepwise heating pr℃ess of the biphenol-A epoxy and the cationic polymer. From these results, the BMH catalyst showed excellent thermal stability as a potential heat curing catalyst. In addition, we considered the application possibility of epoxy molding compound (EMC) which required a skeleton structure and a high heat resistance because the synthesized biphenyl epoxy had a characteristic of rapidly lowering viscosity at a constant temperature and a rigid skeleton structure of biphenol. As a result, it was confirmed that the TMBP-based epoxy developed in this study was composed of a crystalline structure, and a curing reaction was observed with a Novolac resin at a high temperature. In the presence of a catalyst, a curing reaction was observed around 150 ℃ and thus TMBP-based epoxy was successfully applied as a raw material of EMC.

• Elastomers and Composites
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• v.57 no.2
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Elastomers and Composites
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• v.50 no.3
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• pp.167-174
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• 2015

Anionic epoxy compound was synthesized and added to asphalt aiming to prepare self-healing asphalt. Epoxy-modified asphalt showed excellent modification effect and healing effect as well. The results revealed that with 5% addition of polymer the tensile strength, impact strength and complex shear modulus of the polymer-modified asphalt increased by 65%. 64% and 35%, respectively. It seems that high interaction occurs between polymer and asphalt matrix. Self-healing efficiency of the polymer-modified asphalt based on tensile strength showed 100%, comparing to 79% of straight asphalt. In impact experiment the polymer-modified asphalt showed 99% of healing efficiency, comparing to 77% of straight asphalt. In rheological experiment the polymer-modified asphalt showed 103% of healing efficiency, comparing to 72% of straight asphalt. It appears that the ionic bonding existing in epoxy polymers contributed to high values of self-healing efficiency. The polymer which has high intermolecular force fills the crack of the asphalt, pulling the opponent side each other, and so the original properties were restored.

• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.

• Elastomers and Composites
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• v.35 no.2
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• pp.89-97
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• 2000

Waterborne epoxy resins have been developed in order to meet environmental regulations for reduction of the emission of organic solvents from coating industry As each generation has filled a performance gap in the previous technology, new waterborne epoxy resin has developed. Initially, waterborne epoxy resins were used primarily on masonry, but the subsequent generations have found utility for the protection of metallic substrates as well. Indeed, the third generation systems have been formulated to produce the high performance industrial maintenance primers which possess the desirable combination of good corrosion resistance and low volatile organic compound levels. This paper outlines the important guidelines for formulating waterborne epoxy primers from waterborne epoxy resin that has recently developed in our company. The importance of using the appropriate resin-curing agent system at the optimized epoxy to amine ratio is stressed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.10a
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2000.11a
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• pp.57-60
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

• Bulletin of the Korean Chemical Society
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• v.23 no.4
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• pp.587-592
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• 2002

Photocrosslinkable chalcone-epoxy compound comprising 1,3-bis-(4-hydroxy-phenyl)-propenone was synthe-sized for fabricating the photo-alignment layer of liquid crystals. Chalcone group was introduced into the main chain unit of the epoxy oligomer. We observed a photodimerization behavior and an optical anisotropy of this material by irradiation of a linearly polarized UV(LP-UV) light. With a trace amount of cationic photoinitiator (TRS-HFA), polymerization of epoxy groups was also conducted at the similar wavelength range used for photodimerization. Linearly polarized UV irradiation on the chalcone-epoxy films with cationic photoinitiator induced optical anisotropy of the film and the resultant film can be used for alignment layers for low molecular weight nematic liquid crystals.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.57-60
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.