• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.41-48
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• 2010

본 연구에서는 일액형 이방 도전성 페이스트(anisotropic conductive paste, ACP) 혼합 조성의 상온 보관성을 향상시키기 위해 2-methyl imidazole 경화 촉매제를 5종의 각기 다른 물질로써 encapsulation하였다. Encapsulation용 분말 물질들은 DSC를 통해 그 융점을 관찰하였으며, 이를 통해 encapsulation용 분말 물질들을 액상으로 용융시켜 encapsulation하는 공정이 가능함을 확인할 수 있었다. Encapsulation된 2-methyl imidazole 분말을 포함한 ACP 혼합물질의 상온 보관성을 평가하기 위하여 시간에 따른 점도 변화가 관찰되었다. 그 결과, stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질에서 향상된 상온 보관성을 관찰할 수 있었으며, 이러한 formulation은 기본 혼합물질과도 유사한 경화 거동을 보임을 확인할 수 있었다. 최종적으로 stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질을 사용하여 RFID 칩을 제조된 안테나 패턴이 형성된 PET 기판에 고속 플립칩 본딩을 실시하였다. 이 경우 측정된 접합 강도는 기본 혼합물질에 비해 약 37%의 수준인 것으로 측정되었다.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2021년도 가을 학술논문 발표대회
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• pp.131-132
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• 2021

According to the domestic specification, the curing of the specimen for strength management used to determine the time of the mold deformity of the structure concrete in early spring and early autumn is cured in the field structure condition. However, when the seal curing is performed in the field, the temperature of the specimen is very low compared to the temperature of the actual structure, so the strength of the structure concrete predicted based on the strength of the specimen is much undervalued than the actual one, which causes the mold to be deformed. Therefore, this study analyzed the temperature history and compressive strength characteristics of the specimen for strength management through other sealing curing at 5℃ and concrete of the actual structure, and presented the most suitable curing method.

• 접착 및 계면
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• 제7권4호
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• pp.39-44
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• 2006

A new kind of silicone-epoxy composite is reported in this research. The silicone-epoxy resin was synthesized by the hydrosilylation of tetramethycyclotetrasiloxane and 4-vinyl-1-cyclohexene 1,2-epoxy with a high reaction yield. It was found that the obtained silicone-epoxy resin shows a high reactive activity to the aluminum complex-silanol catalyst. The resin could be cured under the catalysis of $(Al(acac)_3/Ph_2Si(OH)_2$ at a concentration below 0.1 wt% to give a hard cured resin showing excellent optical clarity, UV resistance and thermal stability. It was also found that the Si-H groups facilitated the curing reaction and the silicone-epoxy resin bearing Si-H group could be cured effectively even if $Ph_2Si(OH)_2h$ was absent. Moreover, the UV resistance and thermal stability were improved significantly by the introduction of Si-H groups. This is possibly due to the reductive property of Si-H groups which can annihilate radical and peroxide effectively. This kind of silicone-containing epoxy composite might have very promising applications as optical resin, optical adhesive and encapsulation materials for electronic devices.

• Composites Research
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• 제34권1호
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• pp.47-50
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• 2021

본 논문은 차량에 사용되는 B필러의 강화재를 기존의 스틸 소재에서 CFRP(Carbon Fiber Reinforced Plastics)와 GFRP(Glass Fiber Reinforced Plastics)로 대체하여 경량화하는 것이 목표다. 이를 위해서는 무게는 감소시키면서 기존 B필러를 대체할 수 있는 구조안정성을 확보해야 한다. 기존 B필러는 스틸 아우터(outer)를 포함하여 다양한 형상의 스틸 강화재로 구성되며, 이와 같은 스틸 강화재 중 2가지의 스틸 강화재를 복합재로 대체하고자 한다. 이와 같은 스틸 강화재는 강화재 각각을 따로 제작하여 용접을 통해 결합되지만, 복합재 강화재는 패치(patch) 형태의 CFRP와 리브(rib) 구조의 GFRP를 활용하여 압축과 사출 공정을 통해 한번에 제작된다. CFRP는 B필러의 고강도부에 부착되어 측면 하중에 저항하도록 하였으며, GFRP 리브는 위상 최적화(Topology optimization) 기법을 통해 비틀림과 측면 하중을 저항하도록 설계하였다. 구조해석을 통해 기존 스틸 강화재와 비교 분석을 수행하였고, 경량화율을 산출하였다.

• 조명전기설비학회논문지
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• 제25권2호
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• pp.10-18
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• 2011

In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.844-848
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• 2012

Encapsulant curing in terms of convection oven leads to thermal induced stress due to nonuniform thermal conductivity in LED package. We have adopted infrared (IR) light for silicone curing in order to release the stress. The light uniformity irradiated on an encapsulant surface is confirmed to be uniform by optical simulation. Shear strength of die paste using IR compared to convection oven is increased 19.2% at the same curing time, which indicates curing time can be shortened. The indentation depth difference between center and edge of silicone encapsulant in terms of convection oven and IR are 14.8% and 3.4%, respectively. Curing by IR also shows 2.3% better radiant flux persistency rate of LED at $85^{\circ}C$ after 1,000 h reliability test compared to convection curing.

• 한국전기전자재료학회논문지
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• 제29권12호
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• pp.819-823
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• 2016

DSSC (dye-sensitized solar cell) is expected to be one of the next-generation photovoltaics because of its environment-friendly and low-cost properties. However, commercialization of DSSC is difficult because of the electrolyte leakage. We propose thermal curable base on silicon resin and apply a unit cell and large area ($200{\times}200mm$) dye-sensitized solar cell. The resin aimed at sealing of DSSC and gives a promising resolution for sealing of practical DSSC. In result, the photoelectric conversion efficiency of the unit cell and the module was 6.63% and 5.49%, respectively. In the durability test result, the photoelectric conversion efficiency of the module during 500, 1,000, 1,500 and 2,000 hours was 0.73%, 0.73%, 1.82% and 2.36% respectively. It was confirmed that the photoelectric conversion efficiency characteristics are constant. We have developed encapsulation material of thermal curing method excellent in chemical resistance. A sealing material was applied to the dye-sensitized solar cell and it solved the problem of durability the dye-sensitized solar cell. Sealing material may be applied to verify the possibility of practical application of the dye-sensitized solar cell.

• Environmental Engineering Research
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• 제21권1호
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• pp.15-21
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• 2016

Magnesium potassium phosphate cement (MKPC) is an effective agent for solidification/stabilization (S/S) technology. To further explore the mechanism of the S/S by MKPC, two kinds of Cd including $Cd(NO_3)_2$ solution (L-Cd) and municipal solid waste incineration fly ash (MSWI FA) adsorbed Cd (S-Cd), were used to compare the effects of the form of heavy metal on S/S. The results showed that all the MKPC pastes had a high unconfined compressive strength (UCS) above 11 MPa. For L-Cd pastes, Cd leaching concentration increased with the increase of Cd content, and decreased with the increase of curing time. With the percentage of MSWI FA below 20%, S-Cd pastes exhibited similar Cd leaching concentrations as those of L-Cd pastes, while when the content of MSWI FA come up to 30%, the Cd leaching concentration increased significantly. To meet the standard GB5085.3-2007, the highest addition of S-Cd was 30% MSWI FA (6% Cd contained), with the Cd leaching concentration of 0.817 mg/L. The S/S of L-Cd is mainly due to chemical fixation, and the hydration compound of Cd was $NaCdPO_4$, while the S/S of S-Cd is due to physical encapsulation, which is dependent on the pore/crack size and porosity of the MKPC pastes.