• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.390-393
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• 2008

To improve the blue responses of screen-printed single crystalline silicon solar cells, we investigated an emitter etch-back technique to obtain high emitter sheet resistances, where the defective dead layer on the emitter surface was etched and became thinner as the etch-back time increased, resulting in the monotonous increase of short circuit current and open circuit voltage. We found that an optimal etch-back time should be determined to achieve the maximal performance enhancement because of fill factor decrease due to a series resistance increment mainly affected by contact and lateral resistance in this case. To elucidate the reason for the fill factor decrease, we studied the resistance analysis by potential mapping to determine the contact and the lateral series resistance. As a result, we found that the fill factor decrease was attributed to the relatively fast increase of contact resistance due to the dead layer thinning down with the lowest contact resistivity when the emitter was contacted with screen-printed silver electrode.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.5
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• pp.179-183
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• 2008

Employing screen printing technology, aluminum is applied to the back side of the n-type silicon wafer to see the effect of the heat treatment parameters on the Voc of the solar cell, Heat treatment at $850^{\circ}C$ produces the highest Voc among various heat treatment conditions. Heat treatment at the temperatures higher than $850^{\circ}C$ results in lower Voc, which is due to the destruction of the Al-Si alloy emitter layer. The destruction of Al-Si layer observed to be caused by the vigorous movement of silicon atoms toward aluminum layer during the heat treatment.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1312_1313
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• 2009

In this study the fabrication technique of the planner field emission device structure with a DLC layer were studied. The bottom Mo electrode using electrochemical method on the DLC layer deposited using assist sputtering.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.219-220
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• 2000

We propose a new method for the formation of an aluminum parting layer in the fabrication of field emitter arrays, in which we used a reflow property of aluminum at a lower temperature than the deformation point of glass. After the sputtered aluminum layer on the gate metal was etched for the formation of gate holes, we carried out a rapid thermal annealing process, by which the aluminum slightly diffused into the gate hole. This reflowed aluminum could be used as a parting layer and emitter arrays were easily fabricated using this method.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.21-24
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• 2003

The understanding of the mechanism of device degradation has been accomplished recently, for devices using $AlQ_3$ electron transport and emitter molecule. In this presentation the experimental evidence for the degradation mechanism of $AlQ_3$ based devices will be reviewed, showing that the hypothesis of an unstable $AlQ_3^+$ cation explains a large amount of experimental data. This hypothesis, however, explains not only the room temperature device degradation in time but also sheds light on temperature stability of OLEDs. Dependence of half-life of a series of devices with an emitter layer composed of a mixture of $AlQ_3$ and different hole transport molecules (mixed emitter layer) will be discussed when they are operated at elevated temperatures. These results can also be explained in the framework of an unstable $AlQ_3^+$ species. An OLED structure containing a doped mixed emitter layer will be described, which shows extraordinary stability, half-life of 1200 hours at operating temperature of 70 C and initial luminance of 1650 $cd/m^2$. We will also discuss a novel Black $Cathode^{TM}$ OLED with reduced optical reflectivity, which is also stable at elevated temperatures. The new cathode utilizes a conductive light-absorbing layer made of a mixture of metals and organic materials.

• Journal of Electrical Engineering and Technology
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• v.3 no.1
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• pp.121-124
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• 2008

This paper presents the fabrication and field emission of carbon nanotube field emitters for a micro mass spectrometer. The carbon nanotube is an adequate material as a field emitter since it has good characteristics. We have successfully fabricated a diode field emitter and a triode field emitter. Each field emitter has been constructed using several micromachining processes and a thermal CVD process. In the case of the diode field emitter, to increase the electric field, the carbon nanotubes are selectively grown on the patterned nickel catalyst layer. The electron current of the diode field emitter is 73.2 ${\mu}A$ when the anode voltage is 1100V. That of the triode field emitter is 3.4 pA when the anode voltage is 1000V.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.2
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• pp.66-72
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• 1995

Using the Si/SiGe layer grown by solid source molecular beam epitaxy(SSMBE) on the LOCOS-patterned wafers, an emitter-base self-aligned hterojunction biplar transistor(HBT) with the polysilicon-emitter and the silicon germanium(SiGe) base has been fabricated. Trech isolation process, planarization process using a chemical-mechanical poliching, and the selectively implanted collector(SIC) process were performed. A titanium disilicide (TiSi$_{2}$), as a base electrode, was used to reduce an extrinsic base resistance. To prevent the strain relaxation of the SiGe epitaxial layer, low temperature (820${^\circ}C$) annealing process was applied for the emitter-base junction formation and the dopant activation in the arsenic-implanted polysilicon. For the self-aligned Si/SiGe HBT of 0.9${\times}3.8{\mu}m^{2}$ emitter size, a cut-off requency (f$_{T}$) of 17GHz, a maximum oscillation frequency (f$_{max}$) of 10GHz, a current gian (h$_{FE}$) of 140, and an emitter-collector breakdown voltage (BV$_{CEO}$) of 3.2V have been typically achieved.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.600-600
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• 2012

실리콘 이종접합 태양전지는 diffused dopant를 이용하여 high conductivity의 emitter를 가지는 기존의 crystalline silicon 태양전지와는 다르게 a-Si:H를 이용한 low conductivity emitter 때문에 TCO를 front electrode 및 anti-reflection layer로 사용한다. 하지만 TCO와 emitter사이의 work function mismatch에 의한 band-offset이 발생하고 photo-generation된 carrier의 injection을 막아 효율 상승을 제한하게 된다. 본 연구는 산소 반응성 스퍼터링을 통한 front TCO의 일함수 변경과 이에 따른 TCO와 emitter 계면에 존재하는 band-offset 변화에 대하여 분석하였다. 특히 산소 분압에 따른 front TCO의 일함수 변화에 따라 개방전압 및 단락전류 변화가 두드러지게 나타났으며, 직렬저항 성분 변화에 따른 충진률 변화에 따른 효율상승을 얻을 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.393-393
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• 2011

오늘 날 태양전지 산업에서 가장 많은 생산을 하고 있는 분야는 결정질 태양전지분야이다. 현재는 이러한 시대적 요구에 따라 많은 연구가 진행되고 있는데 특히 junction을 이루는 n layer의 doping profile을 선택적으로 형성하여 개방전압 및 단락전류를 향상시키는 연구가 활발히 진행되고 있다. 본 연구는 이러한 n type layer의 doping profile을 선택적으로 형성하는 selective emitter solar cell에 관한 연구로써 SILVACO simulation을 이용하여 low Rs 영역은 고정하고 high Rs 영역의 doping depth를 가변 함으로써 high Rs 영역을 달리 형성하는 방법으로 selective emitter solar cell의 high Rs영역의 최적화에 관한 전산모사를 실시하였다. 각각의 가변조건에 따라 quantum efficiency를 통한 광학적 분석과 I-V를 통한 전기적 분석을 하여 high Rs영역을 최적화 하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.212-216
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• 2004

In this paper, we have fabricated a triode field emitter using carbon nanotubes (CNTs) directly grown by thermal chemical vapor deposition(CVD) method as an electron omission source. Vertically aligned CNTs have been grown in the center of the gate hole, to the size of 1.5 ${\mu}{\textrm}{m}$ in diameter, with help of a sacrificial layer of a type generally used in metal tip process. By the method of tilling the substrate, we made CNTs emitters both with and without SiO$_2$layer, a sidewall protector, deposited on sidewall of gate. After that we researched the electrical characteristics about two types of emitters. In effect, a sidewall protector can enhance the electrical characteristics by suppressing the problem of short circuits between the gate and the CNTs. The leakage current of an emitter with a sidewall protector is approximately sevenfold lower than that of an emitter without it at a gate voltage of 100 V.