• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.655-656
• /
• 2005

In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2005년도 춘계학술대회 논문집
• /
• pp.43-46
• /
• 2005

Micro molding technology is a promising mass production technology for polymer based microstructures. Mass production technologies such as the micro injection/compression molding, hot embossing, and micro reaction molding are already in use. In the present study, we have developed a numerical analysis system to simulate three-dimensional non-isothermal cavity filling for hot embossing, with a special emphasis on the free surface capturing. Precise free surface capturing has been successfully accomplished with the level set method, which is solved by means of the Runge-Kutta discontinuous Galerkin (RKDG) method. The RKDG method turns out to be excellent from the viewpoint of both numerical stability and accuracy of volume conservation. The Stokes equations are solved by the stabilized finite element method using the equal order tri-linear interpolation function. To prevent possible numerical oscillation in temperature Held we employ the streamline upwind Petrov-Galerkin (SUPG) method. With the developed code we investigated the detailed change of free surface shape in time during the mold filling. In the filling simulation of a simple rectangular cavity with repeating protruded parts, we find out that filling patterns are significantly influenced by the geometric characteristics such as the thickness of base plate and the aspect ratio and pitch of repeating microstructures. The numerical analysis system enables us to understand the basic flow and material deformation taking place during the cavity filling stage in microstructure fabrications.

• 한국정밀공학회지
• /
• 제23권8호
• /
• pp.178-184
• /
• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• 한국재료학회지
• /
• 제15권3호
• /
• pp.149-154
• /
• 2005

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

• Journal of Pharmaceutical Investigation
• /
• 제41권3호
• /
• pp.147-151
• /
• 2011

This paper demonstrates the development of a method for preparing micropatterned microdiscs in order to increase contact area with cells and to change the release pattern of drugs. The microdiscs were manufactured with hot embossing, where a polyurethane master structure was pressed onto both solid and porous microparticles made of polylactic-co-glycolic acid at various temperatures to form a micropattern on the microdiscs. Flat microdiscs were formed by hot embossing of porous microparticles; the porosity allowed space for flattening of the microdiscs. Three types of micro-grooves were patterned onto the flat microdiscs using prepared micropatterned molds: (1) 10 ${\mu}M$ deep, 5 ${\mu}M$ wide, and spaced 2 ${\mu}M$ apart; (2) 10 ${\mu}M$ deep, 9 ${\mu}M$ wide, and spaced 5 ${\mu}M$ apart; and (3) 10 ${\mu}M$ deep, 50 ${\mu}M$ wide, and spaced 50 ${\mu}M$ apart. This novel microdisc preparation method using hot embossing to create micropatterns on flattened porous microparticles provides the opportunity for low-cost, rapid manufacture of microdiscs that can be used to control cell adhesion and drug delivery rates.

• 한국정밀공학회지
• /
• 제24권1호
• /
• pp.64-70
• /
• 2007

A long-exposing technique (LET) has been conducted to create nanoscale patterns applicable to diverse micro-devices using two-photon polymerization (TPP). By the weakly-polymerized region via the LET, double-layered embossing patterns can be fabricated simply in a single step. The LET makes possible a voxel and its surrounding to be fully grown into more than 500 nm in lateral size and weakly-polymerized region (WPR), respectively. In the WPR. interconnecting ribs between voxels are generated, and they lead to the creation of double-layered dot patterns. Moreover, by controlling the distance between voxels, various shapes of interconnecting rib can be fabricated when the LET is applied. Various embossing patterns were fabricated to evaluate the usefulness of the proposed technique as a novel nanopatterning technique in TPP.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2004년도 추계학술대회 논문집
• /
• pp.1452-1455
• /
• 2004

Sandwich structures, which are composed of a thick core between two thin faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. Depending on the application of a particular sandwich structure, various types of cores can be used. The production of sandwich sheets by a rolling process, which is a more efficient and economical approach compared to other types of processes, has become an increasingly important subject of study. In this paper, we have studied the embossing structure of sheet type and developed embossing roll mold with $\Phi$3 pattern and roll forming system.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 춘계학술대회
• /
• pp.945-949
• /
• 2003

LIGA(Lithographie Galvanoformung Abformung), a fabrication method for the production of microstructrues with a high aspect ratio, is now playing an important role in a fabrication of polymeric optical waveguide device as the replication processes have been developed such as hot embossing and injection molding. The present report deals with the fabrication of Ni master used for the replication of multi-mode polymeric optical waveguide. With the basic technological features in the sequence of the LIGA technique, we fabricated Ni master with 12 channel microstructures of $100\;{\times}\;100{\mu}m\;^2{\times}\;60mm$, and achieved an accuracy of ${\pm}1\;{\mu}m$. Manufactured polymeric optical wavegude with the same using hot embossing process has also the same accuracy and approved its mass production capability.

• 한국정밀공학회지
• /
• 제23권4호
• /
• pp.162-167
• /
• 2006

Hot embossing lithography(HEL) has the production advantage of comparatively few process step, simple operation, a relatively low cost for embossing tools(Si), and high replication accuracy for small features. In this paper, we considered the nano-molding characteristic according to molding parameters(temperature, pressure, times, etc) and induced a optimal molding condition using HEL. High precision nano-patter master with various shapes were designed and manufactured using the DRIE(Deep Reactive ion Etching), LPCVD(Low Pressure Chemical Vapor Deposition) and thermal oxidation process, and we investigated the molding characteristic of DVD and Blu-ray nickel stamp. We induced flow behaviors of polymer, rheology by shapes and sizes of the pattern through various molding experiments. Finally, with achieving nano-structure molding with high aspect ratio, we will secure a basic technology about the molding of large-area nano-pattern media.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2003년도 학술.기술논문 발표회
• /
• pp.37-40
• /
• 2003

This present paper mainly contains adhesion part disconnection type exposure composition waterproof method using embossing PVC sheet. The existing polymer resin coating and sheet waterproofing construction method have, however, some weak point such as being decrease life cycle of concrete with water leaking from materials be affected by crack and movement dash bond concrete through the whole-adhere construction. Above the reason, this paper has particular method increasing crack-defending performance from stress occurred concrete movement by part disconnection, adds maintain waterproofing performance subordinate sheet, that can be contributed a convenience of maintenance which is decreasing industrial waste and repair construction cycle through the part repair in case of leaking water.