• Title/Summary/Keyword: element removal

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Comparative Study on Element Removal Methods for ESO (진화적 구조 최적화를 위한 요소 제거법의 비교 연구)

  • 한석영
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.9 no.5
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    • pp.112-118
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    • 2000
  • In case ESO(evolutionary structural optimization) which is one of topology optimization methods, the element removal ratio is fixed throughout topology optimization by 1 or 2%. As a result it has no flexibility for various types of structures and thus the rate of convergence might not be efficient. Thus various element removal methods were developed in order to improve the efficiency of ESO. In this paper, various element removal methods for ESO are compared with each other for a bracket and a short cantilever. In addition, a new improved bi-directional element removal method is suggested in order to obtain much better optimized topology. From the comparative results of the examples, it is verified that all of the developed various element removal methods are very effective, and the suggested element removal method is the most effective.

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Effective Element Removal Methods for Topology Optimization (위상 최적화를 위한 효율적인 요소 제거법)

  • 한석영
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.46-51
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    • 2000
  • In case of ESO(evolutionary structural optimization) which is one of topology optimization methods, the element removal ratio is fixed throughout topology optimization by 1 or 2 %. As a result it has no flexibility for various types of structures and thus the rate of convergence might not be efficient. Thus various element removal methods are developed in order to improve the efficiency of ESO. In this paper, various element removal methods for ESO are compared with each other. Each element removal method is explained, and applied to a bracket and a Michell type of beam. In addition, a new bi-directional element removal method is suggested in order to obtain much better optimized topology. From the results of stress, displacement and the rate of convergence for the examples under the same mass constraints, it is verified that the suggested element removal method is the most effective. .

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An Improved Element Removal Method for Evolutionary Structural Optimization

  • Han, Seog-Young
    • Journal of Mechanical Science and Technology
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    • v.14 no.9
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    • pp.913-919
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    • 2000
  • The purpose of this study was to develop a new element removal method for ESO (Evolutionary Structural Optimization), which is one of the topology optimization methods. ESO starts with the maximum allowable design space and the optimal topology emerges by a process of removal of lowly stressed elements. The element removal ratio of ESO is fixed throughout topology optimization at 1 or 2%. BESO (bidirectional ESO) starts with either the least number of elements connecting the loads to the supports, or an initial design domain that fits within the maximum allowable domain, and the optimal topology evolves by adding or subtracting elements. But the convergence rate of BESO is also very slow. In this paper, a new element removal method for ESO was developed for improvement of the convergence rate. Then it was applied to the same problems as those in papers published previously. From the results, it was verified that the convergence rate was significantly improved compared with ESO as well as BESO.

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Finite Element Prediction of Deformation of Material due to Springback after Material Removal of a Forging (단조 후 소재 절삭에 따른 탄성회복 변형의 유한요소예측)

  • Joun, M.S.;Chung, W.J.;Jeong, S.W.
    • Transactions of Materials Processing
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    • v.26 no.4
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    • pp.205-209
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    • 2017
  • In this paper, finite element prediction of deformation of material due to springback after material removal by an axisymmetric forging fabrication at room temperature is conducted. An elastoplastic finite element method is employed considering die plastic deformation. The predictions of a springback analysis conducted after the final stroke of an axisymmetric cold forging process containing residual stresses are utilized to be mapped onto the final material after the material removal. It is assumed that material removal occurs at an instant, i.e., all the material to be removed disappears at once. The predictions are compared with experiments, revealing strong qualitative agreement.

The Change of Biomechanical Milieu after Removal of mstnnnentation in lrunbar Arthrodesis Stiffness of fusion Mass: Finite Element Analysis (척추 유합술 후, 인접 분절의 스트레스에 대한 척추경 나사못에 대한 영향)

  • Kang, Kyoung-Tak;Chun, Heoung-Jae;Son, Ju-Hyun;Kim, Ho-Joong
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.664-667
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    • 2008
  • Since the advent of pedicle screw fixation system, posterior spinal fusion has markedly increased This intemal fixation system has been reported to enhance the fusion rates, thereby becoming very popular procedure in posterior spinal arthrodesis. Although some previous studies have shown the complications of spinal instruments removal, i.e. loss of correction and spinal collapse in scoliosis or long spine fusion patients, there has been no study describing the benefit or complications in lumbar spinal fusion surgery of one or two level. In order to clarify the effect of removal of instruments on mechanical motion profile, we simulated a finite element model of instrumented posterolateral fused lumbar spine model, and investigated the change of mechanical motion profiles after the removal of instrumentation.

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Study on Shape Optimization Using Finite Elements Addition and Removal (요소가감법을 이용한 형상최적설계에 관한 연구)

  • Kim, Young-Jin;Lim, Kyeong-Ho
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.486-491
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    • 2000
  • In this study, finite elements addition and removal method by stress range is applied to optimize shapes in structures, without using classical and numerical optimization methods and search methods. The program based on this algorithm is developed and compared to theoritial results with considerable accuracy. Classical methods need mesh generation for finite element analysis for every iteration, the developed method needs updated mesh data such as coordinates of nodes, elements connectivity, and loads on nodes. And other tools of finite element analysis can be in use as a black box to interface with this program.

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Study on Within-Wafer Non-uniformity Using Finite Element Method (CMP 공정에서의 웨이퍼 연마 불균일성에 대한 유한요소해석 연구)

  • Yang, Woo Yul;Sung, In-Ha
    • Tribology and Lubricants
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    • v.28 no.6
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    • pp.272-277
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    • 2012
  • Finite element analysis was carried out using wafer-scale and particle-scale models to understand the mechanism of the fast removal rate(edge effect) at wafer edges in the chemical-mechanical polishing process. This is the first to report that a particle-scale model can explain the edge effect well in terms of stress distribution and magnitude. The results also revealed that the mechanism could not be fully understood by using the wafer-scale model, which has been used in many previous studies. The wafer-scale model neither gives the stress magnitude that is sufficient to remove material nor indicates the coincidence between the stress distribution and the removal rate along a wafer surface.

Equi-Value Line Program Development for 3-Dimensional Finite Element Models using Personal Computer (개인용 컴퓨터를 이용한 3차원 유한요소 등가곡선 프로그램 개발)

  • Lee, Seok-Soon
    • Journal of the Korean Society for Precision Engineering
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    • v.9 no.1
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    • pp.44-52
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    • 1992
  • A post-processor is developed to be effectively usable in the personal computer. 3-dimensional controur lines are shown on the surface of the finite element model and also on the 3-dimensional cutting plane, using the function linearly interpolated onto the triangular elements which are constructed on the surface or sectional polygons. And these polygons are originated from the finite element model, 3-dimensional model is projected on the plane with hidden line removal by comparision technique[6]. The graphic data file is used to increase the protability of the program. It is easy to use in the other computer system if the graphic routine adopted that computer system is developed. The developed program has wide applications in 3-dimensional finite element analysis.

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Finite element study on the effect of abutment length and material on implant bone interface against dynamic loading

  • Mishra, Manish;Ozawa, Shogo;Masuda, Tatsuhiko;Yoshioka, Fumi;Tanaka, Yoshinobu
    • The Journal of Advanced Prosthodontics
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    • v.3 no.3
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    • pp.140-144
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    • 2011
  • PURPOSE. Finite element study on the effect of abutment length and material on implant bone interface against dynamic loading. MATERIALS AND METHODS. Two dimensional finite element models of cylinderical implant, abutments and bone made by titanium or polyoxymethylene were simulated with the aid of Marc/Mentat software. Each model represented bone, implant and titanium or polyoxymethylene abutment. Model 1: Implant with 3 mm titanium abutment, Model 2: Implant with 2 mm polyoxymethylene resilient material abutment, Model 3: Implant with 3 mm polyoxymethylene resilient material abutment and Model 4: Implant with 4 mm polyoxymethylene resilient material abutment. A vertical load of 11 N was applied with a frequency of 2 cycles/sec. The stress distribution pattern and displacement at the junction of cortical bone and implant was recorded. RESULTS. When Model 2, 3 and 4 are compared with Model 1, they showed narrowing of stress distribution pattern in the cortical bone as the height of the polyoxymethylene resilient material abutment increases. Model 2, 3 and 4 showed slightly less but similar displacement when compared to Model 1. CONCLUSION. Within the limitation of this study, we conclude that introduction of different height resilient material abutment with different heights i.e. 2 mm, 3 mm and 4 mm polyoxymethylene, does not bring about significant change in stress distribution pattern and displacement as compared to 3 mm Ti abutment. Clinically, with the application of resilient material abutment there is no significant change in stress distribution around implant-bone interface.

Analysis of Material Removal Rate Profile and Stress Distribution According to Retainer Pressure (CMP에서 리테이너링의 압력에 따른 연마율 프로파일과 응력 분포 해석)

  • Lee, Hyun-Seop;Lee, Sang-Jik;Jeong, Suk-Hoon;An, Joon-Ho;Jeong, Hea-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.482-483
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    • 2009
  • In chemical mechanical planarization (CMP) process, the uniformity of stress acting on wafer surface is a key factor for uniform material removal of thin film especially in the oxide CMP. In this paper, we analyze the stress on the contact region between wafer and pad with finite-element analysis (FEA). The setting pressure acting on wafer back side was $500g/cm^2$ and the retainer pressure was changed from 300 to $700g/cm^2$. The polishing test is also done with the same conditions. The material removal rate profiles well-matched with stress distribution.

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