• 제목/요약/키워드: electronic parts

검색결과 1,033건 처리시간 0.031초

전자부품의 품질향상을 위한 인라인 자동검사시스템 (In-Line Automated Inspection System for Quality Improvement of Electronic Parts)

  • 정원;정연구
    • 품질경영학회지
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    • 제23권3호
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    • pp.33-44
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    • 1995
  • This paper presents an automated visual inspection system for the electronic parts manufacturing process. In this system, a statistical process control (SPC) method is integrated into the automated inspection method on a real time base. It shows how the collected data can be analyzed with the SPC to provide process information. Also presented are studies of subpixel image processing technology to improve the accuracy of parts measurements, and the cumulative-sum (CUSUM) control chart for fraction defectives. An application of the developed system to connector manufacturing process as a part of computer integrated manufacturing (CIM) is presented.

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FPGA 구현을 통한 자이로의 혼합모드 연구 (A Study on the Mixed Mode of Gyros by FPGA Implementation)

  • 노영환;방효충
    • 제어로봇시스템학회논문지
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    • 제8권1호
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    • pp.54-59
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    • 2002
  • In the three-axis control of satellites by using on-board actuators, gyros are usually used to measure the attitude angles and angular rates. The gyros are operated by electronic parts and mechanical actuators. The digital components of the electronic parts consist of largely FPGA (Field Programmable Gate Array) as one of the methods for VLSI(Very Large Scale Integrated) circuit design, while the mechanical parts provide output signal directly by mechanical actuation of a spinning rotor. In this research, a mixed mode of gyro is implemented in FGA. In addition to the hardware implementation, the simulation study was conducted by using the SABER for the mixed mode simulator. Results for the practical implementation of the satellite ACS (Attitude Control System) interfaced with the data processing are also presented to validate the FPGA implementation.

A Low-Loss On-Chip Transformer Using an Auxiliary Primary Part (APP) for CMOS Power Amplifier Applications

  • Im, Haemin;Park, Changkun
    • 전기전자학회논문지
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    • 제23권2호
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    • pp.403-406
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    • 2019
  • We propose a low-loss on-chip transformer using an auxiliary primary part (APP) for an output matching network for fully integrated CMOS power amplifiers. The APP is designed using a fifth metal layer while the primary and secondary parts are designed using a sixth metal layer with a width smaller than that of the primary and secondary parts of the transformer to minimize the substrate loss and the parasitic capacitance between the primary and secondary parts. By adapting the APP in the on-chip transformer, we obtain an improved maximum available gain value without the need for any additional chip area. The feasibility of the proposed APP structure is successfully verified.

전자 박판 부품의 가공성 평가에 대한 연구 (Estimation of Formability for Sheet Metal Forming of Electronic Parts)

  • Lee, B.C.;Kang, S.Y.;Moon, J.H.
    • 한국정밀공학회지
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    • 제13권5호
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    • pp.104-114
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    • 1996
  • For the improvement of productivity, the reduction of cost and time for manufacturing is mandatory, especially in the field of electromic industry. The study is concerned with a practical means of systematic assistance to formability estimation and selection of reliable design specification for electronic sheet metal parts. The objective of this research work is to develop a simulation system which hops to analyze the target processes with the finite element method and to acquire available design data quickly and exactly. The simulation system developed in the study consists of design verification, selection of optimal combination of parameters, knowledge acquisition and graphical user interface(GUI). Design verification is automatically carried out by using the finite element method. A data base management system and nomograms are utilized for knowledge acquisition. The developed system has been applied to some major sheet metal forming operations such as flanging, embossing, bending and blanking. According to the simulated results, the validation of the target processes has been confirmend. Analysis data, estimation rules of formability and graphical representation of the analysis have been employed for the designer's understanding and evaluation, thus providing a practical means of robust design and evaluation of forma- bility for producing electronic sheet metal parts.

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CAE 와 쾌속조형/쾌속툴링을 이용한 전자제품용 소형 금형의 개발에 관한 연구 (Investigation into the development of deep drawing tools with small size for electronic parts utilizing the CAE and RP/RT technology)

  • 안동규;이상훈;김민수;한길영;김진석;문현수;윤영석
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.334-337
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    • 2005
  • The objective of this research works is to propose a rapid development methodology of small size deep drawing tools for electronic parts utilizing the technology combination of CAE and RP/RT. The technology is applied to the development of deep drawing tools with a drain shape. The final surface of tools is obtained from the evaluation of the formability using the CAE. In order to manufacture the physical prototype of tools fer try-out terming, several fabrication experiments are carried out for three types of rapid tool manufacturing technology. Through the fabrication experiments, the acceptable rapid manufacturing technologies of deep drawing tools with a small size have been proposed.

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변형 VGG 모델의 전처리를 이용한 부품도면 문자 인식 성능 개선 (Performance Improvement of Optical Character Recognition for Parts Book Using Pre-processing of Modified VGG Model)

  • 신희란;이상협;박장식;송종관
    • 한국전자통신학회논문지
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    • 제14권2호
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    • pp.433-438
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    • 2019
  • 본 논문에서는 기계 서비스 부품 도면에서 숫자를 인식하기 위하여 입력 영상에 대한 전처리와 딥러닝 모델을 제안한다. 서비스 부품 도면의 숫자를 인식하는데 있는 지시선과 도형에 의한 오검출 또는 오인식을 개선하기 위하여 수학적 형태학 필터링 전처리를 한다. 숫자 인식을 위하여 VGG-16 모델을 축소 변형한 7 개의 계층을 가지는 VGG 모델을 적용함으로써 인식 성능을 개선한다. 서비스 부품 도면의 숫자 인식 실험 결과, 제안하는 방법이 인식률 95.57%, 정확도는 92.82%로 종래의 방법에 현저히 개선된 결과를 얻었다.

틸팅 차량 설계를 위한 부품관리 체계 구축 연구 (Research for Bill of Material of Train Tilting express development)

  • 송용수;한성호;정유진
    • 시스템엔지니어링워크숍
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    • 통권4호
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    • pp.159-162
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    • 2004
  • In order to care about preserving the environment for future generations, each country has been required to make the laws of the environment. So manufacturers must design, manufacture and sell goods that meet customer's need and must do this while meeting the needs of the environment. In this research we have developed product structure and configuration management system that treats electronic catalogs for recycling of train parts. This research focused on two system. One is JAVA-based electronic catalog that give the information about recycling of train parts. The other is product structure and configuration management system based on electronic catalog and Bill of Materials(B.O.M)

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A Study on Thermal Characteristics for Hand Carried Ultrasound System

  • Kim, Jong-Gu;Cho, Young-Jin;Kwack, Kae-Dal
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제9권2호
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    • pp.149-163
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    • 2009
  • This paper intends to suggest a design to reduce the thermal load of a hand-carried ultrasound (HCU) system, with the aim of increasing the product life. To design ways to reduce the heat load, the surface temperatures of key parts of an HCU system were measured as the 4 system cooling fans, which have a direct relation to the system life, were operated normally. When the derating rate of 80% was applied while the fans of the HCU system were operated abnormally, it was observed that the key image processing parts exceeded the surface temperature (TC) with consideration to derating. Since the part surface temperature did not exceed the derated level when the regulated voltage was derated from 12V to 9V, it is expected to lower the operating voltage of the fans to 9V to increase the fan and HCU system lifetime by 1.8 times.

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반실험적 열소산 방법을 이용한 위성용 전장품 열해석 (A SATELLITE ELECTRONIC EQUIPMENT THERMAL ANALYSIS USING SEMI-EMPERICAL HEAT DISSIPATION METHOD)

  • 김정훈;전형열;양군호
    • 한국전산유체공학회지
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    • 제11권2호
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    • pp.32-39
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    • 2006
  • A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.