• 한국정밀공학회지
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• 제21권8호
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• Advances in nano research
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• 제12권2호
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• pp.151-165
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• 2022

Micro-scale serpentine structure fibers are widely used as flexible sensor in the manufacturing of micro-nano flexible electronic devices because of their outstanding non-linear mechanical properties and organizational flexibility. The use of melt electrowriting (MEW) technology, combined with the axial bending effect of the Taylor cone jet in the process, can achieve the micro-scale serpentine structure fibers. Due to the interference of the process parameters, it is still challenging to achieve the precise deposition of micro-scale and high-consistency serpentine structure fibers. In this paper, the micro-scale serpentine structure fiber is produced by MEW combined with axial bending effect. Based on the controlled deposition of MEW, applied voltage, collector speed, nozzle height and nozzle diameter are adjusted to achieve the precise deposition of micro-scale serpentine structure fibers with different morphologies in a single motion dimension. Finally, the influence mechanism of the above four parameters on the precise deposition of micro-scale serpentine fibers is explored.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• 소음진동
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• 제10권6호
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• pp.971-976
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• 2000

High level random vibration environments induced while launching of spacecraft can damage sensitive electronic equipment, unless the equipment is properly packaged. Thus careful consideration on the launch environment, especially for high level random vibration, is required in the design stage of electronic equipment of spacecraft. This paper describes the development process of Solar Array Regulator for KOMPAT-2, which is designed and tested by Korean engineers. Both analytical and experimental techniques are introduced in this paper.

• 항공우주시스템공학회지
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• 제10권2호
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• 반도체디스플레이기술학회지
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• 제14권4호
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• pp.67-71
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• 2015

Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

• 한국정보통신학회논문지
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• 제22권9호
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• pp.1220-1227
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• 2018

항공전자장비는 항공기에 탑재되는 전자장비를 의미한다. 항공전자장비의 고장은 항공기 운용에 중대한 영향을 미칠 뿐만 아니라 조종사와 승객의 안전까지 위협할 수 있다. 이에 항공전자장비는 타 용도로 사용되는 전자장비들 보다 높은 신뢰성과 안전성을 가지도록 요구도로 규정되어 있다. 항공전자장비는 설계 초기 단계에서부터 안전과 관련된 요구사항 충족을 위해 부품 선정과 시스템 설계를 고려해야 한다. 본 논문에서는 항공전자장비의 안전성, 신뢰성 성능 분석 방법을 설명하고, 안전 요구 성능 충족을 위해 수행할 수 있는 여러 설계 개선 방법을 실제 항공전자장비 개발 사례를 들어 소개한다. 마지막으로 설계 개선된 항공전자장비의 안전 성능 수치를 재분석하고, 개선 전 값과 비교하여 제시한 설계 변경의 유효성을 입증하였다.

• 한국항공우주학회지
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• 제49권2호
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• pp.147-154
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• 2021

본 논문에서는 고정익 항공기 환경제어장치(Environmental Control System) 운용 시 발생될 수 있는 냉각공기의 급격한 온도변화가 항공전자장비에 미치는 영향성을 알아보기 위한 시험장비 구성 및 설계안을 제시한다. ECS 시동 시, 항공기 ECS에서 공급되는 공기의 온도는 초당 5.0℃로 높아질 수 있다. 항공전자장비 개발 시 ECS에서 냉각공기를 제공받는 항공전자장비의 운용성 확보를 위하여, 냉각공기 특성 시험환경을 구현할 수 있는 시험장비가 필요하다. 시험장비 설계 시 열/유동해석을 수행하여 냉각공기의 급격한 온도변화율의 가능성을 확인하였고, 실제 탑재되는 항공전자장비를 적용하여 구현된 시험장비의 성능을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
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• pp.178-181
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• 2001

This paper presents the development of electromagnetic wave detecting equipment for diagnosis of enclosed switchboard. High voltage power equipments are very important equipment of the key industries and the private enterprise. Power line accidents are national plans because of those set off casualties lose of power equipments and communication networks. Therefore the necessity of the development of detecting for power equipment diagnosis is demand for prevention of high voltage equipment accidents. This paper is the development of electromagnetic wave detecting equipment for diagnosis of high voltage equipment. This paper establishes the diagnosis method for high voltage power equipments, that secures original technique and possesses detecting technique for electromagnetic wave. By the study we developed electromagnetic wave detector, and we applied this equipment application tests at the place constructed high voltage equipments.

• 수산해양교육연구
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• 제16권2호
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.